VT-45PP VT-47PP VT-447PP

Transcription

1 & Prepreg General Information Ventec provides a series of and Prepregs with different glass style and resin content. These products have good bonding and thermal performance in applications of heat sink bonding and rigid-flex board, and have a minimal flow range with a consistent lamination. VT-45PP High Tg, &, IPC-4101E /21 /24 /26 A product designed for bonding heat sinks to PCBs, using Ventec s VT-45 resin technology which has been optimized for processing at reduced temperature & pressure to protect previously mounted components on part processed assemblies. VT-47PP Lead Free High Tg, &, IPC-4101E /97 /98 /99 /101 /126 A generation of phenolic cured Low and products using Ventec s VT-47 resin technology with optimized resin rheology designed to enhance bond strength, specifically designed for lead free assembly processes. VT-447PP High Tg, Lead Free &, IPC-4101E /127 /128 /130 VT-447 and product is designed to meet friendly environment requirement. It has better bonding ability and could be used for lead free application, specifically designed for use in rigid-flex applications. Storage Condition & Shelf Life Prepreg Storage Condition Temperature < 23 C (73 F) < 5 C (41 F) Relative humidity < 55% / Shelf Life 3 months 6 months The prepreg exceeding shelf life should be retested. Page 1 of 5

2 & Prepreg Availability Product Type Glass Type Resin Content VT-45 PP Dicy Cured VT-47 PP Lead Free VT-447 PP Lead Free & Environment Friendly Flow Range (mil) (mm) Pressed Thickness (mil) (mm) 106 NF % 10~ ~ NF % 10~ ~ LF % 60~ ~ LF % 60~ ~ LF % 60~ ~ NF % 10~ ~ NF % 10~ ~ LF % 60~ ~ LF % 60~ ~ NF % 10~ ~ NF % 10~ ~ NF % 10~ ~ NF % 10~ ~ NF % 10~ ~ LF % 60~ ~ LF % 60~ ~ * Measured by micrometer NF ---- PP, LF ---- PP 1) Press Temperature C 2) 3plys per pressing 3) Press Pressure psi Built per IPC-TM Page 2 of 5

3 & Prepreg Properties Sheet of Pressed Prepreg Test Item Test Method (IPC-TM-650) Unit VT-45 VT-47 VT-447 Tg TMA C Td TGA ASTM D3850 C Electric Strength KV/mm Peel Strength with 1oz Cu Lb/in Peel strength with CVL Lb/in Moisture D24 / % Absorption After PCT 1atm., 121 C, 1hour % X,Y-axis CTE 30~125 C ppm/ C 12~15 12~15 12~15 Z-axis CTE Before Tg ppm/ C After Tg Thermal Stress Solder dip 288 C Second >100 >300 >300 Breakdown Voltage Arc Resistance D48/50+ D0.5/23 D48/50+ D0.5/ KV >60 >60 > Second DK (RC60% at 1GHz) DF (RC60% at 1GHz) C24/23/ _ C24/23/ _ Flammability As Received UL94 Rating V0 V0 V0 All test data provided are typical values and not intended to be specification values. Page 3 of 5 7

4 & Prepreg Selection Guide For Heat-Sink bonding High Peel Strength Fast Cure VT-45PP High Reliability VT-47PP For Rigid Flex Application High Peel Strength Fast Cure VT-45PP High Layer Count VT-47PP Camera Modulus Battery Modulus Home Key Modulus VT-447PP Halogen Free High Layer Count VT-447PP Page 4 of 5

5 & Prepreg Press Condition VT-45PP VT-47PP VT-447PP Heating rate of materials C/min C/min C/min (5~10 F/min) (5~10 F/min) (5~10 F/min) Cure Temperature 180 C 185 C 185 C Cure Time >50min >60min >60min Vacuum should be continued until over 140 C (284 F) [Material Temperature] Pressure on materials: Start with 100psi, Full pressure: 250~450psi Cold Press: Keep Room Temperature by water; Pressure: 100psi; Dwell Time: 60minutes Contact Ventec technical service to discuss the specific condition. Temperature 250 C/ 482 F 200 C/ 392 F 150 C/ 302 F 100 C/ 212 F 80 C (176 F) Hot Start Cycle for VT-45 N/L flow PP 190 C (374 F) Vacuum: 760Torr(100KPa) Pressure 500psi(35Kg/cm 2 ) 400psi(28Kg/cm 2 ) 300psi(21Kg/cm 2 ) 200psi(14Kg/cm 2 ) 50 C/ 122 F Vacuum: 30Torr(4KPa) 100psi(7Kg/cm 2 ) Time (minute) Page 5 of 5