Product Change Notification - LIAL-20HILO069

Transcription

1 Product Change Notification - LIAL-20HILO069 Date: 25 Jun 2018 Product Category: Microprocessors Affected CPNs: Notification subject: CCB 3431 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire, 2100AC die attach and KE-G1250NAS mold compound in selected products available in 217L LFBGA package at ASE assembly site Notification text: PCN Status: Initial notification PCN Type: Manufacturing Change Microchip Parts Affected: Please open one of the icons found in the Affected CPNs section above. NOTE: For your convenience Microchip includes identical files in two formats (.pdf and.xls) Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire, 2100AC die attach and KE-G1250NAS mold compound in selected products available in 217L LFBGA package at ASE assembly site Pre Change: Using palladium coated copper (PdCu) bond wire, 2100AS die attach material and KE-G1250LKDS mold compound material Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wire, 2100AC die attach material and KE-G1250NAS mold compound material Pre and Post Change Summary: Pre Change Post Change ASE Inc. ASE Inc. Assembly Site (ASE) (ASE) Wire material PdCu CuPdAu Die attach material 2100AS 2100AC Molding compound KE-G1250LKDS KE-G1250NAS material Lead frame material HL832NX-A HL832NX-A Impacts to Data Sheet: None Change Impact: None Reason for Change: To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire Change Implementation Status: In Progress

2 Estimated Qualification Completion Date: December 2018 Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts. Time Table Summary: June 2018 December > Workweek Initial PCN Issue Date X Qual Report Availability X Final PCN Issue Date X Method to Identify Change: Traceability code Qualification Plan: Please open the attachments included with this PCN labeled as PCN_#_Qual Plan. Revision History: June 25, 2018: Issued initial notification. CN Attachment(s): PCN_LIAL-20HILO069_QUAL_PLAN.pdf Please contact your local Microchip sales office with questions or concerns regarding this notification. Terms and Conditions: If you wish to change your product/process change notification (PCN) profile please log on to our website at sign into mymicrochip to open the mymicrochip home page, then select a profile option from the left navigation bar. To opt out of future offer or information s (other than product change notification s), click here to go to microchipdirect and login, then click on the "My account" link, click on "Update profile" and un-check the box that states "Future offers or information about Microchip's products or services."

3 QUALIFICATION PLAN SUMMARY PCN #: LIAL-20HILO069 Date June 14, 2018 Qualification of palladium coated copper with gold flash (CuPdAu) bond wire, 2100AC die attach and KE-G1250NAS mold compound in selected products available in 217L LFBGA package at ASE assembly site

4 Purpose: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire, 2100AC die attach and KE-G1250NAS mold compound in selected products available in 217L LFBGA package at ASE assembly site CCB No.: 3431 Assembly site ASE Miscellaneous BD Number BD_91001_CGF_14_C_2.0 MP Code (MPC) ATBC04 Part Number (CPN) 91SAM9G20B-CU Core Material HL832NX-A Core Thickness 200+/-30um L1/L2 Thickness Min 0.18um/Min 0.18um Process Normal Substrate Part Number BGA Composition NiAu SM Material AUS308 SM Thickness 50+/-15um Drill Size 150um Line/Space Specs Min. 30um / Min. 20um Bond Wire Material CuPdAu Conductive Conductive Mold Compound PKG Die Solder ball Part Number 2100AC Part Number KE-G1250NAS PKG Type LFBGA Pin/Ball Count 217 PKG width/size 15x15 mm Ball Pitch 0.80 mm Die Thickness 6 mils Die Size x 4.286mm Composition 98.5SN/1.0AG/0.5CU(SAC105) Ball size 0.4mm diameter

5 Test Name Wire Bond Pull - WBP Wire Bond Shear - WBS Conditions Read Point -40 C to +85 C Pre & Post Test Temperature 40 C to +85 C Sample Size Min. Qty of Spares per Lot (should be properly marked) Qty of Lots Total Units Fail Accept Qty Est. Dur. Days Test Site Special Instructions CDF-AEC-Q MPHIL Wire pull / ball shear is performed after stress testing and decapsulation. CDF-AEC-Q MPHIL Wire pull / ball shear is performed after stress testing and decapsulation. External Visual Mil. Std /2010 All devices prior to submission for qualification testing 0 3 ALL 0 5 MPHIL Solder ball shear JESD22B117A MPHIL 10 balls/5 units. Parts should gone Preconditioning Coplanarity JESD22B108A/POD MPHIL All units HTSL (High Temp Storage Life) JESD22A C, 2x Stress Electrical test pre and post stress at +25 C and hot temp. 500 hrs 100hrs +25 C, +85 C MPHIL Spares should be properly identified.

6 Test Name Conditions Read Point -40 C to +85 C Pre & Post Test Temperature 40 C to +85 C Sample Size Min. Qty of Spares per Lot (should be properly marked) Qty of Lots Total Units Fail Accept Qty Est. Dur. Days Test Site Special Instructions Preconditioning - Required for surface mount devices +150 C Bake for 24 hours, moisture loading requirements per MSL level + 3X reflow at peak reflow temperature per Jedec-STD-020D for package type. C +25 C MPHIL Spares should be properly identified. 77 parts from each lot to be used for HAST, Autoclave, Temp Cycle test. HAST '+130 C/85% RH for 96hrs + 192hrs. Electrical test pre and post stress at +25 C and hot temp. 96 hrs/192hrs +25 C, +85 C MPHIL Perform per the requirements in AEC-Q006. Spares should be properly identified. Use the parts which have gone through Preconditioning. UHAST +130 C/85% RH for 96 /192hrs 130 C/85% RH for 96 /192hrs +25 C MPHIL Spares should be properly identified. Use the parts which have gone through Pre-conditioning.

7 LIAL-20HILO2100AC die attach and KE-G1250NAS mold compound in selected products available in 217L Affected Catalog Part Numbers(CPN) AT91SAM9G20B-CU AT91SAM9G20B-CU-101 AT91SAM9G20B-CU-103 AT91SAM9G20B-CU-999