Board Assembly TWG. Rev.03 Dec. 5 th, 2013 SMTA Silicon Valley Chapter Meeting At Cisco Systems, Bldg D, Pacific Pacific Room
|
|
- Shanna Wilkerson
- 6 years ago
- Views:
Transcription
1 Board Assembly TWG Champion: Assembly Materials: Keith Howell, Nihon Superior Repair & Rework: Jasbir Bath, Bath Consultancy Press-fit: Dennis Willie, Flextronics SMT Placement: Girish Wable, Jabil NPI: Michael Gerner, Plexus Chair & Co-chair: Dr. Paul Wang, Mitac Frank Grano, GE Participant: 51 from 33 companies Rev.03 Dec. 5 th, 2013 SMTA Silicon Valley Chapter Meeting At Cisco Systems, Bldg D, Pacific Pacific Room
2 International Electronics Manufacturing Initiative (inemi) Not for profit, highly efficient R&D consortia since 1994 Funded by Corporate memberships - Staffed globally in US, China, Japan & Ireland Membership includes 107 leading industry companies & organizations, representing a cross section of our electronics manufacturing industry & supply chain inemi Mission: Forecast and accelerate improvements in the Electronics Manufacturing Industry for a sustainable future. We Accomplish This By: Being the recognized leader at projecting future technology needs for the global supply chain (inemi Technology Roadmap). Guiding and leveraging the strength of the consortium s industry leading international membership. Driving high impact collaborative R&D Results through constantly improving methodologies. Defining and implementing science based sustainable solutions in high impact areas including the environment and health care. Influencing and leveraging key government agencies and labs (inemi Research Priorities Document). inemi has currently 25 collaborative R&D projects and initiatives that address key technology gaps Projects typically have member companies/institutions 1
3 Some Definitions TWG - Technical Working Group Develops the roadmap technology chapters Presently 20 groups and chapters PEG Product Emulator Group Virtual Product : future product attributes plus key cost and density drivers Portable / Consumer Office Systems High-End Systems Medical Products Automotive Aerospace/Defense 2
4 Methodology Available to Market Place Competitive Solutions Technology Evolution Government Roadmap Research Product Needs Disruptive Technology Academia Global Industry Participation GAP Analysis No Work Required inemi Members Collaborate Projects Industry Solution Needed 3
5 Statistics for the 2013 Roadmap > 650 participants -- Big Thanks to All Contributors!! > 350 companies/organizations 18 countries from 4 continents 20 Technology Working Groups (TWGs) 6 Product Emulator Groups (PEGs) > 1900 pages of information Roadmaps the needs for Workshops held in Europe (Berlin, Germany), Asia (Hong Kong, China) and North America (ECTC, San Diego) in June 2012 A Full Global Perspective Available to inemi members on 12/22/12 at: Shipping/Downloading to industry beginning April 4 at 4
6 2013 Technology Working Groups (TWGs) Modeling, Simulation, and Design Solid State Illumination Large Area, Flexible Electronics Semiconductor Technology Photovoltaics Ceramic Substrates Connectors MEMS/ Sensors Packaging & Component Substrates Passive Components Optoelectronics Mass Storage (Magnetic & Optical) Energy Storage & Conversion Systems Test, Inspection & Measurement Thermal Management Organic PCB Board Assembly Final Assembly Customer Information Management Systems Environmentally Conscious Electronics Red=Business Green=Engineering Aqua=Manufacturing Blue=Component & Subsystem 5
7 Portable / Consumer Office Systems Defense and Aerospace Medical Products Automotive High-End Systems Roadmap Development Product Sector Needs Vs. Technology Evolution TWGs (20) Product Emulator Groups Semiconductor Technology Business Processes Prod Lifecycle Information Mgmt. Design Technologies Modeling, Thermal, etc. Manufacturing Technologies Board Assy, Test, etc. Comp./Subsyst. Technologies Packaging, Substrates, Displays, etc. 6
8 Fourteen Contributing Organizations Semiconductors Organic Printed Circuit Boards inemi / ITRS / MIG/PSMA Packaging TWG inemi / MIG / ITRS MEMS TWG inemi / IPC / EIPC / TPCA Organic PWB TWG Interconnect Substrates Ceramic inemi Passives TWG inemi Roadmap inemi Information Management TWG Supply Chain Management inemi Board Assembly TWG inemi Optoelectronics TWG inemi Mass Data Storage TWG Magnetic and Optical Storage Optoelectronics and Optical Storage 7
9 Key Trends (2013 Roadmap) 8 8
10 Key Trends (2013 Roadmap) 9 9
11 Key Trends (2013 Roadmap) 10 10
12 Board Assembly of 3D IC Integration System-in-Package (SiP) Challenges/Opportunities 11
13 Miniaturization: Passive components size reduction Sources: Murata, Rohm From 2012 onwards the M0201 package will be introduced Dimensions: 0.2 x 0.1 mm This is half the size of a package! 12
14 Maturity 3D 3D Integration Technology 3D IC Packaging 3D IC Integration 3D Si Integration Mass Production Full swing production for memories. Every 18 months one layer increase Testing and yield challenges give way for Package stacking Commercialization Applied R&D Basic R&D Die Stacking with wire bonds Package on Package Stacking (PoP) C2C, C2W, W2W Stacking Active applied R&D is undertaken by Research Institutes. System level challenges are key. In the phase of industrialization. Still in Upstream research, technological challenges such as yield & device architecture are key issues. W2W Stacking Technology John H. Lau 13
15 Press-Fit TWG Scope Technologies for second level Board Assembly process Compliance press-fit Design Smaller Compliance Pins Placement & insertion Inspection Testing Challenges Repair Finish Hole size Environment Requirement Contact Relibaility 14
16 Press-Fit TWG Scope Technologies for second level Board Assembly process 15
17 Inspection 3D Automated Press-Fit Pin Profiling Inspection Backplanes and PCBA assemblies up to size 127x76cm (50 x30 ), 200K~500K pts/cm 2 in 18 seconds Non-contact Confocal line sensor scan then create 3D profile to detect bent pin, pin crushed and missing pin in quantitative value Press-Fit TWG Scope 16
18 Press-Fit TWG Scope Technologies for second level Board Assembly process Compliance press-fit Design Smaller Compliance Pins Placement & insertion Inspection Testing Challenges Repair Finish Hole size Environment Requirement Contact Reliability Related press-fit reliability correlation with design and transportation stress (case study) 17
19 Repair and Rework TWG Scope Technologies for second level Board Assembly process Rework and Repair Technology forecast Hand Solder and PTH Rework Rework of New/Non-Standard Components Site Dressing Rework Process Re-Attach Rework Process 18
20 Repair and Rework TWG Scope Technologies for second level Board Assembly process Rework of Temperature Sensitive Devices 19
21 Repair and Rework TWG Scope Technologies for second level Board Assembly process Rework and Repair Technology forecast Area Array and Non-Standard Package Rework Soldering Process Parameter Units Maximum package size Minimum package size Smallest type of discretes being reworked Minimum reworkable pitch Target delta T across solder joints Typical rework profile length (time) mm mm (Imperial) 0201 (Imperial) (Imperial) 0201 metric 0201 metric mm C <10 <10 <10 <10 <10 min 8 6 to 8 6 to 8 6 to 8 6 to 8 SnPb Time Above Liquidus (TAL) Number of allowable area array reworks at a specific location Type of rework (Conv./IR/Other) (Other is Laser and Vapor Phase Rework) sec # % 85/15 85/15 85/15 80/20 70/20/10 Type redress approach (Non Contact/SolderWick) % 20/80 20/80 20/80 30/70 40/60 Type of medium deposit for BGA component rework (Paste on PCB/Paste on Part/Flux only) (See Note) % 40/40/20 40/40/20 40/40/20 40/40/20 40/40/20 20
22 Expanded Rework Section (Pb-Free) Maximum package size mm Minimum package size mm Smallest type of discretes being reworked (Imperial) 0201 (Imperial) (Imperial) 0201 metric 0201 metric Pb-free Minimum reworkable pitch Target delta T across solder joints Typical rework profile length (time) Time Above Liquidus (TAL) Number of allowable area array reworks at a specific location Type of rework (Conv./IR/Other) (Other is Laser and Vapor Phase Rework) Type redress approach (Non Contact/Solder Wick) mm C <10 <10 <10 <10 <10 min sec # % 85/15 85/15 85/15 80/20 70/20/10 % 20/80 20/80 20/80 30/70 40/60 Type of medium deposit for BGA component rework (Paste on PCB/Paste on Part/Flux only) (See Note) % 40/40/20 40/40/20 40/40/20 40/40/20 40/40/20 Note: The use of solder paste or tacky flux will depend on the type of component being reworked. Paste is typically used to reduce the affect of component warpage causing Head-in-Pillow component soldering defects during BGA and PoP part rework. In terms of ease of use and speed of rework, tacky flux is used more even though it may have an affect first pass yield. The percentages mentioned for Paste versus Flux medium are for BGA rework and will vary dependent on the type of part being reworked. 21
23 Repair and Rework TWG Scope Technologies for second level Board Assembly process Hand soldering and PTH Rework 22
24 Assembly Materials TWG Chair: Keith Howell, Nihon Superior
25 Assembly Materials TWG Scope Technologies for second level Board Assembly process SMT solder pastes BGA rework pastes Wave bar solder Wave solder fluxes Repair / manual soldering materials Underfills Die attach materials Encapsulants Conformal coatings 24
26 Assembly Materials Drivers Increasing Component Complexity Increasing package density Smaller components with lower stand-off Rework and cleaning challenges Low component stand-off height will challenge underfill chemistries Fill time and voiding requirements Lower joint heights affect solder joint reliability Opportunities for new interconnect technologies and materials BGA components become thinner resulting in component warpage Head-in-pillow (HiP) defects are expected to become more prevalent Introduction of smaller chip components (0402 metric) Solder pastes to be more thermal resistant to prevent oxidation and graping defects 25
27 Energy Costs Assembly Materials Drivers Lower energy consuming processes may become more prevalent Low temperature alloy technologies to meet the market drive for lower energy consumption in SMT manufacturing Desire to lower process temperatures for higher reliability of the PCB substrates and components 26
28 Assembly Materials Drivers Environmental Concerns RoHS exemptions Telecommunications expiration in 2014 which will drive the conversion to lead-free in time-frame. VOC-free fluxes Lack of RoHS regulation in US Conversion from SnPb to lead-free soldering material has been slower than previously predicted Most consumer electronics are now lead-free worldwide but industrial products for the US, aerospace, and military remain SnPb 27
29 Assembly Materials R&D Needs Higher fluxing power or activity to compensate for the poorer wetting as a result of the higher surface tension of lead-free solders while mitigating tin whiskers (due to possible corrosion) and electrical reliability concerns of the flux on the board Higher fluxing capacity and lower corrosion to support the use of a finer solder powder printing Greater oxidation resistance and improved wetting for the reduction of head-in-pillow component soldering defects, mainly due to component or board warpage Greater oxidation resistance to support 260 C reflow and further miniaturized solder paste deposits, with minimal use of halogen containing compounds in the flux 28
30 Assembly Materials R&D Needs Alloy development which promotes the formation of finer microstructures hence a more smooth and higher reliability solder joint Water soluble chemistries to support cleaning requirements with 260 C reflow No clean chemistries to support 260 C reflow with increased ability for ICT probing No clean chemistries which are compatible with conformal coating systems Flux residue compatible with vapor phase fluids to reduce contamination of the fluids Low viscosity dipping paste for Package-on-Package as finer pitch components are introduced Low voiding paste formulations for thermally conductive components 29
31 Assembly Materials Gaps Parameter Definition SAC/ SAC/ SAC/ SAC/ SAC/ Alloy Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Solder Paste Alloy (Low Temp) Low Temp Low Temp Alloy (Lead-free) High Temp>260C High Temp High Temp High Temp High Temp High Temp Halogen-free Bar Solder Wave Solder Flux Alloy VOC Free Halogen free SAC/ SAC/ SAC/ SAC/ SAC/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Flux-cored Solder Wire Repair Gel/Pasty Fluxes Repair Liquid Fluxes Alloy Flux-cored Solder Wire Repair Gel/Tacky Fluxes SAC/ SAC/ SAC/ SAC/ SAC/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC M ore Benign Left on Board Left on Board M ore Benign Left on Board Left on Board Repair Liquid Fluxes More Benign Left on Board Left on Board 30
32 Assembly Materials Gaps Parameter Definition Die Attach Preforms Thermal conductivity critical Matched CTE capability Lead-free compatibility JEDEC JEDEC JEDEC +260 reflow, small die, paste JEDEC JEDEC JEDEC Die Attach Adhesives Lead-free compatibility JEDEC +260 reflow, large die, paste High thermal (polymer based) paste JEDEC JEDEC JEDEC JEDEC JEDEC >30 W/m-K >50 W/m-K >100 W/m-K >100 W/m-K >100 W/m-K Compatibility with Low-k ILD, paste JEDEC JEDEC JEDEC JEDEC JEDEC 65 nm tech 65 nm tech 45 nm tech 45 nm tech 32 and below nm tech Pre-applied polymer DA to silicon JEDEC JEDEC JEDEC JEDEC JEDEC Repair Adhesives Polymer Based 31
33 Assembly Materials Gaps Parameter Definition Underfills Lead-free FC in package (Laminate) BGA balls only Lead-free FC in package (ceramic), BGA balls only JEDEC 260, BGA balls only JEDEC BGA balls only JEDEC 260, BGA balls only JEDEC BGA balls only JEDEC FC bump and BGA balls JEDEC FC bump and BGA balls JEDEC FC bump and BGA balls JEDEC FC bump and BGA balls JEDEC FC bump and BGA balls JEDEC FC bump and BGA balls Low K ILD JEDEC JEDEC JEDEC JEDEC JEDEC 90 nm tech 65 nm tech 45 nm tech 45 nm tech 45 nm tech Pre-applied FC JEDEC JEDEC JEDEC JEDEC JEDEC Large Die 25 mm Low K 25 mm low K 30 mm low K 30 mm low K 30 mm low K CSP Pre-applied Leadfree Reworkable Reworkable Reworkablle Reworkable Conformal Coatings Lead-free Compatible with Lead-free residues Compatible with Lead-free residues VOC-free 5-10% Compatible with Lead-free residues Increasing Volume Compatible with Lead-free residues Compatible with Lead-free residues Halogen-free 5-10% Increasing Volume Fillers Small Quantiites Small Quantiites Large Quantities Large Quantities Large Quantities Nano-materials Printed Electronics Available Imprint Technologies Available 32
34 Solder Paste Assembly Materials R&D Priorities Next generation of solder materials for lower cost and processing temperatures Replacement of SAC, modified SnCu, and low silver SAC alloys Better characterization of the reliability trade-offs with lower silver SAC alloys and SAC (Sn3-4Ag0.5Cu) and modified SnCu alloys. Silver content increases resistance to thermal cycling, while reducing silver improves drop shock resistance New interconnect technologies deploying nano-materials to support decreased pitch and increased interconnect frequencies. Improvement in printing technology and material development 0.3mm pitch CSP, 01005[0402 metric] chip, LGA/QFN/MLF, and Package-on-Package (PoP) components Effect of the percentage of voiding on the thermal and electrical reliability on QFN/MLF components. Process optimization of paste-in-hole or pin-in-paste with or without solder performs on thick boards as alternatives to wave soldering Improved reflow wetting performance with halogen-free fluxes 33
35 Assembly Materials R&D Priorities Wave Flux Halogen-free material which provides good hole-fill on thick boards Reduced residue fluxes for thick boards with improved pin testability for ICT Development of fluxes with benign residues without heat activation in the solder VOC-free (water based) no-clean wave fluxes with good hole-fill on thicker boards for lead-free wave soldering and low solder balling Improved flux formulations which exceed the electro-migration requirements in J-STD-004 Repair Flux Improvements in tacky fluxes for CSPs Development of fluxes with benign residues without heat activation in the solder 34
36 Assembly Materials R&D Priorities Die Attach Materials Thermal and moisture resistant polymers Formulation adjustments for new lead-free solder masks Low thermal resistance materials Alternative fillers and fiber technology to improve thermal performance Non silver fillers to reduce cost Lower temperature cure to reduce assembly cost and reduce warpage for stress sensitive applications 35
37 Assembly Materials R&D Priorities Conformal Coatings Conformal coating materials / processes which are compatible with leadfree solder materials / processes, to help mitigate lead-free issues such as tin whisker formation Need for investigating the compatibility and wetting of conformal coatings with various lead-free materials (mold compounds, solders, solder mask ) Development of a halogen-free parylene that can help mitigate tin whisker issues and be compatible with the lead-free, no clean flux systems. Conformal coatings for high temperature electronics and components Evaluation of vapor phase thin conformal coatings for various MEMS applications Development of composite conformal coatings materials for better barrier properties and mitigation of tin whiskers 36
38 Assembly Materials R&D Priorities Nanotechnology As the electronics industry moves forward with miniaturization and increasing functionality, there is an escalating demand on materials performance used in the manufacture of materials used in electronics assembly One such method of improving the performance of some materials is the use of nanomaterials and nano-structured materials The US National Nanotechnology Initiative is now 11 years old; initiatives in Europe and Asia started at about the same time when the benefits of nanotechnology for a wide range of applications was recognized Bearing in mind the fact that it takes 7-10 years from invention for a nondisruptive new product to gain market, we are just starting to see the first applications of non-semiconductor nanotechnology reaching the market and can expect considerable growth in this sector in the next few years 37
39 Nanotechnology - Size At least one dimension in the range 1-100nm (US National Nanotechnology Initiative, A nanometre is - a billionth of meter - a thousandth of a micron - 4 hundred thousandths of a mil 1 nanometre = 10-9 m = 0.000,000,001m = 0.001µm mil 38
40 Nanotechnology - Size Nano Particle 1m Solder Sphere 12mm x 12mm 39
41 Assembly Materials R&D Priorities Nanotechnology Small nm fillers being introduced for specific performance improvements Mechanical strength / toughness improvements, optical clarity in filled systems, etc One of the most rapid areas of nanoparticle adoption is printed electronics Paste with nano-sized silver particles is used for solar panel interconnects, RFID and antennas as well as a range of other applications Next evolution beyond fillers is in commercial nano and near nano coatings High-release stencil coatings High-performance waterproofing of consumer electronics 40
42 Assembly Materials Concerns The unpredictability of the effect of potential regulations regarding conflict minerals from the Democratic Republic of the Congo (DRC) to meet Section 1502 of the Dodd-Frank Act The burden and cost of compliance as well as its impact on the supply and pricing of tin, the major constituent in lead-free solders Possible regulations affecting soldering materials, the European Commission s REACH (Registration, Evaluation, Authorization, and Restriction of Chemical substances) law Technology need for higher fluxing power or activity to address the need for lead-free wetting improvement The possibility of additional substances being included in the REACH restriction may limit formulators Further understanding of lead-free solder material metallurgy, processability, and long term reliability Impact on the long term reliability Alloys with Increased reliability 41
43 Summary/Next Steps
44 Strategic Concerns Restructuring from vertically integrated OEMs to multi-firm supply chains Resulted in a disparity in R&D Needs vs. available resources Critical needs for R&D Middle part of the Supply Chain is least capable of providing resources Industry collaboration Gain traction at University R&D centers, Industry consortia, ad-hoc cross-company R&D teams The mechanisms for cooperation throughout the supply chain must be strengthened. Cooperation among OEMs, ODMs, EMS firms and component suppliers is needed to focus on the right technology and to find a way to deploy it in a timely manner Collaboration is inemi s Strength; We play an important role 43
45 Paradigm Shifts Need for continuous introduction of complex multifunctional products to address converging markets favors modular components or SiP (2-D & 3-D): Increases flexibility Shortens design cycle Cloud connected digital devices have the potential to enable major disruptions across the industry: Major transition in business models New Power Distribution Systems for Data Centers Huge data centers operating more like utilities (selling data services) Local compute and storage growth may slow (as data moves to the cloud) Rent vs. buy for software (monthly usage fee model) Rapid evolution and new challenges in energy consuming products such as SSL, Automotive and more Sensors everywhere MEMS and wireless traffic! More Moore (scaling of pitch) has reached its forecast limit and must transition to heterogeneous integration - More Than Moore. 44
46 The Next inemi Deliverables Are Key: Addressing the Gaps Technology continues to move at a faster rate of change Driven in many cases by short life cycle low cost yet high volume product Many of these cool new things don t port well or quickly to high reliability markets such as automotive, medical, or high end networking The next key deliverables from inemi are the 2013 Technical Plan (available only to members) and the 2013 Research Priorities Effective usage and coordination behind both these documents will be key to continued industry progress and growth Look for them in late 2013 The inemi TIG s, Technical and Research Committees are actively working them NOW! 45
47 Questions
48 contacts: Chuck Richardson Grace O Malley gomalley@inemi.org Bill Bader Bill.bader@inemi.org
Board Assembly Roadmap. TWG Chair: Dr. Dongkai Shangguan (Flextronics) Co-chair: Dr. Ravi Bhatkal (Cookson) Co-chair: David Geiger (Flextronics)
Board Assembly Roadmap TWG Chair: Dr. Dongkai Shangguan (Flextronics) Co-chair: Dr. Ravi Bhatkal (Cookson) Co-chair: David Geiger (Flextronics) Agenda Roadmap Development Approach Participants Key Trends
More informationBoard Assembly Roadmap
Board Assembly Roadmap Speaker & Chair: Dr. Dongkai Shangguan (Flextronics) Co-chair: Dr. Ravi Bhatkal (Cookson) Co-chair: David Geiger (Flextronics) Agenda Roadmap Development Approach Chapter Overview
More information2015 Board Assembly Roadmap
2015 Board Assembly Roadmap Jasbir Beth-Rework Chair Dennis Willie-Pressfit Chair Leigh William Gesick, Material Chair Mike Gerner-NPI Chair Brent Fischthal-Placement Chair TWG Chair-Paul Wang, Ph.D, MBA
More informationBoard Assembly MANUFACTURING TECHNOLOGIES. Wave and Selective Soldering... 48
Board Assembly Dr. Dongkai Shangguan, Flextronics, Chair Dr. Ravi Bhatkal, Cookson Electronics, Co-Chair David Geiger, Flextronics, Co-Chair CONTENTS: Board Assembly... 1 Executive Summary... 1 Introduction...
More information2013 inemi Roadmap Webinar Series
2013 inemi Roadmap 2013 Webinar Series About inemi Mission: Forecast and Accelerate improvements in the Electronics Manufacturing Industry for a Sustainable Future. 5 Key Deliverables: Technology Roadmaps
More informationIPC -7095C Design and Assembly Process Implementation For BGAs
IPC -7095C Design and Assembly Process Implementation For BGAs 1 Overview With the introduction of BGA components, things had to change: New design New assembly process New repair process New inspection
More informationINEMI Packaging Substrate Workshop, Toyama, Japan, 2014 Challenges of Organic Substrates from EMS Perspective Weifeng Liu, Ph. D.
INEMI Packaging Substrate Workshop, Toyama, Japan, 2014 Challenges of Organic Substrates from EMS Perspective Weifeng Liu, Ph. D. Date (4/10/2014) AEG - WW Microelectronics and Packaging OUTLINE Overview
More informationSystem in Package: Identified Technology Needs from the 2004 inemi Roadmap
System in Package: Identified Technology Needs from the 2004 inemi Roadmap James Mark Bird Amkor Technology Inc System in package (SiP) technology has grown significantly in the past several years. It
More informationBasic PCB Level Assembly Process Methodology for 3D Package-on-Package
Basic PCB Level Assembly Process Methodology for 3D Package-on-Package Vern Solberg STC-Madison Madison, Wisconsin USA Abstract The motivation for developing higher density IC packaging continues to be
More informationWhite Paper Quality and Reliability Challenges for Package on Package. By Craig Hillman and Randy Kong
White Paper Quality and Reliability Challenges for Package on Package By Craig Hillman and Randy Kong Background Semiconductor technology advances have been fulfilling Moore s law for many decades. However,
More informationEPOXY FLUX MATERIAL AND PROCESS FOR ENHANCING ELECTRICAL INTERCONNECTIONS
As originally published in the SMTA Proceedings. EPOXY FLUX MATERIAL AND PROCESS FOR ENHANCING ELECTRICAL INTERCONNECTIONS Neil Poole, Ph.D., Elvira Vasquez, and Brian J. Toleno, Ph.D. Henkel Electronic
More informationIPC-AJ-820A Assembly and Joining Handbook. The How and Why of All Things PCB & PCA
IPC-AJ-820A Assembly and Joining Handbook The How and Why of All Things PCB & PCA 1 Scope To provide guidelines and supporting info for the mfg of electronic equipment To explain the HOW TO and WHY Discussions
More information5. Packaging Technologies Trends
5. Packaging Technologies Trends Electronic products and microsystems continue to find new applications in personal, healthcare, home, automotive, environmental and security systems. Advancements in packaging
More informationMinimizing Voiding. Cristian Tudor Applications Engineer Eastern Europe
Minimizing Voiding Cristian Tudor Applications Engineer Eastern Europe ctudor@indium.com INDIUM CORPORATION 1 Indium Corporation s Business We develop, manufacture, market and support solders, electronics
More informationPb-free Challenges for High Complexity Products. inemi Jan 16 th 2008
Pb-free Challenges for High Complexity Products inemi Jan 16 th 2008 All Rights Reserved Alcatel-Lucent 2007 Agenda RoHS 101 Typical complex of telecom products (different from consumable) Pb-free Concerns
More informationFailure Modes in Wire bonded and Flip Chip Packages
Failure Modes in Wire bonded and Flip Chip Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract The growth of portable and wireless products is driving the miniaturization
More informationThe No Lead manufacturing Initiative
The No Lead manufacturing Initiative Dr. Srinivas T. Rao UCLA Workshop on Lead-free Solder for Electronic, Optical, and MEMs Packaging and Manufacturing September 5 th 2002 Address Mfg. Needs of OEMs and
More informationUltralow Residue Semiconductor Grade Fluxes for Copper Pillar Flip-Chip
Ultralow Residue Semiconductor Grade Fluxes for Copper Pillar Flip-Chip SzePei Lim (Presenter), Jason Chou, Maria Durham, and Dr. Andy Mackie Indium Corporation 1 Outline of Presentation Roadmaps and challenges
More informationinemi Test and Inspection TIG
inemi Test and Inspection TIG August 21, 2018 Recording (available up to 6 months after webinar) https://inemi.webex.com/inemi/ldr.php?rcid=b515f6993fd3fa1dc3abbfefebcfe4a6 inemi Technology Integration
More informationChallenges in Material Applications for SiP
Challenges in Material Applications for SiP Sze PeiLim Regional Product Manager for Semiconductor Products Indium Corporation Indium Corporation Materials Supplier: SMT solder pastes and fluxes Power semiconductor
More informationEnvironmentally Preferred Products
Environmentally Preferred Products Lead (Pb)-Free, RoHS Compliant Solution May 2006 Customer Communication Let s get clear about RoHS RoHS (EU Directive 2002/95/EC) The official Directive name is Restriction
More informationPackaging Substrate Workshop Wrap Up. Bob Pfahl, inemi
Packaging Substrate Workshop Wrap Up Bob Pfahl, inemi Warpage Facilitator: Jie Xue, Cisco Presenter: ML Loke, Intel Breakout Session (ends 10:30 am) Introduction & your expectation Issues & Root cause
More informationAdvancements In Packaging Technology Driven By Global Market Return. M. G. Todd
Advancements In Packaging Technology Driven By Global Market Return M. G. Todd Electronic Materials, Henkel Corporation, Irvine, California 92618, USA Recently, the focus of attention in the IC packaging
More information2009 Technical Plan. TIG Chair: John Davignon T.C. / TIG Meeting Las Vegas, Nevada April 3, 2009
2009 Technical Plan TIG Chair: John Davignon T.C. / TIG Meeting Las Vegas, Nevada April 3, 2009 Technical Plan Agenda Introduction What has changed Preliminary Gap Chart Preliminary Five-year plan Preliminary
More informationSemiconductor IC Packaging Technology Challenges: The Next Five Years
SPAY025 May 2006 White Paper Mario A. Bolanos, Director Semiconductor Group Packaging Technology Development, Texas Instruments In the era of communications and entertainment, growth of consumer electronics
More information3DIC Integration with TSV Current Progress and Future Outlook
3DIC Integration with TSV Current Progress and Future Outlook Shan Gao, Dim-Lee Kwong Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research) Singapore 9 September, 2010 1 Overview
More informationCu Wire Bonding Survey Results. inemi Cu Wire Bonding Reliability Project Team Jan 30, 2011
Cu Wire Bonding Survey Results inemi Cu Wire Bonding Reliability Project Team Jan 30, 2011 Outline About inemi Project Overview Survey Mechanism Survey Respondents Survey Results Technology Adoption Status
More informationEncapsulation Selection, Characterization and Reliability for Fine Pitch BGA (fpbga )
Encapsulation Selection, Characterization and Reliability for Fine Pitch BGA (fpbga ) Henry M.W. Sze, Marc Papageorge ASAT Limited 14th Floor, QPL Industrial Building, 138 Texaco Road, Tseun Wan, Hong
More informationLow-Silver BGA Assembly Phase II Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Low-Silver BGA Assembly Phase II Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results Gregory Henshall 1 Michael Fehrenbach 2 Hewlett-Packard Co. 1 Palo Alto, CA USA 2 Houston, TX USA
More informationMaterial Selection and Parameter Optimization for Reliable TMV Pop Assembly
Selection and Parameter Optimization for Reliable TMV Pop Assembly Brian Roggeman, David Vicari Universal Instruments Corp. Binghamton, NY, USA Roggeman@uic.com Martin Anselm, Ph.D. - S09_02.doc Lee Smith,
More informationHighlights from the inemi Thermal Management Technology Roadmap. Grace O'Malley inemi
Highlights from the inemi Thermal Management Technology Roadmap Grace O'Malley inemi Objectives Introduction to inemi does Overview of what's happening in the electronics manufacturing industry Highlights
More informationA Supplier s Perspective on the Development of Lead-free Soldering Materials
A Supplier s Perspective on the Development of Lead-free Soldering Materials Keith Howell Nihon Superior Silicon Valley Chapter 13 November 2012 Agenda Solder Paste Flux Development Voiding Head-in-pillow
More informationActive Projects and Research Review
Active Projects and Research Review Denis Barbini, Ph.D., Vitronics Soltec Productronica Munich, Germany November 17, 2005 1 Overview 2 Pb-Free BGAs in SnPb Process Study Chair: Robert Kinyanjui, Sanmina-SCI
More informationAdvanced Analytical Techniques for Semiconductor Assembly Materials and Processes. Jason Chou and Sze Pei Lim Indium Corporation
Advanced Analytical Techniques for Semiconductor Assembly Materials and Processes Jason Chou and Sze Pei Lim Indium Corporation Agenda Company introduction Semiconductor assembly roadmap challenges Fine
More informationELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations
ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations R. Wayne Johnson Alumni Professor 334-844 844-1880 johnson@eng.auburn. @eng.auburn.eduedu Outline System Design Issues
More informationELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations
ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations R. Wayne Johnson Alumni Professor 334-844-1880 johnson@eng.auburn. @eng.auburn.eduedu Outline System Design Issues Package
More informationThales vision & needs in advanced packaging for high end applications
Thales vision & needs in advanced packaging for high end applications M. Brizoux, A. Lecavelier Thales Global Services / Group Industry Chemnitzer Seminar June 23 th -24 th, 2015 Fraunhofer ENAS - Packaging
More informationNext Gen Packaging & Integration Panel
Next Gen Packaging & Integration Panel ECTC 2012 Daniel Tracy, Sr. Director Industry Research & Statistics SEMI May 29, 2012 Packaging Supply Chain Market Trends Material Needs and Opportunities Market
More informationTechnology Disrupts; Supply Chains Manage. Outline. Dr. Herbert J. Neuhaus TechLead Corporation
Technology Disrupts; Supply Chains Manage Dr. Herbert J. Neuhaus TechLead Corporation Outline Supply Chain Management Disruptive Innovation SMT Examples Chip-on-Board Package-on-Package Insights & Recommendations
More informationIncreasing challenges for size and cost reduction,
Packageon-Package: The Story Behind This Industry Hit Package-onpackage (PoP) technology is rapidly evolving to keep pace with the demand for faster, higherdensity devices in smaller, thinner stacks. As
More informationand Current Reliability Concerns Craig Hillman
and Pb-Free: Current Reliability Concerns Craig Hillman RoHS Abstract Like the rest of the electronics industry, your products will transition to Removal of Hazardous Substances (RoHS) compliance prior
More informationAdaption to scientific and technical progress under Directive 2002/95/EC
. Adaption to scientific and technical progress under Directive 2002/95/EC Results previous evaluation Exemption No. 15 Lead in solders to complete a viable electrical connection between semiconductor
More informationConformal Coating over No Clean Flux
Conformal Coating over No Clean Flux Karl Seelig & Timothy O Neill AIM Cranston, Rhode Island. USA. kseelig@aimsolder.com & toneill@aimsolder.com Introduction As the proliferation of modern day electronics
More informationAutomotive Electronic Material Challenges. Anitha Sinkfield, Delphi
Automotive Electronic Material Challenges Anitha Sinkfield, Delphi Automotive Electronic Material Challenges Project Update About inemi Project Participants Problem Statement Project Details Summary and
More informationLPSC SiCap 100µm NiAu finishing - Assembly by soldering
General description This document describes the attachment techniques recommended by Murata* for their LPSC silicon capacitors on the customer substrates. This document is non-exhaustive. Customers with
More informationAddressing the Challenge of Head-In-Pillow Defects in Electronics Assembly
Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly Mario Scalzo Senior Technical Support Engineer CSMTPE, Six-Sigma Black Belt ABSTRACT: The head-in-pillow defect has become a relatively
More informationLOW-SILVER BGA ASSEMBLY PHASE I REFLOW CONSIDERATIONS AND JOINT HOMOGENEITY SECOND REPORT: SAC105 SPHERES WITH TIN-LEAD PASTE
LOW-SILVER BGA ASSEMBLY PHASE I REFLOW CONSIDERATIONS AND JOINT HOMOGENEITY SECOND REPORT: SAC105 SPHERES WITH TIN-LEAD PASTE Chrys Shea Ranjit Pandher Cookson Electronics South Plainfield, NJ, USA Ken
More informationAdaption to scientific and technical progress under Directive 2002/95/EC
. Adaption to scientific and technical progress under Directive 2002/95/EC Results previous evaluation Exemption No. 7 a a) Lead in high melting temperature type solders (i.e. lead-based alloys containing
More informationReliability of Lead-Free Solder Connections for Area-Array Packages
Presented at IPC SMEMA Council APEX SM 2001 For additional information, please email marketing@amkor.com Reliability of Lead-Free Solder Connections for Area-Array Packages Ahmer Syed Amkor Technology,
More informationHigh Density PoP (Package-on-Package) and Package Stacking Development
High Density PoP (Package-on-Package) and Package Stacking Development Moody Dreiza, Akito Yoshida, *Kazuo Ishibashi, **Tadashi Maeda, Amkor Technology Inc. 1900 South Price Road, Chandler, AZ 85248, U.S.A.
More informationAssembly and Rework of Lead Free Package on Package Technology By: Raymond G. Clark and Joseph D. Poole TT Electronics - IMS Perry, Ohio
Assembly and Rework of Lead Free Package on Package Technology By: Raymond G. Clark and Joseph D. Poole TT Electronics - IMS Perry, Ohio Abstract: Miniaturization continues to be a driving force in both
More informationQualification of Thin Form Factor PWBs for Handset Assembly
Qualification of Thin Form Factor PWBs for Handset Assembly Mumtaz Y. Bora Kyocera Wireless Corporation San Diego, Ca. 92121 mbora@kyocera-wreless.com Abstract: The handheld wireless product market place
More informationALPHA OM-5100 FINE PITCH SOLDER PASTE
SM 797-7 ALPHA OM-5100 FINE PITCH SOLDER PASTE DESCRIPTION Cookson Electronics Assembly Material s ALPHA OM-5100, is a low residue, no-clean solder paste designed to maximize SMT line yields. The flux
More informationBecoming Lead Free. Automotive Electronics. Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant
Automotive Electronics Becoming Lead Free Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant 1 Agenda 1. Leadfree Electronics Drivers 2. Requirements 3. Areas of Impact 4.
More informationXBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm - Assembly by soldering
Assembly by soldering General description This document describes the attachment techniques recommended by Murata* for their pre-bumped and un-bumped silicon capacitors on the customer substrates. This
More informationStatement of Work (SOW) inemi Packaging TIG SiP Module Moldability Project
Statement of Work (SOW) inemi Packaging TIG SiP Module Moldability Project Version #1.0 Date: April 22, 2016 Project Leader: Billy Ahn, STATS ChipPAC Co-Project Leader: Anthony Yang, Moldex3D inemi Staff:
More informationChallenges of Fan-Out WLP and Solution Alternatives John Almiranez
Challenges of Fan-Out WLP and Solution Alternatives John Almiranez Advanced Packaging Business Development Asia Introduction to Fan-Out WLP Introduction World of mobile gadgetry continues to rapidly evolve
More informationDesign and Assembly Process Implementation of 3D Components
IPC-7091 Design and Assembly Process Implementation of 3D Components Developed by the 3-D Electronic Packages Subcommittee (B-11) of the Packaged Electronic Components Committee (B-10) of IPC Users of
More informationAssembly Reliability of TSOP/DFN PoP Stack Package
As originally published in the IPC APEX EXPO Proceedings. Assembly Reliability of TSOP/DFN PoP Stack Package Reza Ghaffarian, Ph.D. Jet Propulsion Laboratory, California Institute of Technology Pasadena,
More informationMEPTEC Semiconductor Packaging Technology Symposium
MEPTEC Semiconductor Packaging Technology Symposium Advanced Packaging s Interconnect Technology Process Shift and Direction October 23, 2014 Jay Hayes- Director of Business Development -Bumping and Flip
More informationClose supply chain collaboration enables easy implementation of chip embedded power SiP
Close supply chain collaboration enables easy implementation of chip embedded power SiP Gerald Weidinger, R&D Project Leader, AT&S AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse13
More information2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers)
2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers) Dr. Stephan Meschter BAE Systems LEAP WG Technical Guidelines Handbook Leader Johnson City, NY Phone: 607-770-2332, Email:
More informationHOW THE MOLD COMPOUND THERMAL EXPANSION OVERRULES THE SOLDER COMPOSITION CHOICE IN BOARD LEVEL RELIABILITY PERFORMANCE
HOW THE MOLD COMPOUND THERMAL EXPANSION OVERRULES THE SOLDER COMPOSITION CHOICE IN BOARD LEVEL RELIABILITY PERFORMANCE AUTHORS: B. VANDEVELDE, L. DEGRENDELE, M. CAUWE, B. ALLAERT, R. LAUWAERT, G. WILLEMS
More informationIMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION
IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Frank Grano, Felix Bruno Huntsville, AL Dana Korf, Eamon O Keeffe San Jose, CA Cheryl Kelley Salem, NH Joint Paper by Sanmina-SCI Corporation EMS, GTS
More informationPARYLENE ENGINEERING. For Longer Lasting Products
PARYLENE ENGINEERING For Longer Lasting Products PARYLENE ENGINEERING This presentation serves as a quick overview of the conformal coating material and processes currently used in the industry. The field
More informationHTSC SiCap 400µm - NiAu finishing - Assembly by soldering
General description This document describes the attachment techniques recommended by Murata* for their HTSC silicon capacitors on the customer substrates. This document is non-exhaustive. Customers with
More informationROOM TEMPERATURE FAST FLOW REWORKABLE UNDERFILL FOR LGA
As originally published in the SMTA Proceedings ROOM TEMPERATURE FAST FLOW REWORKABLE UNDERFILL FOR LGA Mary Liu, Ph.D., and Wusheng Yin, Ph.D. YINCAE Advanced Materials, LLC Albany, NY, USA wyin@yincae.com
More informationSustainable World. Systems and Information. Bob Pfahl
Towards a Sustainable World through Electronic Systems and Information Technology Bob Pfahl We are living in a Material World US 4 people 40 hour work week 1600 square feet $22,000 per capita 11,000 possessions
More informationS/C Packaging Assembly Challenges Using Organic Substrate Technology
S/C Packaging Assembly Challenges Using Organic Substrate Technology Presented by Bernd Appelt ASE Group Nov. 17, 2009 Overview The Packaging Challenge Chip Substrate Interactions Stiffeners for FC-BGA
More informationCall for Prioritization & Participation In MEMS inemi Initiatives. Oct 26, 2011
Call for Prioritization & Participation In MEMS inemi Initiatives Oct 26, 2011 Agenda Objectives from this Webinar inemi Overview (for non workshop attendees) Seven Potential MEMS Collaboration Initiatives
More informationWS488 WATER SOLUBLE SOLDER PASTE
WS488 WATER SOLUBLE SOLDER PASTE FEATURES Excellent Wetting Extended Cleaning Window Superior Slump Resistance 8 Hour+ Stencil Life Wash With Water Alone Low Foaming DESCRIPTION AIM s WS488 water soluble
More information2011 inemi Roadmap Highlights. Chuck Richardson, inemi October 18, 2011 SMTAI 2011 Fort Worth Convention Center Fort Worth, TX
2011 inemi Roadmap Highlights Chuck Richardson, inemi October 18, 2011 SMTAI 2011 Fort Worth Convention Center Fort Worth, TX Index inemi Introduction Roadmap Process Overview Situation Analysis Strategic
More informationinemi Statement of Work (SOW) inemi Packaging TIG Impact of Low CTE Mold Compound on 2nd Level Solder Joint Reliability Phase 1 & Phase 2
inemi Statement of Work (SOW) inemi Packaging TIG Impact of Low CTE Mold Compound on 2nd Level Solder Joint Reliability Phase 1 & Phase 2 Version: 4.1 Date: March 26, 2014 Project Leader: Bart Vandevelde
More informationTIN-BASED LEAD-FREE SOLDER BUMPS FOR FLIP-CHIP APPLICATION. S. Yaakup, H. S. Zakaria, M. A. Hashim and A. Isnin
TIN-BASED LEAD-FREE SOLDER BUMPS FOR FLIP-CHIP APPLICATION S. Yaakup, H. S. Zakaria, M. A. Hashim and A. Isnin Advanced Materials Research Centre (AMREC), SIRIM Berhad, Lot 34, Jalan Hi-Tech 2/3, Kulim
More informationThe Development of a Novel Stacked Package: Package in Package
The Development of a Novel Stacked Package: Package in Package Abstract Stacked die Chip Scale Packages (CSPs) or Fine-pitch BGAs (FBGAs) have been readily adopted and integrated in many handheld products,
More informationQualification and Performance Specification for High Frequency (Microwave) Printed Boards
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards Developed by the High Speed/High Frequency Board Performance Subcommittee (D-22) of the High Speed/High Frequency
More information2004 Roadmap: Environmentally Conscious Electronics. Mark Newton, Dell Joe Johnson, Microsoft Robert C. Pfahl, Jr., inemi
2004 Roadmap: Environmentally Conscious Electronics 0 Mark Newton, Dell Joe Johnson, Microsoft Robert C. Pfahl, Jr., inemi Topics to be Discussed International Electronics Manufacturing Initiative (inemi)
More information1.3.2 Nanotechnology Nanoporosity Deposition Methods Dissolution Methods
Table of Contents 1. Metal Finishing 1 1.1 Introduction 1 1.1.1 Description of Industrial Activity Covered 1 1.1.2 Environmental and Legislative Background 3 1.1.3 Emerging Technology or Research? 4 1.2
More informationAlternative Approaches to 3-Dimensional Packaging and Interconnection
Alternative Approaches to 3-Dimensional Packaging and Interconnection Joseph Fjelstad SiliconPipe, Inc. www.sipipe.com IC Packaging a Technology in Transition In the past, IC packaging has been considered
More informationWS-575-C-RT. Halogen-Free Ball-Attach Flux PRODUCT DATA SHEET
-RT Halogen-Free Ball-Attach Introduction Indium Corporation s Ball-Attach -RT allows customers to use a completely halogen-free (NIA = no intentionally added halogens) single-step ball-attach process
More informationKeeping industry reliability test protocols current with rapidly changing markets. Bob Pfahl APEX February 23, 2007
Keeping industry reliability test protocols current with rapidly changing markets Bob Pfahl APEX February 23, 2007 Situation Analysis: 2007 inemi Roadmap Growth of Automotive Electronics Market Convergence
More informationHBLED packaging is becoming one of the new, high
Ag plating in HBLED packaging improves reflectivity and lowers costs JONATHAN HARRIS, President, CMC Laboratories, Inc., Tempe, AZ Various types of Ag plating technology along with the advantages and limitations
More informationFreescale Semiconductor Tape Ball Grid Array (TBGA) Overview
Freescale Semiconductor Tape Ball Grid Array (TBGA) Overview Revision 0 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the
More informationMurata Silicon Capacitors - LPSC 100µm NiAu finishing Assembly by Soldering. Table of Contents
Table of Contents Table of Contents...1 Introduction...2 Handling precautions and storage...2 Pad opening...3 Process Flow...5 Solder print material and stencil printing recommendations...6 Pick and Place...7
More informationPlasma for Underfill Process in Flip Chip Packaging
Plasma for Underfill Process in Flip Chip Packaging Jack Zhao and James D. Getty Nordson MARCH 2470-A Bates Avenue Concord, California 94520-1294 USA Published by Nordson MARCH www.nordsonmarch.com 2015
More informationSample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
As originally published in the IPC APEX EXPO Conference Proceedings. Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys Mehran Maalekian Karl Seelig, V.P. Technology Timothy
More informationBasic Project Information. Background. Version: 2.0 Date: June 29, Project Leader: Bart Vandevelde (imec) inemi Staff: Grace O Malley
inemi Statement of Work (SOW) Packaging TIG Impact of Low CTE Mold Compound on 2nd Level Solder Joint Reliability Project, Phase 2 (Experimental build and testing) Version: 2.0 Date: June 29, 2015 Project
More informationinemi Lead-Free Alloy Characterization Program Update: Thermal Cycle Testing and Alloy Test Standards Development
inemi Lead-Free Alloy Characterization Program Update: Thermal Cycle Testing and Alloy Test Standards Development Chair: Greg Henshall, HP Co-Chair: Stephen Tisdale, Intel October 21, 2011 Authors Julie
More informationXTSC SiCap 400µm - NiAu finishing - Assembly by soldering
General description This document describes the attachment techniques recommended by Murata* for their XTSC silicon capacitors on the customer substrates. This document is non-exhaustive. Customers with
More informationLead-free soldering materials, some considerations. Presented at FHI conference, Gorinchem November 2005
Lead-free soldering materials, some considerations Presented at FHI conference, Gorinchem November 2005 Outline Present situation in Europe towards RoHS Industry status Lead-free soldering materials Getting
More informationUnique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY
Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY Frank Toth, and Gary F. Shade; Intel Corporation, Hillsboro, OR, USA {francis.toth.jr@intel.com, (503)-696-1546}
More informationRecent Trends of Package Warpage and Measurement Metrologies (inemi Warpage Characterization Project Phase 3)
Recent Trends of Package Warpage and Measurement Metrologies (inemi Warpage Characterization Project Phase 3) Wei Keat Loh 1, Ron Kulterman 2, Haley Fu 3, Masahiro Tsuriya 3 1 Intel Technology Sdn. Bhd.
More informationECE414/514 Electronics Packaging Spring 2012 Lecture 2. Lecture Objectives
ECE414/514 Electronics Packaging Lecture 2 James E. Morris Dept of Electrical & Computer Engineering Portland State University Lecture Objectives Introduce first-level interconnect technologies: wire-bond,
More informationReliability of RoHS-Compliant 2D and 3D 1С Interconnects
Reliability of RoHS-Compliant 2D and 3D 1С Interconnects John H. Lau, Ph.D. New York Chicago San Francisco Lisbon London Madrid Mexico City Milan New Delhi San Juan Seoul Singapore Sydney Toronto Foreword
More informationPRINTED CIRCUITS HANDBOOK
PRINTED CIRCUITS HANDBOOK Clyde F. Coombs, Jr. Sixth Edition Me Graw New York Chicago San Francisco Lisbon London Madrid Mexico City Milan New Delhi San Juan Seoul Singapore Sydney Toronto CONTENTS List
More informationA Novel Material for High Layer Count and High Reliability Printed Circuit Boards
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards Jie Wan, Junqi Tang, Xianping Zeng Shengyi Technology Co., Ltd. No.5 Western Industry Road, North Industry District SSL
More informationcontaminated, or if the location of the assembly house is well above sea level.
VAPOR PHASE REFLOW S EFFECT ON SOLDER PASTE RESIDUE SURFACE INSULATION RESISTANCE Karen Tellefsen. Mitch Holtzer, Corne Hoppenbrouwers Alpha Assembly Solutions South Plainfield, NJ, USA Roald Gontrum SmartTech
More informationBridging Supply Chain Gap for Exempt High-Reliability OEM s
Bridging Supply Chain Gap for Exempt High-Reliability OEM s Hal Rotchadl hrotchadl@premiers2.com www.premiers2.com Premier Semiconductor Services Tempe, AZ RoHS exempt high reliability OEMs breathed a
More informationPrime Technology Inc.(PTI), Engineering Capability
Technology, Knowhow, Services & Market Segments With large-scale resources and the broadest capital in the Electronics Manufacturing Services (EMS) industry, Prime Technology (PTI) provides services from
More information