Stack-up and routing optimization by understanding micro-scale PCB effects

Size: px
Start display at page:

Download "Stack-up and routing optimization by understanding micro-scale PCB effects"

Transcription

1 Stack-up and routing optimization by understanding micro-scale PCB effects Authors: G. Romo, CST of America Chudy Nwachukwu, Isola Group Reydezel Torres-Torres, INAOE Seung-Won Baek, CST of America Martin Schauer, CST of America 1

2 Outline Introduction Fiber Weave Effects Analytical Model Simulations and Measurements Summary and Conclusions 2

3 Introduction As communication frequencies continue to increase, new (microscopic) effects arise We present an experimental, numerical, and analytical investigation of the role that Fiber weave effects play in high speed interconnects 3

4 Fiber Weave Effect FW effects originate from the inhomogeneous properties of PCB laminates 4

5 Laminate Properties Electrical properties of prepreg material Electrical properties of cured laminate material 5

6 Fiber Weave Effects Fiber weave used in this work 1080 Warp & Weft Count: 60 x 47 Sparse material (inhomogeneous) Thickness: /0.065mm 2116 Warp & Weft Count: 60 x 58 Dense material (homogeneous) Thickness: /0.097mm 6

7 Fiber Weave Effects (FWE) Effects due to location of trace w.r.t. fiber weave bundles High Er; Low Zo Low Er; High Zo Effects due to periodic loadingof trace by fiber weave bundles Resonance Ф 7

8 FWE: Resonance For incident broadband electromagnetic radiation on a periodic structure: λ' λ d The wavelength satisfying the in-phase constructive interference will be reflected and the rest transmitted. Resonance d = λ' 2 λ' Reflected λ λ' Transmitted Size or resonance depends on materialcontrastand length of propagation λ 8

9 Special cases: Ф=0, 45, 90 FWE: Periodic loading For the above angles: f c d ~ 20mils ~ f ~ 150GHz 2d ε r 9

10 Arbitrary Angle: Ф=0 > 45 FWE: Periodic loading Challenge is to find/define the spatial period Separate the Weft and Warp loading Warp loading is in pitch scale high frequencies neglected Weft loading occurs in a larger scale lower frequencies key role Weft spatial period is obtained from trigonometric expressions: c 1 [ ] fres = 2 weft period = pitch tan( Φ) 2 ε eff pitch [ tan( Φ) ] 10

11 Resonance Frequency and Spatial Period Angles Ф<20 are potentially the most critical Large angles Ф>5 More periods per length strong resonances 11

12 FWE: Simulation results 3D parameterized model created in CST MICROWAVE STUDIO

13 FWE: Simulation results Position- Simulation of 1080 laminate at Ф=0, for different trace positions Positions 1 and 9: Trace over bundles Predicted impedance variations is very small (~1Ω) 13

14 FWE: Simulation results Position- Simulation of 1080 laminate at Ф=0, for different trace positions Positions 1 and 9: Trace over bundles Predicted Effective relative permittivity is also small (~0.13) 14

15 FWE: Simulation results Angle- Simulation of 1080 laminate at Ф=0, Ф=7, Ф=10 andф=15, 7in Insertion Loss Return Loss Excellent agreement with analytical equation Resonance strength is also consistent: the larger the angle more periods per length Stronger resonance Angle Equation 2 Simulated (GHz) [Deg] (GHz)

16 FWE: Simulation results Angle- Simulation of 2116 laminate at Ф=7, Ф=10 andф=15, 4in Insertion Loss Return Loss Excellent agreement with analytical equation Resonance strength is weaker compared with that from 1080 due to the more homogeneous laminate 16

17 Experimental Verification: Board Stack-Up I-Tera, 1080 and 2116 weave based resin-system 50 ohm singleended microstrip configuration 17

18 Experimental Verification: Test Structures 2 sets of 3-in long microstrips. 2 sets of 4-in and 8- in microstrips with solder mask. 2 sets of 4-in and 8- in long microstrips without solder mask. Same number of sets of striplines (work in progess) 18

19 Measurement Setup Two-port S-parameter measurements were performed to the fabricated transmission lines Board Probe-2 Camera view Probe-1 VNA 19

20 VNA Calibration An off-board calibration was applied to correct the measurement system from systematic errors Probe-1 Probe-2 For that matter, the line-reflect-match (LRM) algorithm and an impedance standard substrate (ISS) were used Calibration substrate (ISS) 20

21 Fiber Weave Effect: Position The characteristic impedance was obtained for lines at different locations on the board 3 in Position 1 Position 7 Re(Z Z c ) (Ω) Top (1080) Bottom (2116) Position (#) The observed changes in Zc are within the tolerances typically specified by the PCB shop (±5%) 21

22 Fiber Weave Effect: Angle (Top) The same experiment was carried out but now varying Φ Re(Z Z c ) (Ω) Φ = 0 Φ = 7 Φ = 10 Φ = 15 Top (1080) f (GHz) Relatively small changes are observed in Zc 22

23 Fiber Weave Effect: Angle (Bottom) Similar variations are observed on the bottom side of the board ) (Ω) Re(Z c ) Φ = 0 Φ = 7 Φ = Φ = 15 Bottom (2116) f (GHz) Zc remains relatively low sensitive to changes in Φ 23

24 Fiber Weave Effect: Angle, ε Within the measured frequency range, the maximum variation of the permittivity is less than 2% effective relativ ve permittivity 2.9 Φ = 0 Φ = Φ = 10 Bottom (2116) 2.7 Φ = Top (1080) f (GHz) effective tive permittivity relat GHz Top (1080) Bottom (2116) 7 10 Φ ( ) 15 The small variations of Zc and Eeff are consistent with the predicted simulation results 24

25 Fiber Weave Effect: Angle (1080) Insertion and Return Loss, 4-in traces Insertion Loss Return Loss Excellent agreement with analytical equation Strength of resonance increases with angle Angle [Deg] Equation 2 (GHz) Measured (GHz)

26 Fiber Weave Effect: Angle (1080) Insertion and Return Loss, 8-in traces Insertion Loss Return Loss Excellent agreement with analytical equation Resonances spread over frequency due to fiber weave imperfections 26

27 Fiber Weave Effect: Angle (2116) Insertion and Return Loss, 4- and 8-in traces Insertion Loss Return Loss (8-in) No resonances were detected from measurement This is due to the highly homogeneous material 27

28 α (Np/m) Fiber Weave Effect: Angle, attenuation The effect of the resonances clearly impacts the propagation characteristics Top (1080) Φ = 0 Φ = 7 Φ = 10 Φ = f (GHz) α (Np/m) 8 Top (1080) Bottom (2116) 6 Φ = f (GHz) This is more accentuated on the 1080 side of the board due to the sparser weave This, as well as other discussed results, points out that the more accentuated fiber weave effect is that associated with the resonances 28

29 Conclusions Most important FWE is that associated with resonances An analytical model, verified by modeling and measurements was proposed Small angles (5-15 ) are potentially the most critical to signal integrity at bandwidths below 50 GHz The use of homogenous spread fiber weave has been shown to mitigate these effects 29

Nine Dot Connects. DFM Stackup Considerations Part 4 Webinar August The following questions were asked during the webinar.

Nine Dot Connects. DFM Stackup Considerations Part 4 Webinar August The following questions were asked during the webinar. DFM Stackup Considerations Part 4 Webinar August 2015 The following questions were asked during the webinar. Question / Comment Aren't the inner signal layer traces classified as embedded micro-strips

More information

Stackup Planning, Part 1

Stackup Planning, Part 1 by Barry Olney coulmn BEYOND DESIGN Stackup Planning, Part 1 The PCB substrate that physically supports the components, links them together via highspeed interconnects and also distributes highcurrent

More information

SITV s Stack-ups and Loss. Add a subtitle

SITV s Stack-ups and Loss. Add a subtitle SITV s Stack-ups and Loss Add a subtitle SITV Stack-ups General Signal Integrity TV s are often used to characterize material performance There are a variety of TV s that use differing approaches and measurement

More information

PARAMETRIC STUDY OF FLAT SANDWICH MULTILAYER RADOME

PARAMETRIC STUDY OF FLAT SANDWICH MULTILAYER RADOME Progress In Electromagnetics Research, PIER 66, 253 265, 2006 PARAMETRIC STUDY OF FLAT SANDWICH MULTILAYER RADOME A. Kedar and U. K. Revankar Electronics & Radar Development Establishment C.V. Raman Nagar,

More information

Rectangular Junction Ferrite Component in Millimeter Waves

Rectangular Junction Ferrite Component in Millimeter Waves PIERS ONLINE, VOL. 4, NO. 5, 2008 526 Rectangular Junction Ferrite Component in Millimeter Waves D. Vincent Saint-Etienne University, France Abstract The design of non reciprocal components still remains

More information

Building HDI Structures using Thin Films and Low Temperature Sintering Paste

Building HDI Structures using Thin Films and Low Temperature Sintering Paste Building HDI Structures using Thin Films and Low Temperature Sintering Paste Catherine Shearer, James Haley and Chris Hunrath Ormet Circuits Inc. - Integral Technology California, USA chunrath@integral-hdi.com

More information

A Study of Microwave Behavior of a Thin-Print Gold Ink

A Study of Microwave Behavior of a Thin-Print Gold Ink A Study of Microwave Behavior of a Thin-Print Gold Ink By David J. Nabatian KOARTAN Microelectronic Interconnect Materials Mountain Ridge Business Park, Unit B2, 248 Sussex Tpk., Randolph, NJ 07869 Phone:

More information

Advanced Material Selection IPC Designers Council. Michael J. Gay February 8 th 2017

Advanced Material Selection IPC Designers Council. Michael J. Gay February 8 th 2017 Advanced Material Selection IPC Designers Council Michael J. Gay February 8 th 2017 Michael.gay@isola-group.com Laminate Material Components Resin, Glass, Copper Resin Glass Copper Prepreg or B-Stage B-Stage

More information

DESIGNCON High Speed Signal Path Losses as Related to PCB Laminate Type and Copper Roughness

DESIGNCON High Speed Signal Path Losses as Related to PCB Laminate Type and Copper Roughness DESIGNCON 2013 High Speed Signal Path Losses as Related to PCB Laminate Type and Copper Roughness Lee Ritchey, Speeding Edge Leeritchey@speedingedge.com John Zasio, Speeding Edge Zasio@pacbell.com Rich

More information

Fine Pitch P4 Probe Cards

Fine Pitch P4 Probe Cards Fine Pitch P4 Probe Cards Photolithographic Pattern Plating Process June 1998 By Toshi Ishii, Hide Yoshida Contents What is a P4 probe card? Specification Some test results Tip cleaning RF performance

More information

ALTIUMLIVE 2018: NAVIGATING THE COMPLEXITIES OF PCB MATERIAL SELECTION

ALTIUMLIVE 2018: NAVIGATING THE COMPLEXITIES OF PCB MATERIAL SELECTION ALTIUMLIVE 2018: NAVIGATING THE COMPLEXITIES OF PCB MATERIAL SELECTION Chris Hunrath Insulectro, VP of Technology San Diego October 4 Outline 1 PCB Material Overview 2 What is the Dielectric Constant of

More information

How Printed Circuit Boards are Made. Todd Henninger Field Applications Engineer Midwest Region

How Printed Circuit Boards are Made. Todd Henninger Field Applications Engineer Midwest Region PCB 101: How Printed Circuit Boards are Made Todd Henninger Field Applications Engineer Midwest Region Tooling PRE-PRODUCTION ENGINEERING (Tooling) Design Data Package CAD Data (ODB++ or Gerber 274x format)

More information

How to select PCB materials for highfrequency

How to select PCB materials for highfrequency How to select PCB materials for highfrequency apps Find out how to simplify that choice when striving for the best tradeoff between ease of fabrication and best electrical performance. By John Coonrod

More information

A Study of RF Absorber for Anechoic Chambers Used in the Frequency Range for Power Line Communication System

A Study of RF Absorber for Anechoic Chambers Used in the Frequency Range for Power Line Communication System 1014 Progress In Electromagnetics Research Symposium 2006, Cambridge, USA, March 26-29 A Study of RF Absorber for Anechoic Chambers Used in the Frequency Range for Power Line Communication System K. Shimada

More information

Taconic Advanced Dielectric Division. Thomas McCarthy. Sean Reynolds. Jon Skelly

Taconic Advanced Dielectric Division. Thomas McCarthy. Sean Reynolds. Jon Skelly Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures Taconic Advanced Dielectric Division Thomas McCarthy Sean Reynolds Jon Skelly Multilayer/Stripline Design

More information

14. Designing with FineLine BGA Packages

14. Designing with FineLine BGA Packages 14. Designing with FineLine BGA Packages S51014-1.0 Chapter 14, Designing with FineLine BGA Packages, replaces AN 114: Designing with FineLine BGA Packages. Introduction As programmable logic devices (PLDs)

More information

Mobile Device Passive Integration from Wafer Process

Mobile Device Passive Integration from Wafer Process Mobile Device Passive Integration from Wafer Process Kai Liu, YongTaek Lee, HyunTai Kim, and MaPhooPwint Hlaing STATS ChipPAC, Inc. 1711 West Greentree, Suite 117, Tempe, Arizona 85284, USA Tel: 48-222-17

More information

Kuseong-dong, Yuseong-gu, Daejeon, , Korea

Kuseong-dong, Yuseong-gu, Daejeon, , Korea Citation & Copyright (to be inserted by the publisher ) Measurement of material properties of composites under high temperature using fiber Bragg grating sensors D. H. Kang 1, S. W. Park 1, S. H. Kim 1,

More information

FABRICATION OF NONRECIPROCAL MICROWAVE COMPONENTS USING THICK FILM FERRIMAGNETIC PASTES

FABRICATION OF NONRECIPROCAL MICROWAVE COMPONENTS USING THICK FILM FERRIMAGNETIC PASTES Electrocomponent Science and Technology, 1981, Vol. 8, pp. 111-114 0305-3091/81/0802-0111 $06.50/0 (C) 1981 Gordon and Breach Science Publishers, Inc. Printed in Great Britain FABRICATION OF NONRECIPROCAL

More information

EMBG Resonators Based on Carbon Nanotubes for DNA Detection

EMBG Resonators Based on Carbon Nanotubes for DNA Detection ROMANIAN JOURNAL OF INFORMATION SCIENCE AND TECHNOLOGY Volume 14, Number 3, 2011, 212 221 EMBG Resonators Based on Carbon Nanotubes for DNA Detection Alina CISMARU 1, Marius VOICU 1, Antonio RADOI 1, Adrian

More information

Dispersion Analysis of Finite Dielectric Coplanar Waveguide (FCPW) on Alumina and FR4 Substrate

Dispersion Analysis of Finite Dielectric Coplanar Waveguide (FCPW) on Alumina and FR4 Substrate Dispersion Analysis of Finite Dielectric Coplanar Waveguide (FCPW) on Alumina and FR4 Substrate Shanu Sharma #1, Alok Kumar Rastogi (FIETE) # 1, Gazala Parvin #1 #1 Institute for Excellence in Higher Education,

More information

Artificial Neural Network Model for Soil Moisture Estimation at Microwave Frequency

Artificial Neural Network Model for Soil Moisture Estimation at Microwave Frequency Progress In Electromagnetics Research M, Vol. 43, 175 181, 2015 Artificial Neural Network Model for Soil Moisture Estimation at Microwave Frequency RamanRajeshMohan 1, *, Shanta Mridula 1, and Pezholil

More information

CURE PROCESS MONITORING OF CURVED COMPOSITE WITH INTERLAMINAR TOUGHENED LAYERS

CURE PROCESS MONITORING OF CURVED COMPOSITE WITH INTERLAMINAR TOUGHENED LAYERS CURE PROCESS MONITORING OF CURVED COMPOSITE WITH INTERLAMINAR TOUGHENED LAYERS The University of Tokyo, Graduate School of Frontier Science, 5-1-5, Kashiwanoha, Kashiwashi, Chiba 277-8561, Japan, sawaguchi@smart.k.u-tokyo.ac.jp.

More information

Conductive Product Information Sheet.

Conductive Product Information Sheet. RF SOLUTIONS LTD. Unit 5 & 6, Wonastow Ind Est West, Wonastow Road, Monmouth, Monmouthshire. NP25 3JU Tel: 01600 719464 Fax: 01600 716963 email: info@finishingsolution.co.uk Website: www.finishingsolution.co.uk

More information

Designing With High-Density BGA Packages for Altera Devices. Introduction. Overview of BGA Packages

Designing With High-Density BGA Packages for Altera Devices. Introduction. Overview of BGA Packages Designing With High-Density BGA Packages for Altera Devices December 2007, ver. 5.1 Application Note 114 Introduction As programmable logic devices (PLDs) increase in density and I/O pins, the demand for

More information

Sherlock 4.0 and Printed Circuit Boards

Sherlock 4.0 and Printed Circuit Boards Sherlock 4.0 and Printed Circuit Boards DfR Solutions January 22, 2015 Presented by: Dr. Nathan Blattau Senior Vice President 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 301-474-0607 www.dfrsolutions.com

More information

3D Packaging- Synthetic Quartz Substrate and Interposers for High Frequency Applications. Vern Stygar #1, Tim Mobley* 2 # Asahi Glass Corporation

3D Packaging- Synthetic Quartz Substrate and Interposers for High Frequency Applications. Vern Stygar #1, Tim Mobley* 2 # Asahi Glass Corporation 3D Packaging- Synthetic Quartz Substrate and Interposers for High Frequency Applications Vern Stygar #1, Tim Mobley* 2 # Asahi Glass Corporation 4375 Northwest 235 th Avenue, Hillsboro OR USA 97124 1 vstygar@agem.com

More information

Chapter 14. Designing with FineLine BGA Packages

Chapter 14. Designing with FineLine BGA Packages Chapter 14. Designing with FineLine BGA Packages S53009-1.3 Chapter 14, Designing with FineLine BGA Packages, replaces AN 114: Designing with FineLine BGA Packages. Introduction As programmable logic devices

More information

B-IS620i/3. IS620i. Base material. for high-frequency. applications CAF. Enhanced

B-IS620i/3. IS620i. Base material. for high-frequency. applications CAF. Enhanced J B-/3 Base material for high-frequency applications CAF Enhanced Low loss base material with a stable dielectric behaviour over frequency is a base material for high frequency applications, especially

More information

Manufacturing Capacity

Manufacturing Capacity Capability List Manufacturing Capacity QTA & Prototype Layer : 1L ~32 L Impedance Board Ball Grid Array ( BGA ) Blind/ Buried Via Micro Via ( Laser Drilling) Flex /Rigid Flexible PCB Series Orders Layer

More information

ADVANCED TEXTILES WITH ENHANCED ELECTRICAL CONDUCTIVITY

ADVANCED TEXTILES WITH ENHANCED ELECTRICAL CONDUCTIVITY ADVANCED TEXTILES WITH ENHANCED ELECTRICAL CONDUCTIVITY Veronika Tunáková, Jiří Militký Faculty of Textile Engineering, Dept. of Material Engineering, Studentská 2, Technical University of Liberec 461

More information

Temperature stable design of Microwave Circulators using HFSS and Maxwell. Dr. Thomas Lingel

Temperature stable design of Microwave Circulators using HFSS and Maxwell. Dr. Thomas Lingel Lingel, 2003 Temperature stable design of Microwave Circulators using HFSS and Maxwell Dr. Thomas Lingel Outline Motivation Principle of Operation of Circulators Modeling of the RF behavior using HFSS

More information

FABRICATING HIGH CURRENT, HEAVY COPPER PCBS

FABRICATING HIGH CURRENT, HEAVY COPPER PCBS Royal Circuit Solutions 21 Hamilton Ct, Hollister, CA 95023 (831) 636-7728 www.royalcircuits.com FABRICATING HIGH CURRENT, HEAVY COPPER PCBS INTRODUCTION All printed circuit boards (PCBs) carry current

More information

Company Overview Markets Products- Capabilities

Company Overview Markets Products- Capabilities Company Overview Markets Products- Capabilities A Simpler way for PCB production. www.purepcb.co.uk What can Pure do for you? From 1 off Circuit upward, No MOQ/MOV High Mix Production Focus. Fast Turn

More information

QUANTIFICATION OF PROCESSING PARAMETERS FOR WIND TURBINE BLADES

QUANTIFICATION OF PROCESSING PARAMETERS FOR WIND TURBINE BLADES AIAA-2003-0694 QUANTIFICATION OF PROCESSING PARAMETERS FOR WIND TURBINE BLADES Douglas Cairns, John Mandell, and Daniel Samborsky Montana State University Bozeman, Montana, 59717 ABSTRACT All materials

More information

C A P A B I L I T I E S S U M M A R Y Assured Performance

C A P A B I L I T I E S S U M M A R Y Assured Performance C A P A B I L I T I E S S U M M A R Y Assured Performance CAPABILITIES SUMMARY Lexatys, LLC 10253 Stone Creek Drive #1 Laurel, DE 19956-4700 P: 302.715.5029 Ext. 1001 F: 302.309.9173 Email: sales@lexatys.com

More information

PEC (Printed Electronic Circuit) process for LED interconnection

PEC (Printed Electronic Circuit) process for LED interconnection PEC (Printed Electronic Circuit) process for LED interconnection Higher wattage LED s/ power components or their placement in higher densities, requires a larger dissipation of heat in a more effective

More information

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards Qualification and Performance Specification for High Frequency (Microwave) Printed Boards Developed by the High Speed/High Frequency Board Performance Subcommittee (D-22) of the High Speed/High Frequency

More information

Nanoscale Plasmonic Interferometers for Multi-Spectral, High-Throughput Biochemical Sensing

Nanoscale Plasmonic Interferometers for Multi-Spectral, High-Throughput Biochemical Sensing Supporting Online Information for Nanoscale Plasmonic Interferometers for Multi-Spectral, High-Throughput Biochemical Sensing Jing Feng (a), Vince S. Siu (a), Alec Roelke, Vihang Mehta, Steve Y. Rhieu,

More information

Conductive Paste-Based Interconnection Technology for High Performance Probe Card

Conductive Paste-Based Interconnection Technology for High Performance Probe Card Conductive Paste-Based Interconnection Technology for High Performance Probe Card Sang-il Kwon Eddy Kang TSE Co., Ltd. Overview Introduction of TABP Technology Key Technology of Core to Core Interconnection

More information

Taconic Advanced Dielectric Division. Thomas McCarthy. Sean Reynolds. Jon Skelly

Taconic Advanced Dielectric Division. Thomas McCarthy. Sean Reynolds. Jon Skelly Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures Taconic Advanced Dielectric Division Thomas McCarthy Sean Reynolds Jon Skelly Multilayer/Stripline Design

More information

Effect of various parameters on electromagnetic shielding effectiveness of textile fabrics

Effect of various parameters on electromagnetic shielding effectiveness of textile fabrics Indian Journal of Fibre & Textile Research Vol. 34, June 2009, pp. 144-148 Effect of various parameters on electromagnetic shielding effectiveness of textile fabrics A Das a, V K Kothari, A Kothari & A

More information

EFFECT OF AMORPHOUS, NONMAGNETIC BARRIER LAYER ON THE PERFORMANCE OF A MULTISECTION WILKINSON BROADBAND POWER DIVIDER

EFFECT OF AMORPHOUS, NONMAGNETIC BARRIER LAYER ON THE PERFORMANCE OF A MULTISECTION WILKINSON BROADBAND POWER DIVIDER Progress In Electromagnetics Research Letters, Vol. 30, 145 152, 2012 EFFECT OF AMORPHOUS, NONMAGNETIC BARRIER LAYER ON THE PERFORMANCE OF A MULTISECTION WILKINSON BROADBAND POWER DIVIDER R. K. Sharma

More information

: GA-170-LE/ GA-170B-LE

: GA-170-LE/ GA-170B-LE Grace Electron Corp. Processing Guide Phenolic Cured Material Laminate/ Prepreg : GA-170-LE/ GA-170B-LE Grace Electron Corp. Tech. & QA Dept. Revision 2010/3/30 Page 1 of 7 @2010Grace Group Grace Declaration:

More information

Characterisation of Fe-Ni amorphous thin films for possible magnetostrictive sensor applications

Characterisation of Fe-Ni amorphous thin films for possible magnetostrictive sensor applications Characterisation of Fe-Ni amorphous thin films for possible magnetostrictive sensor applications Contents 9.1 Introduction 9.2 Experiment 9.3 Results and Discussions 9.4 Conclusion 9.1 Introduction Magnetostrictive

More information

BROADBAND RFCMF 1220(0508) Series RoHS Compliance MULTILAYER COMMON MODE FILTER. For USB 2.0 / IEEE 1394 Application

BROADBAND RFCMF 1220(0508) Series RoHS Compliance MULTILAYER COMMON MODE FILTER. For USB 2.0 / IEEE 1394 Application BROADBAND RFCMF 1220(0508) Series RoHS Compliance MULTILAYER COMMON MODE FILTER Halogens Free Product For USB 2.0 / IEEE 1394 Application P/N: RFCMF1220100M4T *Contents in this sheet are subject to change

More information

Modeling Printed Circuit Boards with Sherlock 3.2

Modeling Printed Circuit Boards with Sherlock 3.2 Modeling Printed Circuit Boards with Sherlock 3.2 DfR Solutions September 23, 2014 Presented by: Dr. Nathan Blattau Senior Vice President 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 301-474-0607

More information

Extraordinary grating-coupled microwave transmission through a subwavelength annular aperture

Extraordinary grating-coupled microwave transmission through a subwavelength annular aperture Extraordinary grating-coupled microwave transmission through a subwavelength annular aperture Humeyra Caglayan, Irfan Bulu, and Ekmel Ozbay Department of Physics, Bilkent University, Bilkent, 06800 Ankara,

More information

require the investigation of Many qualitative methods but few quantitative methods and even fewer real-time measurements!

require the investigation of Many qualitative methods but few quantitative methods and even fewer real-time measurements! Biosensors, biocompatibilization of materials, and surface science require the investigation of the sorption processes and the 3-D organization of proteins at solid/liquid interface. Many qualitative methods

More information

3M Electromagnetic Compatible Products

3M Electromagnetic Compatible Products 3M Electromagnetic Compatible Products Selection Guide Revision E 3 Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant

More information

Lead Free, Zero Shrink, Substrate Bonded LTCC System

Lead Free, Zero Shrink, Substrate Bonded LTCC System Lead Free, Zero Shrink, Substrate Bonded LTCC System R.L. Wahlers, A.H. Feingold and M. Heinz Electro-Science Laboratories, 416 E. Church Rd., King of Prussia, PA, 19406 Abstract Previous papers have reported

More information

Plasmonics using Metal Nanoparticles. Tammy K. Lee and Parama Pal ECE 580 Nano-Electro-Opto-Bio

Plasmonics using Metal Nanoparticles. Tammy K. Lee and Parama Pal ECE 580 Nano-Electro-Opto-Bio Plasmonics using Metal Nanoparticles Tammy K. Lee and Parama Pal ECE 580 Nano-Electro-Opto-Bio April 1, 2007 Motivation Why study plasmonics? Miniaturization of optics and photonics to subwavelength scales

More information

Surface Plasmon Effects in Nano-Optics. Greg Gbur Department of Physics and Optical Science, UNC Charlotte, Charlotte, North Carolina 28227

Surface Plasmon Effects in Nano-Optics. Greg Gbur Department of Physics and Optical Science, UNC Charlotte, Charlotte, North Carolina 28227 Surface Plasmon Effects in Nano-Optics Greg Gbur Department of Physics and Optical Science, UNC Charlotte, Charlotte, North Carolina 28227 Shanghai, Jan 2007 Summary Introduction: What is a surface plasmon?

More information

Mastering the Tolerances Required by New PCB Designs. Brad Hammack Multek Doumen, China

Mastering the Tolerances Required by New PCB Designs. Brad Hammack Multek Doumen, China Mastering the Tolerances Required by New PCB Designs Brad Hammack Multek Doumen, China Abstract The packaging industry is driving the Printed Circuit Board (PCB) technology level in the direction of semiconductor

More information

: GA-HF-14/ GA-HFB-14

: GA-HF-14/ GA-HFB-14 Grace Electron Corp. Processing Guide Halogen Free Material Laminate/ Prepreg : GA-HF-14/ GA-HFB-14 Grace Electron Corp. Tech. & QA Dept. Revision 2009/5/18 Page 1 of 7 @2009Grace Group Grace Declaration:

More information

TBF R1N THIN FILM BAND PASS FILTER. Insertion Loss 1.7dB Max. at +25

TBF R1N THIN FILM BAND PASS FILTER. Insertion Loss 1.7dB Max. at +25 TBF-1608-245-R1N THIN FILM BAND PASS FILTER 1. Feature 1-1 Thin Film Band Pass Filter 1-2 WLAN Band Application. 1-3 Ultra Low Profile 1-4 Lead Free, RoHS compliance 2. Part Number TBF 1608 245 R1N (1)

More information

IBM Bottleneck Analysis

IBM Bottleneck Analysis IBM Bottleneck Analysis by Hubert Harrer and Team Hubert Harrer IBM Deutschland Research & Development GmbH Schoenaicherstr. 220 71032 Boeblingen Germany hharrer@de.ibm.com Impact of Increased Bandwidth

More information

Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments

Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments As originally published in the IPC APEX EXPO Conference Proceedings. Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments Scott Hinaga Staff Engineer, PCB Technology Group Cisco

More information

LTCC SYSTEMS and LTCC DESIGN RULES

LTCC SYSTEMS and LTCC DESIGN RULES LTCC SYSTEMS and LTCC DESIGN RULES Low Temperature Co-fired Ceramic revision status: G page 1 of 19 Table of Contents: 1 General page 3 2 Commercial LTCC tape systems page 4 3 Design possibilities page

More information

Nanophotonics: principle and application. Khai Q. Le Lecture 11 Optical biosensors

Nanophotonics: principle and application. Khai Q. Le Lecture 11 Optical biosensors Nanophotonics: principle and application Khai Q. Le Lecture 11 Optical biosensors Outline Biosensors: Introduction Optical Biosensors Label-Free Biosensor: Ringresonator Theory Measurements: Bulk sensing

More information

Kingbright. L-36BID T-1 (3mm) Blinking LED Lamp DESCRIPTIONS PACKAGE DIMENSIONS FEATURES APPLICATIONS ATTENTION SELECTION GUIDE

Kingbright. L-36BID T-1 (3mm) Blinking LED Lamp DESCRIPTIONS PACKAGE DIMENSIONS FEATURES APPLICATIONS ATTENTION SELECTION GUIDE T-1 (3mm) Blinking LED Lamp DESCRIPTIONS The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode Electrostatic discharge and

More information

Interconnection Reliability of HDI Printed Wiring Boards

Interconnection Reliability of HDI Printed Wiring Boards Presented in the ECWC 10 Conference at IPC Printed Circuits Expo, SMEMA Council APEX and Designers Summit 05 Interconnection Reliability of HDI Printed Wiring Boards Tatsuo Suzuki Nec Toppan Circuit Solutions,

More information

IPC-2221B APPENDIX A Version 2.0 June 2018

IPC-2221B APPENDIX A Version 2.0 June 2018 IPC-2221B APPENDIX A Version 2.0 June 2018 A.1 INTRODUCTION This appendix was developed by the IPC 1-10c Test Coupon and Artwork Generation Task Group and is included in this current document revision

More information

Multilayer Silver / Dielectric Thin-Film Coated Hollow Waveguides for Sensor and Laser Power Delivery Applications

Multilayer Silver / Dielectric Thin-Film Coated Hollow Waveguides for Sensor and Laser Power Delivery Applications Multilayer Silver / Dielectric Thin-Film Coated Hollow Waveguides for Sensor and Laser Power Delivery Applications Theory, Design, and Fabrication Carlos M. Bledt a, James A. Harrington a, and Jason M.

More information

Dielectric II-VI and IV-VI Metal Chalcogenide Thin Films in Hollow Glass Waveguides (HGWs) for Infrared Spectroscopy and Laser Delivery

Dielectric II-VI and IV-VI Metal Chalcogenide Thin Films in Hollow Glass Waveguides (HGWs) for Infrared Spectroscopy and Laser Delivery Dielectric II-VI and IV-VI Metal Chalcogenide Thin Films in Hollow Glass Waveguides (HGWs) for Infrared Spectroscopy and Laser Delivery Carlos M. Bledt * a, Daniel V. Kopp a, and James A. Harrington a

More information

Kingbright. L-56BID T-1 3/4 (5mm) Blinking LED Lamp DESCRIPTIONS PACKAGE DIMENSIONS FEATURES APPLICATIONS ATTENTION SELECTION GUIDE

Kingbright. L-56BID T-1 3/4 (5mm) Blinking LED Lamp DESCRIPTIONS PACKAGE DIMENSIONS FEATURES APPLICATIONS ATTENTION SELECTION GUIDE T-1 3/4 (5mm) Blinking LED Lamp DESCRIPTIONS The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode Electrostatic discharge

More information

Virtual Prototyping of a Microwave Fin Line Power Spatial Combiner Amplifier

Virtual Prototyping of a Microwave Fin Line Power Spatial Combiner Amplifier Virtual Prototyping of a Microwave Fin Line Power Spatial Combiner Amplifier Alberto Leggieri, Franco Di Paolo, Davide Passi Department of Electronic Engineering University of Roma Tor Vergata 00133 Roma

More information

Kingbright. L-36BID T-1 (3mm) Blinking LED Lamp DESCRIPTIONS PACKAGE DIMENSIONS FEATURES APPLICATIONS ATTENTION SELECTION GUIDE

Kingbright. L-36BID T-1 (3mm) Blinking LED Lamp DESCRIPTIONS PACKAGE DIMENSIONS FEATURES APPLICATIONS ATTENTION SELECTION GUIDE T-1 (3mm) Blinking LED Lamp DESCRIPTIONS The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode Electrostatic discharge and

More information

Low-Frequency Magnetic Field Shielding Physics and Discovery for Fabric Enclosures Using Numerical Modeling

Low-Frequency Magnetic Field Shielding Physics and Discovery for Fabric Enclosures Using Numerical Modeling Low-Frequency Magnetic Field Shielding Physics and Discovery for Fabric Enclosures Using Numerical Modeling Bruce Archambeault, Andrey Radchenko, Tamar Makharashvili and James Drewniak Missouri University

More information

Archive 2017 BiTS Workshop- Image: Easyturn/iStock

Archive 2017 BiTS Workshop- Image: Easyturn/iStock Archive September 6-7, 2017 InterContinental Shanghai Pudong Hotel - Shanghai, China Archive 2017 BiTS Workshop- Image: Easyturn/iStock September 6-7, 2017 Archive COPYRIGHT NOTICE This multimedia file

More information

Basic Opamp Design and Compensation. Transistor Model Summary

Basic Opamp Design and Compensation. Transistor Model Summary Basic Opamp Design and Compensation David Johns and Ken Martin (johns@eecg.toronto.edu) (martin@eecg.toronto.edu) slide of 37 General Constants Transistor charge Boltzman constant Transistor Model Summary

More information

Performance of Ag thick film rejection filter due to ferrite thick film loading

Performance of Ag thick film rejection filter due to ferrite thick film loading Available online at www.pelagiaresearchlibrary.com Advances in Applied Science Research, 2012, 3 (1):6-11 ISSN: 0976-8610 CODEN (USA): AASRFC Performance of Ag thick film rejection filter due to ferrite

More information

Optical and Physical Characteristics of EUV Phase Shift Masks

Optical and Physical Characteristics of EUV Phase Shift Masks Optical and Physical Characteristics of EUV Phase Shift Masks Tae Geun Kim, Byung Hun Kim, Chang Young Jeong, Chung Yong Kim, SangsulLee, and Jinho Ahn Department of Materials Science and Engineering,,

More information

DuPont. Pyralux AP-PLUS ALL-POLYIMIDE THICK COPPER-CLAD LAMINATES

DuPont. Pyralux AP-PLUS ALL-POLYIMIDE THICK COPPER-CLAD LAMINATES DuPont Pyralux AP-PLUS ALL-POLYIMIDE THICK COPPER-CLAD LAMINATES An Expanded Family of High-Performance Laminates for Advanced Flexible and Rigid-Flex Printed Circuit Applications Product Description DuPont

More information

WP56BID T-1 3/4 (5mm) Blinking LED Lamp

WP56BID T-1 3/4 (5mm) Blinking LED Lamp T-1 3/4 (5mm) Blinking LED Lamp DESCRIPTIONS The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode Electrostatic discharge

More information

Microwave Exposure System for In Vitro and In Vivo Studies

Microwave Exposure System for In Vitro and In Vivo Studies Microwave Exposure System for In Vitro and In Vivo Studies C. T. Nadovich 1,2*, W.D. Jemison 2, J. A. Stoute 3, C. Spadafora 4 1 Lafayette College, Easton, PA, USA, 2 Clarkson University, Potsdam, NY,

More information

R Series : IMP SMT BOARD TO BOARD ADAPTATOR H3 REEL OF 600 TECHNICAL DATA SHEET 1 / 7 COMPONENTS MATERIALS.

R Series : IMP SMT BOARD TO BOARD ADAPTATOR H3 REEL OF 600 TECHNICAL DATA SHEET 1 / 7 COMPONENTS MATERIALS. .. pn ao TECHNICAL DATA SHEET 1 / 7 All dimensions are in mm. COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS MATERIALS BERYLLIUM COPPER BERYLLIUM COPPER BERYLLIUM COPPER POLYETHER

More information

ALTIUMLIVE 2018: FLEX: SOMETHING NEW FOR EVERYONE

ALTIUMLIVE 2018: FLEX: SOMETHING NEW FOR EVERYONE ALTIUMLIVE 2018: FLEX: SOMETHING NEW FOR EVERYONE Tara Dunn Omni PCB President San Diego October 5, 2018 Applications That Span Technology Today s Discussion: 1. Basic processing steps for both subtractive

More information

Mechanical properties of radar-absorbing structure with nickelelectroless-plated

Mechanical properties of radar-absorbing structure with nickelelectroless-plated Mechanical properties of radar-absorbing structure with nickelelectroless-plated glass fabric Min-su Jang 1, Young-Woo Nam 1, Jae-Hun Choi 1, Sang-Min Baek 2 and Chun-Gon Kim 1 1 Department of Aerospace

More information

Modeling Of A Diffraction Grating Coupled Waveguide Based Biosensor For Microfluidic Applications Yixuan Wu* 1, Mark L. Adams 1 1

Modeling Of A Diffraction Grating Coupled Waveguide Based Biosensor For Microfluidic Applications Yixuan Wu* 1, Mark L. Adams 1 1 Modeling Of A Diffraction Grating Coupled Waveguide Based Biosensor For Microfluidic Applications Yixuan Wu* 1, Mark L. Adams 1 1 Auburn University *yzw0040@auburn.edu Abstract: A diffraction grating coupled

More information

Composite Structure Engineering Safety Awareness Course

Composite Structure Engineering Safety Awareness Course Composite Structure Engineering Safety Awareness Course Emerging Technologies and Special Processes Larry Gintert Agenda Emerging Technologies and Special Processes What are the implications of M&P Control

More information

Development of System in Package

Development of System in Package Development of System in Package In recent years, there has been a demand to offer increasingly enhanced performance for a SiP that implements downsized and lower-profile chips at lower cost. This article

More information

Crack extension research of FR4 substrate embedded 90 bend optical fiber under the random vibration Wei Li 1,a, Dejian Zhou 1,b

Crack extension research of FR4 substrate embedded 90 bend optical fiber under the random vibration Wei Li 1,a, Dejian Zhou 1,b 4th International Conference on Machinery, Materials and Computing Technology (ICMMCT 2016) Crack extension research of FR4 substrate embedded 90 bend optical fiber under the random vibration Wei Li 1,a,

More information

Plasmonic Nanostructures II

Plasmonic Nanostructures II Plasmonic Nanostructures II Dr. Krüger / Prof. M. Zacharias, IMTEK, Propagation of SPPs Propagation distance decreases with decreasing strip width! 2 Dr. Krüger / Prof. M. Zacharias, IMTEK, Bound and leaky

More information

Wire-Bond CABGA A New Near Die Size Packaging Innovation Yeonho Choi February 1, 2017

Wire-Bond CABGA A New Near Die Size Packaging Innovation Yeonho Choi February 1, 2017 Amkor Technology, Inc. White Paper Wire-Bond CABGA A New Near Die Size Packaging Innovation Yeonho Choi February 1, 2017 Abstract Expanding its ChipArray Ball Grid Array (CABGA) package form factor miniaturization

More information

EMERGING APPLICATIONS

EMERGING APPLICATIONS COVER FEATURE INVITED PAPER New PCB Material Emerging for mmwave Applications Tarun Amla Isola Group, Chandler, Ariz. Requirements for stability of dielectric properties, manufacturability and suitability

More information

Microstrip Rectangular Patch Antenna Printed on LiTi Ferrite with Perpendicular DC Magnetic Biasing

Microstrip Rectangular Patch Antenna Printed on LiTi Ferrite with Perpendicular DC Magnetic Biasing Microstrip Rectangular Patch Antenna Printed on LiTi Ferrite with Perpendicular DC Magnetic Biasing Naveen Kumar Saxena 1,* (IEEE Student Member), Nitendar Kumar 2 and P.K.S. Pourush 1 1. Microwave Lab,

More information

3M Electromagnetic Compatible Products

3M Electromagnetic Compatible Products 3M Electromagnetic Compatible Products 3Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant new problems. These solutions

More information

Agilent N4420B S-Parameter Test Set

Agilent N4420B S-Parameter Test Set Agilent N4420B S-Parameter Test Set Technical Overview Expand your 2-port PNA Series network analyzer to a complete 4-port solution Compatible with Agilent PNA & PNA-L network analyzers Solid-state switches

More information

SECTION RADIO FREQUENCY SHIELDING ENCLOSURE RF Welded System

SECTION RADIO FREQUENCY SHIELDING ENCLOSURE RF Welded System SECTION 13096 RADIO FREQUENCY SHIELDING ENCLOSURE RF Welded System Prepared by: 90 Dayton Avenue, Unit 4B, Suite 13 Passaic, NJ 07055 (973) 574-9077 13096-1 RF WELDED SYSTEM PART 1 GENERAL 1.1 SECTION

More information

Bio-inspired algorithms applied to microstrip antennas design

Bio-inspired algorithms applied to microstrip antennas design Journal of Computational Interdisciplinary Sciences (2009) 1(2): 141-147 2009 Pan-American Association of Computational Interdisciplinary Sciences ISSN 1983-8409 http://epacis.org Bio-inspired algorithms

More information

TECHNICAL DATA SHEET 1 / 7 MATERIALS BERYLLIUM COPPER BERYLLIUM COPPER BERYLLIUM COPPER POLYETHER ETHERCETONE 30% GF

TECHNICAL DATA SHEET 1 / 7 MATERIALS BERYLLIUM COPPER BERYLLIUM COPPER BERYLLIUM COPPER POLYETHER ETHERCETONE 30% GF .. pn ao TECHNICAL DATA SHEET 1 / 7 All dimensions are in mm. COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS MATERIALS BERYLLIUM COPPER BERYLLIUM COPPER BERYLLIUM COPPER POLYETHER

More information

ESA s approach to quality control of the supply chain for PCBs. Stan Heltzel European Space Agency

ESA s approach to quality control of the supply chain for PCBs. Stan Heltzel European Space Agency ESA s approach to quality control of the supply chain for PCBs Stan Heltzel European Space Agency Outline A. ESA s approach to supply chain control for PCBs B. Case study: contamination in PCBs 1. Problem

More information

Fiber and Electro-Optics Research Center Virginia Polytechnic Institute and State University Blacksburg, Virginia 24061

Fiber and Electro-Optics Research Center Virginia Polytechnic Institute and State University Blacksburg, Virginia 24061 OPTICAL FIBER METHODS FOR AUTOCLAVE AND EPOXY CURE MONITORING B. Zimmermann, C. DiFrancia K. Murphy, A.Vengsarkar,' and R. Claus Fiber and Electro-Optics Research Center Virginia Polytechnic Institute

More information

Absorption Enhancement of MSM Photodetector Structure with a Plasmonic Double Grating Structure

Absorption Enhancement of MSM Photodetector Structure with a Plasmonic Double Grating Structure Edith Cowan University Research Online ECU Publications Pre. 2011 2010 Absorption Enhancement of MSM Photodetector Structure with a Plasmonic Double Grating Structure Chee Leong Tan Volodymyr V. Lysak

More information

BUILD TO PERFORMANCE RF Customized Ceramic Thin Film Filters

BUILD TO PERFORMANCE RF Customized Ceramic Thin Film Filters Vectron Thin Film Filters BUILD TO PERFORMANCE RF Customized Ceramic Thin Film Filters Anton Buchleitner, Vectron International VECTRON Thin Film Filters bandwidth / MHz Features: 1 1 1 1 1 1.1.1.1.1.1.1

More information

I-Tera MT40 Processing Guide

I-Tera MT40 Processing Guide I-Tera MT40 Processing Guide The processing guidelines contained in this document were developed through in-house testing and field experience. However, they should be considered to be starting points

More information

High Layer Count PCB. Technology Trends in KOREA ISUPETASYS

High Layer Count PCB. Technology Trends in KOREA ISUPETASYS High Layer Count PCB Technology Trends in KOREA April, 21 2011 Sang Soo LEE ISUPETASYS Contents 2 Definition of High Layer Count PCB Core Technology Trends High Layer Count PCB Technology Drivers Interconnection

More information

Verifying The Reliability Of Connections In HDI PWBs

Verifying The Reliability Of Connections In HDI PWBs Verifying The Reliability Of Connections In HDI PWBs The stacking of via holes is used effectively in the development of high density circuits on build-up printed wiring boards (PWBs). However, when micro

More information

Module 2: Optical Fiber Materials

Module 2: Optical Fiber Materials Module 2: Optical Fiber Materials Khanh Kieu, College of Optical Sciences, University of Arizona Slide #1 Outlines 1. Introduction 2. Physical properties Optical properties Thermal properties Mechanical

More information