Module 12: Nano Imprint Lithography. Lecture 16: Nano Imprint Lithography 1

Size: px
Start display at page:

Download "Module 12: Nano Imprint Lithography. Lecture 16: Nano Imprint Lithography 1"

Transcription

1 Module 12: Nano Imprint Lithography Lecture 16: Nano Imprint Lithography 1 1

2 In the previous five lectures (Lectures 11 to 15) we have seen how Photolithography can be used for patterning, particularly relevant to the micro electronics industry. However, as it has been highlighted in the introduction itself that apart from silicon based microelectronics, various other branches of science and engineering like microfluidics, smart and super adhesives, data storage media, confined chemistry applications, lab on a chip devices, various nano-biotechnology applications like single molecule enzymology, structural color, fabrication of super hydrophobic, super wetting, self-cleaning, gradient topography surfaces etc. also extensively require meso patterned surfaces. Most of the above mentioned bulk-nano applications as well as fabrication of various organic or plastic electronic devices like hybrid organic electronic devices, thin film transistors (TFT), plastic solar cells) etc. rely on surface patterning techniques that can generate defect free surface structures on various types of polymers with sub-micron and meso scale feature resolution. While the dimensional tolerance of the patterns in most of these applications is not as stringent as that necessary in the microelectronic industry, the key requirement here is to have rapid, massively parallel processes by which the patterns spread over large areas (cm 2 ), can be generated in bulk quantities at relatively lower cost. You must have noted by now that the utility of Photolithography is further limited by its material specific nature, as it can directly pattern only a Photoresist film, and therefore not useful for patterning other classes of materials and polymers used for most of the above said applications. Therefore, it was realized in early 90 s itself that non Photolithographic, polymer specific patterning techniques are necessary to cater to the demands of the different bulk nano patterning applications. At this time, two separate groups: Stephen Chou at Minnesota (later at Princeton) and George M Whitesides at Harvard almost simultaneously revolutionized the field of patterning by developing various polymer specific patterning methods. Chou developed imprinting based patterning methods, which eventually lead to the development of widely utilized Nano Imprint Lithography (NIL). On the other hand, Whiteside s contribution in the field has also been immense with development of 2

3 various techniques that are capable of producing meso scale topographic as well as chemical patterns, which are broadly classified as Soft Lithography (SL) methods. The scientific impact of these innovations related to SL can be gauged from the mere fact that most of the research articles describing the developments lead to series publication in top scientific journals, including Nature and Science! These methods are easy, and can be implemented without major infrastructure and instrumentation, though commercial instruments based on the SL techniques are also available. With time, numerous variants of the different SL techniques have evolved which have extended the applicability of these methods for patterning of wide range of materials including colloids, gels, ceramics and even metals. Subsequent development saw that many of the recent techniques can also be used for patterning flexible materials, foils and films coated on non-planar surfaces. In this lecture we first discuss Nano Imprint Lithography and its variants Soft Lithography Techniques Broadly, the polymer specific, non photolithographic patterning techniques are clubbed as Soft Lithography group of methods. There is a slight bit of controversy related to the use of the word soft, which eventually leads to another controversial question of whether the Nano Imprint Lithography group of techniques can be included as Soft lithography methods or not! The use of the word Soft Lithography was pioneered by George Whitesides to broadly classify the techniques invented by him, all of which incidentally used a flexible and soft crosslinked PDMS (Sylgard 184) stamp. You will soon observe that NIL, in its classical form does not use a flexible stamp, and requires a rigid Silicon Mold. Thus, if the classification of the techniques is doen exclusively on the nature of the stamp (rigid or flexible!), then probably NIL group of methods cannot be considered as Soft Lithography techniques. This is in fact is the convention and many researchers classify NIL as an Embossing technique. However, if one considers that all these techniques are aimed at patterning Soft material like polymers, then one may consider that NIL group of methods can also be included in the list of SL techniques. However, this is a minor 3

4 controversy and I will leave the decision open to the students. We will learn various interesting aspects of both type of techniques. In this text, I will consider NIL also as a SL technique. Figure 16.1: Classification of different Soft Lithography Techniques The Soft Lithography techniques can be classified based on various criterions. For example, it can be based on the type of patterns generated either be topographic structures or chemical structures (ordered array of different wettability regimes on the surface). The classification can also be based on the mechanism of pattern replications: 1) Imprinting, where the pattern replication is achieved by a visco plastic deformation of a molten polymer layer subject to externally applied forces, examples of which include the NIL, Hot Embossing and associated group of methods; and 2) Capillary flow driven pattern replication inside a confined channel, examples of which include methods like Capillary Force Lithography (CFL), Micro Molding in Capillaries (MIMIC), Solvent Assisted Micro Molding (SAMIM) etc. As I have already pointed out, classification is also possible based on the nature of stamp (rigid or flexible) used. The schematic in figure 1 gives an idea about the different methods and their classifications. It can be seen that most SL techniques use a soft, flexible stamp. It is typically made of cross linked polydimethylsiloxane (PDMS). PDMS is an inorganic polymer which has a unique combination of properties resulting from an inorganic siloxane backbone, to which the organic methyl groups 4

5 are attached. This results in a very low glass transition temperature (close to 60 O C) and low viscosity at room temperature. Further, the material can conveniently be transformed in to an elastomeric solid by thermal cross-linking. The commercially available brand of Sylgard (Sylgard 184 and other variants) manufactured by Dow Corning, USA is widely used for making the stamps. However, other elastomeric materials like polyurethanes, polyimides, and crosslinked Novolac resins (a phenol formaldehyde polymer) have also been used as soft lithography stamps or molds. The choice of crosslinked PDMS or Sylgard 184 as a preferred material for the fabrication of SL stamps is attributed to several other factors: 1) ability of a flexible Sylgard 184 stamp to conform to a surface over relatively large areas, including over non planar areas, due to low viscosity and high fluidity; 2) the elasticity of the material allows it to be peeled off after being cross linked and the desired shape has been transferred onto it; 3) low surface energy of Sylgard 184 favors easy detachment; 4) Sylgard 184 is chemically inert and therefore can be used for patterning wide variety of polymers; 5) Sylgard 184 is optically transparent down to ~ 300 nm, which allows the stamps to be used for patterning of UV curable polymers; 6) Sylgard 184 as a material is durable, allowing reusability of the same stamp several times; 7) The surface properties of a cross linked Sylgard 184 can be easily modified by various techniques, like UV Ozone exposure or Plasma Oxidation followed by attachment of surface active monolayers (SAM). We now present the different pattern replication methods, in somewhat details Nano Imprint Lithography Nano Imprint Lithography (NIL) was developed by Stephen Chou and colleagues at the University of Minnesota, in mid 90 s. This was the first technique that overcame the diffraction limitation of Photolithography and could demonstrate, way back in 1997 itself that structures with lateral resolution < 10 nm can be achieved! The resolution limit further improved to 5 nm in NIL is an extremely simple concept, where a rigid mold with the relief structures is 5

6 pressed against a thermally softened polymer layer. In NIL, and external force is applied to achieve the pattern replication. In NIL, the pattern replication is achieved based on a visco plastic deformation of the molten polymer layer under an applied external force. Once the pattern replication is complete, the polymer layer is cooled below the glass transition temperature to solidify or freeze the structures. It should be noted that unlike the other Soft Lithography techniques which uses as flexible stamp, NIL uses a rigid mold, the use of which is necessary for withstanding the applied external pressure. Figure16.2: Key steps of Nano Imprint Lithography (NIL) The mould in the nanoimprint technique plays the same effective role as that of the photomask in photolithography. The hard features on NIL moulds templates allow replication of features with lateral resolutions below 10 nm, which is not possible to achieve using a soft stamp. In most cases, the hard mould is made of Si or SiO 2, though it is possible to use a metallic mold as well. Issues that influence the selection of mould materials include the hardness, the compatibility with traditional micro-fabrication processing and the thermal expansion coefficient etc. It is desired that there is not a huge mismatch in the coefficient of thermal expansion between the polymer and the mold material. 6

7 Figure 16.2 shows the key steps associated with Nano Imprint Lithography. Molding techniques based on imprint processes utilize the difference between the mechanical properties of the structured mold and the molding material. In principle, the viscous molding material is shaped by pressing the rigid stamp into it. In order to achieve reasonable degree of pattern replication quickly, it is normally carried out under pressure, with a molding materials having relatively low viscosity.in the classical NIL, the polymer film and mold are both heated initially. The temperature for imprinting depends on the glass transition temperature (T G ) of the polymer. For example, if PMMA with T G = 105 C is used as the resist layer (polymer film), an imprinting temperature of ~ 200 C is generally used. Once the mold and the film are both heated, then the mold is compressed against the polymer film, with evenly distributed external force. The typical magnitude of the applied pressure varies between atm. Under the applied external pressure, a perfect negative replica of the mold patterns form on the film surface. A lower pressure fails to fully replicate the patterns on the surface of the film. In contrast, a higher pressure may result in a damage of the mold. The temperature of the assembly is then brought down to room temperature which allows freezing of the structures. The mold is then withdrawn, releasing the patterns on the film surface. One critical issue in NIL is the mold removal, as it can often be difficult to release a rigid mold, which sticks with the polymer film during the patterning step. To facilitate the detachment of the mold, the molds are generally coated with low surface energy mold release agents that tend to reduce adhesion between the polymer and mold. This important issue is addressed in somewhat details later. Mold breakage is highly undesirable as it completely spoils the structures formed by NIL. Another key problem of NIL is that the patterns form with a thin residual layer of polymeric material. However, in many cases this layer is intentionally left underneath the mold protrusions, which acts as a soft cushioning layer that prevents direct impact of the hard mold on the substrate and effectively protects the mold features, as a direct contact between the rigid substrate and the rigid mold can often lead to structural damage of the mold. For most applications, this residual 7

8 layer needs to be removed by an anisotropic O 2 plasma-etching process to complete the pattern definition. NIL as a technique is often referred to as hot embossing since the process involves heating the polymer above its glass-transition temperature. An important criterion for a good NIL resist is that the imprinted pattern should maintain its mechanical integrity during mould substrate separation as well as any subsequent pattern transfer steps. Material requirement of NIL necessitates that the film to be patterned should exhibit very low thermal and pressure shrinkage within the range of operating conditions. Currently, significant research is going on for developing new materials and polymer formulations that are ideally suitable for NIL applications. Till date, mostly commercially available thermo plastic materials like poly(methylmethacrylate) (PMMA), polystyrene (PS) etc. have been traditionally used as NIL resists. Historically, these materials were not developed for NIL or patterning applications and are therefore not optimized for the specific requirement of NIL process. One critical requirement that would make any material a preferred candidate for NIL is the ability of the polymer to detach neatly from the mold, during de-molding process. At the same time it should not hamper either mold filling or the adhesion of the mold to the substrate. None of the commercially available regular polymers can satisfy these seemingly contradictory requirements. In typical applications, it has already been mentioned that the mould surface is treated with a low surface energy surfactant for easy release. However, when imprinting high density or high aspect ratio patterns, the imprinted polymer tends to adhere to the mould resulting in pattern defects. Block copolymers materials which exhibit dual surface properties through structural phase segregation is being exploited to solve this problem. In addition, a higher dry etching resistance is also desirable if the imprinted polymer pattern is to be used as a dry etching mask for subsequent processing. Addition of Si-containing material in the polymer formulation could is an effective method in this regard. It is important to understand that the area is completely open and significant research and development is currently underway in the field. The stamp however is 8

9 prone to rapid damage due to extensive thermal and pressure cycling and unfortunately requires more frequent replacement than most other Soft Lithography methods. NIL has also been successfully utilized for patterning metal thin films, using Excimer laser for rapid melting and imprinting. Figure 16.3: Schematic representation of stress accumulation during NIL 16.3 Squeeze Flow and Hydrodynamics during Pattern Replication by NIL Here we look at the hydrodynamics associated with NIL, which is simple, yet fascinating and is also responsible for accumulation of significant extent of residual stresses, which might eventually affect the long term stability of the patterns created by NIL. As can be seen in figure 16.3, during embossing the linear downward movement of a stamp engenders a complex squeeze flow of the molten viscous polymer in the lateral as well as upward direction. During pattern replication, the two surfaces of the stamp and the substrate come entirely into contact with each other until complete mold filling results. The displacement of the molten polymer in NIL takes place by both applied imprinting forces and capillary forces. The relative dominance of the two phenomena depends largely on the precise condition prevailing on the sample and depends on host of parameters like wettability of the stamp by the molten polymer, viscosity etc. A simple model for the squeezed polymer flow underneath the stamp protrusion is obtained by treating the polymer as an incompressible liquid of constant viscosity, and solving the Navier Stokes equation with no slip boundary conditions at the stamp and substrate surfaces. For a line- 9

10 shaped stamp protrusions and cavities, the following expression is obtained, which is known as the Stefan equation: (16.1) Where F is the constant imprint force, h 0 is the initial film thickness, h(t) is the thickness of the film after imprinting for a duration t, s is the line width of each mold stripe, L is length of each stripe and η 0 is the viscosity of the polymer. Inserting h F = h(t F ) [Residual film thickness, t F is the imprinting time], we obtain: (16.2) Further, substituting p = F/ sl, which is the constant pressure under each stamp protrusion, we obtain a more useful form of the above equation which gives the time of imprinting as: (16.3) From the Stefan equation (16.3) it can be clearly understood that for the same pressure, a stamp with narrower features will sink faster than a stamp with larger features. Thus, based on the stamp geometry and the viscosity of the polymer melt, the imprinting time can be suitably optimized Accumulation of Residual Stresses in NIL As we understand now, during NIL, the pattern is transferred to the heated polymer film by mechanically forcing or squeezing the polymer to flow into the mold at elevated temperatures and pressures. When the mold along with the patterned film is cooled below the glass transition temperature (T G ) of the polymer, the stresses get accumulated within the imprinted patterns. These stresses tend to get released over prolonged periods of time, which may lead to loss of fidelity of the imprinted patterns. 10

11 The accumulation of stress during NIL is attributed to several factors. Firstly, due to no slip boundary condition on the surface of the mold, the polymer layer right adjacent to the stamp moves downwards, in the direction of motion of the stamp. However, as the film has finite thickness, the polymer layer gets squeezed and starts flowing laterally towards the zones where the effect of squeezing due to external pressure is less, which is below the valleys of the mold. As two streams of polymer flow into these zones from opposite side, the resulting motion of the polymer stream now starts flowing upwards, for filling up the mold. Thus there is a significant velocity gradient within each mold groove where the polymer rises up during mold filling. The velocity of the fluid in this regime changes sign from negative (downward) to positive. We know that the expression of shear stress is τ = μ (δv/δx), for a Newtonian liquid, where μ is the viscosity. The large velocity gradient attributes to a higher value of the second term in the expression, that is (δv/δx). Further, as the polymer is cooled down once the pattern replication is complete it (cooling) also results in progressive increase of μ, which further increases the value of τ by several orders once the temperature drops below the T G. Thus, in the expression for shear stress both the terms are high and contribute to a higher magnitude of the shear stress in the system. As the polymer freezes below T G, these stresses get accumulated within the imprinted patterns. As already mentioned, the accumulated stresses may gradually release over a prolonged period of time, resulting in reduction of feature height and loss of fidelity of the structures. Further, the viscosity also depends strongly on the polymer s molecular weight, and therefore the problem of stress accumulation is higher in higher molecular weight polymers. However, it can often be difficult to use a low molecular weight polymer for patterning, as it may have poor structural integrity and might dewet during the thermal cycling (dewetting will be discussed later, in details). Also, the lack of entanglement of the molecules in low molecular weight polymers may lead to brittle behavior of the imprinted patterns, which may fracture during the mold separation stage. Thus, the choice of both T G and the molecular weight is important in 11

12 maintaining structural stability of the imprinted patterns. The stress build-up during the thermal cycling of the NIL process can also affect the pattern integrity during mould separation Low Pressure and Low Temperature Variants of NIL The problem of residual stress accumulation in the polymer layer be overcome to a certain extend by performing the pattern replication at temperatures closer to the glass transition temperature of the polymer. A low pressure version of NIL (LP NIL, operating pressure 2 3 bars) was developed which uses a flexible stamp made of fluoropolymer material. The reduced pressure significantly eliminates the problem of substrate or mold fracture that is associated with high pressure NIL. One may argue that this method, to a large extend resembles Pressure Assisted Capillary Force Lithography (discusses later). Solvent vapor assisted NIL, which eliminates the thermal annealing step completely and relies on softening of the polymer due to inter penetration of the solvent molecules into the polymer matrix. This action reduces the cohesion between the polymer molecules which in turn results in lowering of the viscosity of the film to be patterned. Once pattern replication is complete, the solvent molecules were evaporated out of the film to freeze the structures. On the other hand, Room Temperature Imprint Lithography (RTIL) is also possible by applying a higher pressure with a low molecular weight polymer. In this case, the pattern replication involves plastic flow of polymer under compressive stress conditions. As the mold is placed on the polymer film and subject to external pressure, the polymer which is in direct contact with the mold initially deforms elastically. With higher penetration, the polymer under the contact zones yields and starts flowing plastically flows in outward laterally direction in a manner similar to that shown in figure This in turn results in an upward movement of the material into the void between two adjacent contact zones. The other major derivative of NIL, which came up primarily to eliminate the associated problems of thermal cycling and stress build up is UV assisted NIL, which is discussed in the subsequent lecture. 12

13 Reference: 1. L. J. Guo, Nanoimprint Lithography: Methods and Material Requirements, Advanced Materials 19, , S. H. Ahn and L. J. Guo, Roll to Roll Nanoimprint Lithography and Dynamic Nano- Inscription, Chapter 2, pages 27 42, in Generating Micro and Nanopatterns in Polymeric Materials, edited by A. del Campo and E. Artz, WILEY VCH Verlag & Co., Weinheim, Germany, ISBN: H. Schift and A. Kristensen, Nanoimprint Lithography, Chapter 8, pages , in Springer Handbook of Nanotechnology, edited by B. Bhushan, Springer, ISBN: (Print) (Online). 4. R. Mukherjee, Soft Lithography and Beyond: Some Recent Developments in Meso Patterning, Chapter 4, pages , in Microfluidics and Microscale Transport Process, edited by S. Chakraborty, CRC Press, ISBN:

Processing guidelines

Processing guidelines Processing guidelines mr-uvcur21 series UV-curable Polymer for UV-based Nanoimprint Lithography Characteristics mr-uvcur21 is a liquid UV-curable polymer system with low viscosity and high curing rate

More information

Micro and nano structuring of carbon based materials for micro injection moulding and hot embossing

Micro and nano structuring of carbon based materials for micro injection moulding and hot embossing Micro and nano structuring of carbon based materials for micro injection moulding and hot embossing Victor Usov, Graham Cross, Neal O Hara, Declan Scanlan, Sander Paulen, Chris de Ruijter, Daniel Vlasveld,

More information

D Eggenstein-Leopoldshafen, Germany 2 University of Karlsruhe (TH), Institute for Microstructure Technology (IMT),

D Eggenstein-Leopoldshafen, Germany 2 University of Karlsruhe (TH), Institute for Microstructure Technology (IMT), Sub-µ structured Lotus Surfaces Manufacturing M. Worgull 1, M. Heckele 1, T. Mappes 2, B. Matthis 1, G. Tosello 3, T. Metz 4, J. Gavillet 5, P. Koltay 4, H. N. Hansen 3 1 Forschungszentrum Karlsruhe (FZK),

More information

Large-area patterning by roller-based nanoimprint lithography

Large-area patterning by roller-based nanoimprint lithography JOANNEUM RESEARCH Forschungsgesellschaft Institute MATERIALS, Weiz, Austria Large-area patterning by roller-based nanoimprint lithography Ursula Palfinger, Dieter Nees, Stephan Ruttloff, Markus Leitgeb,

More information

Ceramic and glass technology

Ceramic and glass technology 29 Glass Properties Glass is an inorganic, nonmetallic material which cools to a rigid solid without crystallization. Glassy, or noncrystalline, materials do not solidify in the same sense as do those

More information

Photolithography I ( Part 2 )

Photolithography I ( Part 2 ) 1 Photolithography I ( Part 2 ) Chapter 13 : Semiconductor Manufacturing Technology by M. Quirk & J. Serda Bjørn-Ove Fimland, Department of Electronics and Telecommunication, Norwegian University of Science

More information

BONDING OF MULTIPLE WAFERS FOR HIGH THROUGHPUT LED PRODUCTION. S. Sood and A. Wong

BONDING OF MULTIPLE WAFERS FOR HIGH THROUGHPUT LED PRODUCTION. S. Sood and A. Wong 10.1149/1.2982882 The Electrochemical Society BONDING OF MULTIPLE WAFERS FOR HIGH THROUGHPUT LED PRODUCTION S. Sood and A. Wong Wafer Bonder Division, SUSS MicroTec Inc., 228 SUSS Drive, Waterbury Center,

More information

Vacuum casting, a new answer for manufacturing biomicrosystems

Vacuum casting, a new answer for manufacturing biomicrosystems 1 Vacuum casting, a new answer for manufacturing biomicrosystems M Denoual 1 *, P Mognol 2, and B Lepioufle 1 1 Biomis-SATIE ENS-Cachan antenne de Bretagne, Bruz, France 2 IRCCyN Nantes, France The manuscript

More information

Amorphous Oxide Transistor Electrokinetic Reflective Display on Flexible Glass

Amorphous Oxide Transistor Electrokinetic Reflective Display on Flexible Glass Amorphous Oxide Transistor Electrokinetic Reflective Display on Flexible Glass Devin A. Mourey, Randy L. Hoffman, Sean M. Garner *, Arliena Holm, Brad Benson, Gregg Combs, James E. Abbott, Xinghua Li*,

More information

The Effect of Hydrophobic Patterning on Micromolding of Aqueous-Derived Silk Structures

The Effect of Hydrophobic Patterning on Micromolding of Aqueous-Derived Silk Structures The Effect of Hydrophobic Patterning on Micromolding of Aqueous-Derived Silk Structures Konstantinos Tsioris 1, Robert D White 1, David L Kaplan 2, and Peter Y Wong 1 1 Mechanical Engineering, Tufts University,

More information

Leveraging the Precision of Electroforming over Alternative Processes When Developing Nano-scale Structures

Leveraging the Precision of Electroforming over Alternative Processes When Developing Nano-scale Structures VOLUME 4 - ELECTROFORMING Leveraging the Precision of over Alternative Processes When Developing Nano-scale Structures Electrical and mechanical component and subsystem designers generally have five techniques

More information

Figure 2.3 (cont., p. 60) (e) Block diagram of Pentium 4 processor with 42 million transistors (2000). [Courtesy Intel Corporation.

Figure 2.3 (cont., p. 60) (e) Block diagram of Pentium 4 processor with 42 million transistors (2000). [Courtesy Intel Corporation. Figure 2.1 (p. 58) Basic fabrication steps in the silicon planar process: (a) oxide formation, (b) selective oxide removal, (c) deposition of dopant atoms on wafer, (d) diffusion of dopant atoms into exposed

More information

Fabrication Techniques for Thin-Film Silicon Layer Transfer

Fabrication Techniques for Thin-Film Silicon Layer Transfer Fabrication Techniques for Thin-Film Silicon Layer Transfer S. L. Holl a, C. A. Colinge b, S. Song b, R. Varasala b, K. Hobart c, F. Kub c a Department of Mechanical Engineering, b Department of Electrical

More information

Thermal Management of LEDs: Looking Beyond Thermal Conductivity Values

Thermal Management of LEDs: Looking Beyond Thermal Conductivity Values Thermal Management of LEDs: Looking Beyond Thermal Conductivity Values Specifically designed and formulated chemical products are widely used in the electronics industry for a vast array of applications.

More information

Lecture 19 Microfabrication 4/1/03 Prof. Andy Neureuther

Lecture 19 Microfabrication 4/1/03 Prof. Andy Neureuther EECS 40 Spring 2003 Lecture 19 Microfabrication 4/1/03 Prof. ndy Neureuther How are Integrated Circuits made? Silicon wafers Oxide formation by growth or deposition Other films Pattern transfer by lithography

More information

Plasma for Underfill Process in Flip Chip Packaging

Plasma for Underfill Process in Flip Chip Packaging Plasma for Underfill Process in Flip Chip Packaging Jack Zhao and James D. Getty Nordson MARCH 2470-A Bates Avenue Concord, California 94520-1294 USA Published by Nordson MARCH www.nordsonmarch.com 2015

More information

Lecture 6. Through-Wafer Interconnect. Agenda: Through-wafer Interconnect Polymer MEMS. Through-Wafer Interconnect -1. Through-Wafer Interconnect -2

Lecture 6. Through-Wafer Interconnect. Agenda: Through-wafer Interconnect Polymer MEMS. Through-Wafer Interconnect -1. Through-Wafer Interconnect -2 Agenda: EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie Lecture 6 Through-wafer Interconnect EEL6935 Advanced MEMS 2005 H. Xie 1/21/2005 1 Motivations: Wafer-level packaging CMOS 3D Integration

More information

Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology

Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology R.K. Trichur, M. Fowler, J.W. McCutcheon, and M. Daily Brewer Science, Inc. 2401 Brewer Drive Rolla, MO

More information

Delamination of Thin Films Using Laser Induced Stress Waves

Delamination of Thin Films Using Laser Induced Stress Waves Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems Delamination of Thin Films Using Laser Induced Stress Waves Undergraduate Researcher Angelica Anne Vargas, Research Experience

More information

Ajay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University

Ajay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University 2014 Ajay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University Page1 Syllabus UNIT 1 Introduction to VLSI Technology: Classification of ICs, Scale of integration,

More information

Self Healing Ceramic (Surfaces)

Self Healing Ceramic (Surfaces) Self Healing Ceramic (Surfaces) KIVI NIRIA Jaarcongres 23 november 2011 Matthijn de Rooij University of Twente Laboratory for Surface Technology and Tribology Introduction Technical Ceramics Crystalline

More information

Chapter 8 Deformation and Strengthening Mechanisms. Question: Which of the following is the slip system for the simple cubic crystal structure?

Chapter 8 Deformation and Strengthening Mechanisms. Question: Which of the following is the slip system for the simple cubic crystal structure? Chapter 8 Deformation and Strengthening Mechanisms Concept Check 8.1 Why? Question: Which of the following is the slip system for the simple cubic crystal structure? {100} {110} {100} {110}

More information

Fabrication Technology

Fabrication Technology Fabrication Technology By B.G.Balagangadhar Department of Electronics and Communication Ghousia College of Engineering, Ramanagaram 1 OUTLINE Introduction Why Silicon The purity of Silicon Czochralski

More information

Ceramic and glass technology

Ceramic and glass technology 1 Row materials preperation Plastic Raw materials preperation Solid raw materials preperation Aging wet milling mastication Mixing seving Grain size reduction Milling Crushing Very fine milling Fine milling

More information

EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES

EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES G. Fortunato, A. Pecora, L. Maiolo, M. Cuscunà, D. Simeone, A. Minotti, and L. Mariucci CNR-IMM,

More information

Micro Injection Molding of Micro Fluidic Platform

Micro Injection Molding of Micro Fluidic Platform Micro Injection Molding of Micro Fluidic Platform S. C. Chen, J. A. Chang, Y. J. Chang and S. W. Chau Department of Mechanical Engineering, Chung Yuan University, Taiwan, ROC Abstract In this study, micro

More information

Low Stress Silicone Encapsulant Enables Distributed Power Generation

Low Stress Silicone Encapsulant Enables Distributed Power Generation Low Stress Silicone Encapsulant Enables Distributed Power Generation Guy Beaucarne Kent Larson Dow Corning Corporation Introduction The way electric power is generated, distributed and used is presently

More information

Optimizing the Assembly Process with Cure-On-Demand UV/Visible Light-Curable Adhesives

Optimizing the Assembly Process with Cure-On-Demand UV/Visible Light-Curable Adhesives Optimizing the Assembly Process with Cure-On-Demand UV/Visible Light-Curable Adhesives Virginia P. Read Industrial Market Segment Manager DYMAX Corporation Torrington, CT www.dymax.com Introduction Manufacturers

More information

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming

More information

High-Speed Roll-to-Roll Nanoimprint Lithography on Flexible Plastic Substrates**

High-Speed Roll-to-Roll Nanoimprint Lithography on Flexible Plastic Substrates** COMMUNICATION DOI: 10.1002/adma.200702650 High-Speed Roll-to-Roll Nanoimprint Lithography on Flexible Plastic Substrates** By Se Hyun Ahn and L. Jay Guo* The ability of micro- to nanometer-scale patterning

More information

Photoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller

Photoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Photoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller Webpage: http://www.rit.edu/lffeee 82 Lomb Memorial Drive Rochester, NY 14623-5604

More information

Exploiting the Synergy of Fluorine and Silicone for Stain Resistant and Easy-Clean Coatings.

Exploiting the Synergy of Fluorine and Silicone for Stain Resistant and Easy-Clean Coatings. Exploiting the Synergy of luorine and Silicone for Stain Resistant and Easy-Clean Coatings. Dr. Peter Hupfield, Dow Corning Ltd., United Kingdom Mr. Eiji Kitaura, Dow Corning Toray Ltd., Japan Dr. Tetsuya

More information

Nanofabrication Prof. Stephen Y. Chou NanoStructure Laboratory

Nanofabrication Prof. Stephen Y. Chou NanoStructure Laboratory Nanofabrication Prof. Stephen Y. Chou Department of Electrical Engineering Princeton University 1 Acknowledgment Dr. Paul Fischer Dr. Yun Wang Dr. Jay Guo Dr. Peter Klauss Dr. Jim Wang Dr. Longtin He Dr.

More information

The formation of oscillation marks in continuous casting of steel

The formation of oscillation marks in continuous casting of steel The formation of oscillation marks in continuous casting of steel 1 Introduction Continuous casting is a method of producing an infinite solid strand from liquid metal by continuously solidifying it as

More information

NANO SCRATCH TESTING OF THIN FILM ON GLASS SUBSTRATE

NANO SCRATCH TESTING OF THIN FILM ON GLASS SUBSTRATE NANO SCRATCH TESTING OF THIN FILM ON GLASS SUBSTRATE Prepared by Jesse Angle 6 Morgan, Ste156, Irvine CA 92618 P: 949.461.9292 F: 949.461.9232 nanovea.com Today's standard for tomorrow's materials. 2010

More information

BOROFLOAT & Glass Wafers: A Union of Inspiration & Quality

BOROFLOAT & Glass Wafers: A Union of Inspiration & Quality Home Tech SCHOTT North America, Inc. 553 Shepherdsville Road Louisville, KY 4228 USA Phone: +1 (52) 657-4417 Fax: +1 (52) 966-4976 Email: borofloat@us.schott.com www.us.schott.com/borofloat/wafer BOROFLOAT

More information

Enhancing the Performance & Reliability of Your Electronics Designs. Innovative Thermally Conductive Silicone Solutions IMAGINE

Enhancing the Performance & Reliability of Your Electronics Designs. Innovative Thermally Conductive Silicone Solutions IMAGINE Enhancing the Performance & Reliability of Your Electronics Designs Innovative Thermally Conductive Silicone Solutions IMAGINE Heat Is the Enemy of Electronic Devices The reasons why may vary from application

More information

Soft-lithography for Preparing Patterned Liquid Crystal Orientations

Soft-lithography for Preparing Patterned Liquid Crystal Orientations 2007 KIDS Soft-lithography for Preparing Patterned Liquid Crystal Orientations Hak-Rin Kim **a, Jong-Wook Jung **a, Min-Soo Shin **a, Myung-Eun Kim a, You-Jin Lee **a, and Jae-Hoon Kim *b Abstract We demonstrate

More information

12.0 Materials for Missile, Space, and Launch Systems

12.0 Materials for Missile, Space, and Launch Systems 12.0 Materials for Missile, Space, and Launch Systems 12.1 Introduction Affordability is the key criterion for assessing the value of a new technology and its potential incorporation into military applications.

More information

Gaetano L Episcopo. Introduction to MEMS

Gaetano L Episcopo. Introduction to MEMS Gaetano L Episcopo Introduction to MEMS What are MEMS? Micro Electro Mechanichal Systems MEMS are integrated devices, or systems of devices, with microscopic parts, such as: Mechanical Parts Electrical

More information

VLSI Technology Dr. Nandita Dasgupta Department of Electrical Engineering Indian Institute of Technology, Madras

VLSI Technology Dr. Nandita Dasgupta Department of Electrical Engineering Indian Institute of Technology, Madras VLSI Technology Dr. Nandita Dasgupta Department of Electrical Engineering Indian Institute of Technology, Madras Lecture - 33 Problems in LOCOS + Trench Isolation and Selective Epitaxy So, we are discussing

More information

STUDY OF POLYMER FLOW BEHAVIOR IN CAVITY FILLING OF ALIGNMENT STRUCTURES IN MICRO HOT EMBOSSING THESIS

STUDY OF POLYMER FLOW BEHAVIOR IN CAVITY FILLING OF ALIGNMENT STRUCTURES IN MICRO HOT EMBOSSING THESIS i STUDY OF POLYMER FLOW BEHAVIOR IN CAVITY FILLING OF ALIGNMENT STRUCTURES IN MICRO HOT EMBOSSING THESIS Presented to the Graduate Council of Texas State University-San Marcos in Partial Fulfillment of

More information

Surface micromachining and Process flow part 1

Surface micromachining and Process flow part 1 Surface micromachining and Process flow part 1 Identify the basic steps of a generic surface micromachining process Identify the critical requirements needed to create a MEMS using surface micromachining

More information

YIELD & TENSILE STRENGTH OF STEEL & ALUMINIUM USING MICROINDENTATION

YIELD & TENSILE STRENGTH OF STEEL & ALUMINIUM USING MICROINDENTATION YIELD & TENSILE STRENGTH OF STEEL & ALUMINIUM USING MICROINDENTATION Prepared by Duanjie Li, PhD & Pierre Leroux 6 Morgan, Ste156, Irvine CA 9618 P: 949.461.99 F: 949.461.93 nanovea.com Today's standard

More information

EXPLORING VACUUM CASTING TECHNIQUES FOR MICRON AND SUBMICRON FEATURES. Campus Ker Lann, av Robert Schumann Bruz, France

EXPLORING VACUUM CASTING TECHNIQUES FOR MICRON AND SUBMICRON FEATURES. Campus Ker Lann, av Robert Schumann Bruz, France EXPLORING VACUUM CASTING TECHNIQUES FOR MICRON AND SUBMICRON FEATURES M. Denoual *, P. Mognol **, B. Lepioufle * * Biomis-SATIE ENS-Cachan antenne de Bretagne, Campus Ker Lann, av Robert Schumann 35170

More information

Nonplanar Metallization. Planar Metallization. Professor N Cheung, U.C. Berkeley

Nonplanar Metallization. Planar Metallization. Professor N Cheung, U.C. Berkeley Nonplanar Metallization Planar Metallization Passivation Metal 5 (copper) Metal 3 (copper) Interlevel dielectric (ILD) Via (tungsten) Metal 1 (copper) Tungsten Plug to Si Silicon Caps and Plugs oxide oxide

More information

Photonic Drying Pulsed Light as a low Temperature Sintering Process

Photonic Drying Pulsed Light as a low Temperature Sintering Process Photonic Drying Pulsed Light as a low Temperature Sintering Process Lou Panico Xenon Corporation W E S T E R N M I C H I G A N U N I V E R S I T Y PRESENTATION OVERVIEW What is Printed Electronics Materials

More information

A MODEL FOR RESIDUAL STRESS AND PART WARPAGE PREDICTION IN MATERIAL EXTRUSION WITH APPLICATION TO POLYPROPYLENE. Atlanta, GA 30332

A MODEL FOR RESIDUAL STRESS AND PART WARPAGE PREDICTION IN MATERIAL EXTRUSION WITH APPLICATION TO POLYPROPYLENE. Atlanta, GA 30332 Solid Freeform Fabrication 2016: Proceedings of the 26th 27th Annual International Solid Freeform Fabrication Symposium An Additive Manufacturing Conference A MODEL FOR RESIDUAL STRESS AND PART WARPAGE

More information

Superionic Solid State Stamping (S4)

Superionic Solid State Stamping (S4) Superionic Solid State Stamping (S4) Lead Faculty Researcher: Placid Ferreira Department: Materials Science & Engineering Hsu et al, Nano Letters, 2007 1. Description: This dry, single step, electrochemical

More information

Surface Micromachining

Surface Micromachining Surface Micromachining Outline Introduction Material often used in surface micromachining Material selection criteria in surface micromachining Case study: Fabrication of electrostatic motor Major issues

More information

Tribology Module4: Lubricants & Lubrication

Tribology Module4: Lubricants & Lubrication Tribology Module4: Lubricants & Lubrication Q.1. What is fluid film lubrication? What is the difference between hydrostatic and hydrodynamic lubrication? Ans: Fluid film lubrication is a generic term used

More information

1. Introduction. What is implantation? Advantages

1. Introduction. What is implantation? Advantages Ion implantation Contents 1. Introduction 2. Ion range 3. implantation profiles 4. ion channeling 5. ion implantation-induced damage 6. annealing behavior of the damage 7. process consideration 8. comparison

More information

In-Situ Monitoring of Pattern Filling in Nano-Imprint Lithography Using Surface Plasmon Resonance

In-Situ Monitoring of Pattern Filling in Nano-Imprint Lithography Using Surface Plasmon Resonance Copyright 2011 American Scientific Publishers All rights reserved Printed in the United States of America Journal of Nanoscience and Nanotechnology Vol. 11, 1 6, 2011 In-Situ Monitoring of Pattern Filling

More information

New Evaluation Methods for Pressure Sensitive Adhesive (PSA) Tapes Used in the Semiconductor Industry

New Evaluation Methods for Pressure Sensitive Adhesive (PSA) Tapes Used in the Semiconductor Industry New Evaluation Methods for Pressure Sensitive Adhesive (PSA) Tapes Used in the Semiconductor Industry by Tomoyuki Aogaki *, Hidefumi Miyagi * and Yoshihisa Kano * We propose new evaluation methods for

More information

PDF created with FinePrint pdffactory Pro trial version

PDF created with FinePrint pdffactory Pro trial version Benefits Damage-free dicing of thin silicon Capable of producing smallest street widths which in return provides additional space for more parts per wafer Single step process results in reduction of cost

More information

THE PATH TO VOLUME PRODUCTION FOR CPV OPTICS

THE PATH TO VOLUME PRODUCTION FOR CPV OPTICS THE PATH TO VOLUME PRODUCTION FOR CPV OPTICS Thomas Luce 1 and Joel Cohen 1 1 Eschenbach Optik GmbH, Nuremberg, Germany ABSTRACT A crucial prerequisite for a commercial success of largescale CPV is the

More information

Behaviors of QFN Packages on a Leadframe Strip

Behaviors of QFN Packages on a Leadframe Strip Behaviors of QFN Packages on a Leadframe Strip Eric Ouyang, Billy Ahn, Seng Guan Chow, Anonuevo Dexter, SeonMo Gu, YongHyuk Jeong, JaeMyong Kim STATS ChipPAC Inc 46429 Landing Parkway, Fremont, CA 94538,

More information

ABSTRACT: INTRODUCTION:

ABSTRACT: INTRODUCTION: ABSTRACT: Nano-Composite Polymer Optical Coatings Tom Faris Vampire Optical Coatings, Inc. P.O. Box 240 Kirkersville, Ohio 43033 (740)-927-5257 f(740)-927-5032 vampirecoatings@earthlink.net Traditionally

More information

Nanocoating close to the market

Nanocoating close to the market Nanocoating close to the market Moritz Graf zu Eulenburg Introduction Market overview Overview of most important coating aspects Description of different coating systems Description of different drying

More information

OPTIMISED CURING OF SILVER INK JET BASED PRINTED TRACES

OPTIMISED CURING OF SILVER INK JET BASED PRINTED TRACES Nice, Côte d Azur, France, 27-29 September 2006 OPTIMISED CURING OF SILVER INK JET BASED PRINTED TRACES Z. Radivojevic 1, K. Andersson 1, K. Hashizume 2, M. Heino 1, M. Mantysalo 3, P. Mansikkamaki 3,

More information

Fabrication of a Crossbar Structure at 50 nm Half-pitch by UV-based Nanoimprint Lithography

Fabrication of a Crossbar Structure at 50 nm Half-pitch by UV-based Nanoimprint Lithography Fabrication of a 34 34 Crossbar Structure at 50 nm Half-pitch by UV-based Nanoimprint Lithography NANO LETTERS xxxx Vol. 0, No. 0 A-E G. Y. Jung, S. Ganapathiappan, Douglas A. A. Ohlberg, Deirdre L. Olynick,

More information

Genesis of Friction between Macroscale contacts. Reference: Chapter 3 of the text books

Genesis of Friction between Macroscale contacts. Reference: Chapter 3 of the text books Genesis of Friction between Macroscale contacts Reference: Chapter 3 of the text books What is friction? F = W s µ varies as a function of the sliding distance. 1 0.6 0.2 0 0 20 40 60 80 Di stan ce slid

More information

A Study on Injection Moulding of Two Different Pottery Bodies

A Study on Injection Moulding of Two Different Pottery Bodies A Study on Injection Moulding of Two Different Pottery Bodies M. Y. Anwar 1, M. Zubair 1, M. Ajmal 1, and M. T. Z. Butt 2 1. Department of Metallurgical & Materials Engineering, UET Lahore. 2. Faculty

More information

Mater. Res. Soc. Symp. Proc. Vol Materials Research Society

Mater. Res. Soc. Symp. Proc. Vol Materials Research Society Mater. Res. Soc. Symp. Proc. Vol. 940 2006 Materials Research Society 0940-P13-12 A Novel Fabrication Technique for Developing Metal Nanodroplet Arrays Christopher Edgar, Chad Johns, and M. Saif Islam

More information

Multiphoton lithography based 3D micro/nano printing Dr Qin Hu

Multiphoton lithography based 3D micro/nano printing Dr Qin Hu Multiphoton lithography based 3D micro/nano printing Dr Qin Hu EPSRC Centre for Innovative Manufacturing in Additive Manufacturing University of Nottingham Multiphoton lithography Also known as direct

More information

LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS. Dr. Saad Ahmed XENON Corporation November 19, 2015

LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS. Dr. Saad Ahmed XENON Corporation November 19, 2015 LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS Dr. Saad Ahmed XENON Corporation November 19, 2015 Topics Introduction to Pulsed Light Photonic sintering for Printed Electronics R&D Tools for

More information

Final Year Project Proposal 1

Final Year Project Proposal 1 Final Year Project Proposal 1 Mechanical testing for high temperature polymers Mr Eric Phua Jian Rong (JRPhua@ntu.edu.sg) In offshore subsea drilling, different types of microelectronics devices and sensors

More information

Deep Lithography for Microfabrication

Deep Lithography for Microfabrication Deep Lithography for Microfabrication Part 2: UV Deep Lithography (UVDL) Luiz O. S. Ferreira Mechanical Engineering Faculty Campinas State University UNICAMP Campinas SP - BRAZIL lotavio@fem.unicamp.br

More information

Engineered Adhesive Solutions

Engineered Adhesive Solutions Our expertise is your success Engineered dhesive Solutions For the Smart ard & Identification Industry Your partner Scapa is a global leading supplier of technical adhesive tapes and films to major industries

More information

Vertically aligned Ni magnetic nanowires fabricated by diblock-copolymer-directed Al thin film anodization

Vertically aligned Ni magnetic nanowires fabricated by diblock-copolymer-directed Al thin film anodization Vertically aligned Ni magnetic nanowires fabricated by diblock-copolymer-directed Al thin film anodization Researcher: Kunbae (Kevin) Noh, Graduate Student, MAE Dept. and CMRR Collaborators: Leon Chen,

More information

High Temperature Resistant Adhesives Beat the Heat

High Temperature Resistant Adhesives Beat the Heat High Resistant Adhesives Beat the Heat Too hot, too cold or just right? It s not just a question for Goldilocks. Engineers have to be even better judges of temperature when they select a materials system

More information

Positive Photoresists

Positive Photoresists Positive Photoresists Gesellschaft für chemische Materialien spezieller Photoresistsysteme mbh Positive Photoresists map 1200 series Thick resists map 1275, map 1275 HV Unique features of the positive

More information

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages Michael Hertl 1, Diane Weidmann 1, and Alex Ngai 2 1 Insidix, 24 rue du Drac, F-38180 Grenoble/Seyssins,

More information

Process considerations to achieve optimum weld strengths of Wood Plastics Composites using advanced Vibration Welding technology

Process considerations to achieve optimum weld strengths of Wood Plastics Composites using advanced Vibration Welding technology Process considerations to achieve optimum weld strengths of Wood Plastics Composites using advanced Vibration Welding technology Michael J. Johnston, Dukane Corporation As the uses for Wood Plastic Composites

More information

NPL Manual. Modelling Creep in Toughened Epoxy Adhesives

NPL Manual. Modelling Creep in Toughened Epoxy Adhesives NPL Manual Modelling Creep in Toughened Epoxy Adhesives This Electronic Guide was produced as part of the Measurements for Materials System Programme on Design for Fatigue and Creep in Joined Systems Introduction

More information

EE C245 ME C218 Introduction to MEMS Design Fall 2011

EE C245 ME C218 Introduction to MEMS Design Fall 2011 Lecture Outline EE C245 ME C218 Introduction to MEMS Design Fall 2011 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720

More information

EXPERIMENTAL INVESTIGATION ON COOLING RATE FOR CENTRIFUGAL CASTING Kirti Kanaujiya, Yugesh Mani Tiwari Department of Mechanical Engineering

EXPERIMENTAL INVESTIGATION ON COOLING RATE FOR CENTRIFUGAL CASTING Kirti Kanaujiya, Yugesh Mani Tiwari Department of Mechanical Engineering ISSN 2320-9135 1 International Journal of Advance Research, IJOAR.org Volume 3, Issue 9, September 2015, Online: ISSN 2320-9135 EXPERIMENTAL INVESTIGATION ON COOLING RATE FOR CENTRIFUGAL CASTING Kirti

More information

NORTH AMERICA EPOXY CURING AGENTS EPOXY

NORTH AMERICA EPOXY CURING AGENTS EPOXY NORTH AMERICA EPOXY CURING AGENTS EPOXY A ROBUST TOOLBOX TO MEET DIVERSE FORMULATION AND END-USE REQUIREMENTS With a heritage built on more than 60 continuous years in the industry, Olin is the reliable

More information

Enabling Technology in Thin Wafer Dicing

Enabling Technology in Thin Wafer Dicing Enabling Technology in Thin Wafer Dicing Jeroen van Borkulo, Rogier Evertsen, Rene Hendriks, ALSI, platinawerf 2G, 6641TL Beuningen Netherlands Abstract Driven by IC packaging and performance requirements,

More information

PULSED LASER WELDING

PULSED LASER WELDING PULSED LASER WELDING Girish P. Kelkar, Ph.D. Girish Kelkar, Ph.D, WJM Technologies, Cerritos, CA 90703, USA Laser welding is finding growing acceptance in field of manufacturing as price of lasers have

More information

Extrusion. Key Issues to Address. Lecture 2. Process. Process Variants. Process Analysis. Problem Solving

Extrusion. Key Issues to Address. Lecture 2. Process. Process Variants. Process Analysis. Problem Solving Extrusion Lecture 2 Chapter 4 Key Issues to Address Process Process Variants Process Analysis Problem Solving S.V. Atre 1 Extrusion Material is forced to flow through a die orifice to provide long continuous

More information

Chapter 14 Polymers CHAPTER 7 POLYMERIC MATERIALS. Ancient Polymer History. Rubber balls used by Incas Noah used pitch (a natural polymer) for the ark

Chapter 14 Polymers CHAPTER 7 POLYMERIC MATERIALS. Ancient Polymer History. Rubber balls used by Incas Noah used pitch (a natural polymer) for the ark Chapter 14 Polymers What is a polymer? Polymers are organic materials made of very large molecules containing hundreds of thousands of unit molecules called mers linked in a chain-like structure (repeated

More information

Syl-Off Solventless, Platinum-Catalyzed Vinyl Silicone Release Coatings from Dow Corning

Syl-Off Solventless, Platinum-Catalyzed Vinyl Silicone Release Coatings from Dow Corning Release System Information Guide Syl-Off Solventless, Platinum-Catalyzed Vinyl Silicone Release Coatings from Dow Corning General Information Syl-Off brand solventless, platinum-catalyzed vinyl silicone

More information

HIGH-THROUGHPUT, CONTINUOUS NANOPATTERNING TECHNOLOGIES FOR DISPLAY AND ENERGY APPLICATIONS

HIGH-THROUGHPUT, CONTINUOUS NANOPATTERNING TECHNOLOGIES FOR DISPLAY AND ENERGY APPLICATIONS HIGH-THROUGHPUT, CONTINUOUS NANOPATTERNING TECHNOLOGIES FOR DISPLAY AND ENERGY APPLICATIONS by Se Hyun Ahn A dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of

More information

Thermoset Solutions for Fuel Cell Seals

Thermoset Solutions for Fuel Cell Seals Thermoset Solutions for Fuel Cell Seals Daniel Ramrus, Sr. Research Scientist, PhD. Daniel.Ramrus@ballard.com* Paul Kozak, R&D Manager, P. Eng., MBA. Paul.Kozak@ballard.com* Date of presentation: September

More information

Supporting informations

Supporting informations Supporting informations Microfluidic with integrated microfilter of conical-shaped holes for high efficiency and high purity capture of circulating tumor cells Yadong Tang 1+, Jian Shi 2+, Sisi Li 1, Li

More information

PS-101 Preparing for Your Success

PS-101 Preparing for Your Success PS-101 Preparing for Your Success The Pressure-sensitive Label Construction Module 4: Adhesives Pressure-Sensitive Adhesive Features Coating Technology Adhesive Chemistry Adhesive Selection Criteria &

More information

Optimizing spray coater process parameters

Optimizing spray coater process parameters Optimizing spray coater process parameters Dr. Eleonora Storace, Florian Palitschka, Dr. Dietrich Tönnies SUSS MicroTec Lithography GmbH Germany Published in the SUSS report 01/2014 E-mail: info@suss.com

More information

3. Mechanical Properties of Materials

3. Mechanical Properties of Materials 3. Mechanical Properties of Materials 3.1 Stress-Strain Relationships 3.2 Hardness 3.3 Effect of Temperature on Properties 3.4 Fluid Properties 3.5 Viscoelastic Properties Importance of Mechanical Properties

More information

Performance and productivity.

Performance and productivity. Product Comparison Guide 3M Dynamar Polymer Processing Additives Performance and productivity. Proven technology from 3M, engineered for a smoother extrusion process from start to finish. Improve processing

More information

Integration of Block-Copolymer with Nano- Imprint Lithography: Pushing the Boundaries of Emerging Nano-Patterning Technology

Integration of Block-Copolymer with Nano- Imprint Lithography: Pushing the Boundaries of Emerging Nano-Patterning Technology Integration of Block-Copolymer with Nano- Imprint Lithography: Pushing the Boundaries of Emerging Nano-Patterning Technology April 2010 update SNL Geoff Brennecka (PI) Bruce Burckel Matt George Jack Skinner

More information

Metallization deposition and etching. Material mainly taken from Campbell, UCCS

Metallization deposition and etching. Material mainly taken from Campbell, UCCS Metallization deposition and etching Material mainly taken from Campbell, UCCS Application Metallization is back-end processing Metals used are aluminum and copper Mainly involves deposition and etching,

More information

Module 3 Machinability. Version 2 ME IIT, Kharagpur

Module 3 Machinability. Version 2 ME IIT, Kharagpur Module 3 Machinability Lesson 14 Failure of cutting tools and tool life Instructional objectives At the end of this lesson, the students will be able to (i) (ii) (iii) (iv) (v) State how the cutting tools

More information

Introduction to Dynamic Mechanical Testing for Rubbers and Elastomers. Mackenzie Geiger Applications Scientist September 6, 2017

Introduction to Dynamic Mechanical Testing for Rubbers and Elastomers. Mackenzie Geiger Applications Scientist September 6, 2017 Introduction to Dynamic Mechanical Testing for Rubbers and Elastomers Mackenzie Geiger Applications Scientist September 6, 2017 Is DMA Thermal Analysis or Rheology? Definitions Thermal Analysis measurement

More information

Table of Contents. Robert A. Malloy. Plastic Part Design for Injection Molding. An Introduction ISBN:

Table of Contents. Robert A. Malloy. Plastic Part Design for Injection Molding. An Introduction ISBN: Table of Contents Robert A. Malloy Plastic Part Design for Injection Molding An Introduction ISBN: 978-3-446-40468-7 For further information and order see http://www.hanser.de/978-3-446-40468-7 or contact

More information

Laser Welding of Engineering Plastics

Laser Welding of Engineering Plastics Laser Welding of Engineering Plastics Technical Information Further information on individual products: www.ultramid.de www.ultradur-lux.basf.com www.ultrason.de www.plasticsportal.eu/ultraform 2 LASER

More information

3 Thermally Conductive Tapes

3 Thermally Conductive Tapes 3 Thermally Conductive Tapes Technical Data July, 21 Product Description 3M Thermally Conductive Tapes 885, 881, and 8815 are designed to provide a preferential heat-transfer path between heat-generating

More information

DIRECT LASER SINTERING OF BOROSILICATE GLASS

DIRECT LASER SINTERING OF BOROSILICATE GLASS DIRECT LASER SINTERING OF BOROSILICATE GLASS F. Klocke, A. McClung and C. Ader Fraunhofer Institute for Production Technology IPT, Aachen, Germany Reviewed, accepted August 4, 2004 Abstract Despite the

More information

Module 3 Selection of Manufacturing Processes. IIT Bombay

Module 3 Selection of Manufacturing Processes. IIT Bombay Module 3 Selection of Manufacturing Processes Lecture 3 Design for Bulk Deformation Processes Instructional objectives By the end of this lecture, the students are expected to learn the working principle

More information