Seminar Micro- and Nano-technology
|
|
- Gabriella Freeman
- 6 years ago
- Views:
Transcription
1 Seminar Micro- and Nano-technology Seminar 1 Schedule Wednesday 17:45-18:30 Yannick Bourgin yannick.bourgin@uni-jena.de Phone: +49(3641)
2 Presentations 2 Presentation by 2 students 25 minutes presentation 15 minutes questions From the audience and then from me General informations Head lines Numering slides An introduction to the subject A conclusion
3 Criterion 3 Target Self-learning about a topic Synthetise informations Exposing and transmiting some information Be active!! You are at a master level Inactivity makes the seminar very boring for everybody Good to know... I do have internet I know wikipedia I was a student I have the presentations of the previous years
4 Criterion 4 The authors Self presentation (position, dressing, speaking...) English skills The talk Content is clear The targeted objectives are well presented Easy to follow Questions Quality and clarity of the answers
5 MNT seminar SS15 calendar 5 Presentation schedule Date Topic Students 13/05/2015 Clean Room and Cleaning Techniques 20/05/2015 Resist coating techniques 2 27/05/2015 Photo resists 2 03/06/2015 AFM 2 10/06/2015 SEM/FIB 2 17/06/2015 Diamond Turning 2 24/06/2015 Nano imprint litho/roll to roll 01/07/2015 Self Assembly Double/Q/O Patterning - LELE 08/07/2015 Direct self assembly
6 Clean room and cleaning techniques 6 Why working in clean room? Clean room classes (ISO normes) and dressing.. How a clean room works. Contaminant sources. Typical substrates used in micro-optics: Si, SiO2, glass Cleaning methods: Wet and dry Standart wet cleaning RCA Ultra sonic Plasma ashing Cleaning after the fabrication
7 Resist coating techniques 7 Spin coating wafer syringe dispensed fluid Principle and equipment Basic physics model Spin coating defects Dip coating Spray coating Thickness measurment of resist vacuum chuck Spin parameter settings
8 Photo resists 8 Resists properties tone (positive, negative) CD Thickness, sensitivity (l), dose... Photoresist structure (resin, solvent, photoactive compound) Photoresist processing (do not focus on the coating!!) Adhesion on substrate Baking (why?) Development Chemistry (reaction to UV light) Optical parameters (dill, cauchy)
9 Atomic Force Microscope 9 How an AFM works Forces involved Different type of operation (contact, non contact, tapping) Advantages and drawbacks Using AFM to make nano-structures
10 Scanning Electron Micrope Focussed Ion Beam 10 How a SEM works (principle, sources, detector) Electron-matter interaction (secondary or back scattered e, Auger e, X-ray) Preparation of the sample How a FIB works Different type of characterization (profile, chemistry) Advantages and drawbacks Using FIB to make nano-structures
11 Diamond Turning 11 Methode used (diamond turning, milling, shaping) Raster cutting Requirement for micro-optics For which kind of component
12 Nano Imprint Lithography roll to roll 12 Principle Thermal NIL UV-NIL Materials used Operation types (full wafer VS step and repeat) Introduction to the roll to roll technique
13 Self Assembly Double patterning Litho Etch Litho Etch 13 Principle of SADP Materials used SA Quadruple and Octuple Patterning Double exposure/lele Applications-resolution
14 Direct Self Assembly 14 Principle (What is DSA?) Phase diagramm of block copolymer Graphoepitaxy VS Chemoepitaxy Resolution Applications
15 Useful links 15 Interested links Some company provides free materials or courses: The Dow chemical company, Nikon, ASML... Microchemical Some university as well (MIT...) Read article and recent papers, lithography is field that progress quickly
16 MNT seminar SS15 calendar 16 Date Topic Students 13/05/2015 Clean Room and Cleaning Techniques -Johannes Wilde -Manuel Hopf 20/05/2015 Resist coating techniques -Vivek Beladiya -Mohammadreza Younesi 27/05/2015 Photo resists -Felix Kröger -Martina Riuz 03/06/2015 AFM -Olga Rusykina -Liyenn Song 10/06/2015 SEM/FIB -Malte Siems -Henning Stark 17/06/2015 Diamond Turning -Jui-hsin Chen -Ming-Snng Chao 24/06/2015 Nano imprint litho/roll to roll -Justus Bohn -Sabine Stück 01/07/2015 Self Assembly Double/Q/O Patterning - LELE -Gerrit Feldkamp -Parijat Barman 08/07/2015 Direct self assembly -Hui Zhou -Anda-Maria Tafrosi -Cristina Madonna Maqnedo
Photolithography I ( Part 2 )
1 Photolithography I ( Part 2 ) Chapter 13 : Semiconductor Manufacturing Technology by M. Quirk & J. Serda Bjørn-Ove Fimland, Department of Electronics and Telecommunication, Norwegian University of Science
More informationPhotoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller
ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Photoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller Webpage: http://www.rit.edu/lffeee 82 Lomb Memorial Drive Rochester, NY 14623-5604
More informationmicro resist technology
Characteristics Processing guidelines Negative Tone Photoresist Series ma-n 2400 ma-n 2400 is a negative tone photoresist series designed for the use in micro- and nanoelectronics. The resists are available
More informationStatus of the DESY NanoLab Project
Status of the DESY NanoLab Project Ralf Röhlsberger DESY Wissenschaftlicher Ausschuss DESY 7 June 2011 Mission of the DESY NanoLab To accomodate the growing need for structural probes on the nanoscale,
More informationProcessing guidelines
Processing guidelines mr-uvcur21 series UV-curable Polymer for UV-based Nanoimprint Lithography Characteristics mr-uvcur21 is a liquid UV-curable polymer system with low viscosity and high curing rate
More informationProcessing guidelines. Negative Tone Photoresist Series ma-n 2400
Characteristics Processing guidelines Negative Tone Photoresist Series ma-n 2400 ma-n 2400 is a negative tone photoresist series designed for the use in micro- and nanoelectronics. The resists are available
More informationLithography Tool Package
4. Development Thomas Anhøj and Tine Greibe Outline 1. Introduction Process steps in UV lithography 2. Spin coating Resist composition Pre-treatment Principle Softbake Spin curve 3. Exposure Hardware Process
More informationTechnical Data Sheet Technisches Datenblatt
AZ ECI 3000 Photoresist Universal i-line/crossover Photoresist Series GENERAL INFORMATION AZ ECI 3000 photoresist series are a family of fast positive resists with high resolution capabilities (0.4 µm
More informationMCC. NANO PMMA and Copolymer
MCC PRODUCT ATTRIBUTES NANO and Submicron linewidth control (polymethyl methacrylate) is a versatile polymeric material that is well suited Sub 0.1µm imaging for many imaging and non-imaging microelectronic
More informationLarge-area patterning by roller-based nanoimprint lithography
JOANNEUM RESEARCH Forschungsgesellschaft Institute MATERIALS, Weiz, Austria Large-area patterning by roller-based nanoimprint lithography Ursula Palfinger, Dieter Nees, Stephan Ruttloff, Markus Leitgeb,
More informationMCC. PMGI Resists NANO PMGI RESISTS OFFER RANGE OF PRODUCTS
MCC PMGI RESISTS OFFER Sub.25µm lift-off processing Film thicknesses from 5µm Choice of resin blends for optimal undercut control High thermal stability Superior adhesion to Si, NiFe, GaAs, InP
More informationLab #2 Wafer Cleaning (RCA cleaning)
Lab #2 Wafer Cleaning (RCA cleaning) RCA Cleaning System Used: Wet Bench 1, Bay1, Nanofabrication Center Chemicals Used: H 2 O : NH 4 OH : H 2 O 2 (5 : 1 : 1) H 2 O : HF (10 : 1) H 2 O : HCl : H 2 O 2
More informationIntegration of Block-Copolymer with Nano- Imprint Lithography: Pushing the Boundaries of Emerging Nano-Patterning Technology
Integration of Block-Copolymer with Nano- Imprint Lithography: Pushing the Boundaries of Emerging Nano-Patterning Technology April 2010 update SNL Geoff Brennecka (PI) Bruce Burckel Matt George Jack Skinner
More informationAdvanced developer-soluble gap-fill materials and applications
Advanced developer-soluble gap-fill materials and applications Runhui Huang, Dan Sullivan, Anwei Qin, Shannon Brown Brewer Science, Inc., 2401 Brewer Dr., Rolla, MO, USA, 65401 ABSTRACT For the via-first
More informationAjay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University
2014 Ajay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University Page1 Syllabus UNIT 1 Introduction to VLSI Technology: Classification of ICs, Scale of integration,
More informationINTERVIA BPP-10 Photoresist
Technical Data Sheet INTERVIA BPP-10 Photoresist For Advanced Packaging Applications Description Regional Product Availability Advantages INTERVIA BPP-10 Photoresist is a general-purpose, multi-wavelength
More information1500 Series. EMD PeRFoRmaNce MaTeRIaLs. technical datasheet. Positive Tone Photoresists APPLICATION TYPICAL PROCESS. SPIN CURVES (150mm wafers)
EMD PeRFoRmaNce MaTeRIaLs technical datasheet AZ 1500 Series Positive Tone Photoresists APPLICATION General purpose positive tone photoresists featuring excellent substrate adhesion for demanding wet etch
More informationMicro and nano structuring of carbon based materials for micro injection moulding and hot embossing
Micro and nano structuring of carbon based materials for micro injection moulding and hot embossing Victor Usov, Graham Cross, Neal O Hara, Declan Scanlan, Sander Paulen, Chris de Ruijter, Daniel Vlasveld,
More informationMetallization deposition and etching. Material mainly taken from Campbell, UCCS
Metallization deposition and etching Material mainly taken from Campbell, UCCS Application Metallization is back-end processing Metals used are aluminum and copper Mainly involves deposition and etching,
More informationNovel Spin on Planarization Technology by Photo Curing SOC (P-SOC)
Journal of Photopolymer Science and Technology Volume 3, Number 3 (17) 373-378 C 17SPST Technical Paper Novel Spin on Planarization Technology by Photo Curing (P-) Takafumi Endo*, Rikimaru Sakamoto, Keisuke
More informationX-ray Photoelectron Spectroscopy
X-ray Photoelectron Spectroscopy X-ray photoelectron spectroscopy (XPS) is a non-destructive technique used to analyze the elemental compositions, chemical and electronic states of materials. XPS has a
More informationMicrocontact Printing Procedures for Adhesive and Conductive Epoxies
Microcontact Printing Procedures for Adhesive and Conductive Epoxies This objective was accomplished through a formal record of the procedures to deliver a stamped product which met the benchmark mechanical,
More informationVia Fill in Small Trenches using Hot Aluminum Process. By Alice Wong
Via Fill in Small Trenches using Hot Aluminum Process By Alice Wong Goals for Project Good Via Fill in Small contact holes using hot aluminum process Be able to get good images of the contact holes using
More informationCu Wiring Process for TFTs - Improved Hydrogen Plasma Resistance with a New Cu Alloy -
Cu Wiring Process for TFTs - Improved Hydrogen Plasma Resistance with a New Cu Alloy - Masanori Shirai*, Satoru Takazawa*, Satoru Ishibashi*, Tadashi Masuda* As flat-screen TVs become larger and their
More informationSurface Preparation and Cleaning Conference April 19-20, 2016, Santa Clara, CA, USA. Nano-Bio Electronic Materials and Processing Lab.
Surface Preparation and Cleaning Conference April 19-20, 2016, Santa Clara, CA, USA Issues on contaminants on EUV mask Particle removal on EUV mask surface Carbon contamination removal on EUV mask surface
More informationEE40 Lec 22. IC Fabrication Technology. Prof. Nathan Cheung 11/19/2009
Suggested Reading EE40 Lec 22 IC Fabrication Technology Prof. Nathan Cheung 11/19/2009 300mm Fab Tour http://www-03.ibm.com/technology/manufacturing/technology_tour_300mm_foundry.html Overview of IC Technology
More informationVLSI Technology. By: Ajay Kumar Gautam
By: Ajay Kumar Gautam Introduction to VLSI Technology, Crystal Growth, Oxidation, Epitaxial Process, Diffusion Process, Ion Implantation, Lithography, Etching, Metallization, VLSI Process Integration,
More informationUV5 POSITIVE DUV PHOTORESIST For Microlithography Applications
UV5 POSITIVE DUV PHOTORESIST For Microlithography Applications DESCRIPTION UV5 positive DUV photoresist has been optimized to provide vertical profile imaging of isolated and semidense features for device
More informationSpecimen Preparation Technique for a Microstructure Analysis Using the Focused Ion Beam Process
Specimen Preparation Technique for a Microstructure Analysis Using the Focused Ion Beam Process by Kozue Yabusaki * and Hirokazu Sasaki * In recent years the FIB technique has been widely used for specimen
More informationSub-5 nm Structures Process Development and Fabrication Over Large Areas
A S Jugessur,, 2017, 1:1 SciFed Nanotech Research Letters Research Article Open Access Sub-5 nm Structures Process Development and Fabrication Over Large Areas * A S Jugessur * University of Iowa Microfabrication
More informationEE C245 ME C218 Introduction to MEMS Design Fall 2011
Lecture Outline EE C245 ME C218 Introduction to MEMS Design Fall 2011 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720
More informationElectron Beam Induced Processes and their Applicability to Mask Repair
& Electron Beam Induced Processes and their Applicability to Mask Repair Hans W.P. Koops (1), Volker Boegli (1), Klaus Edinger (1), Johannes Bihr (2), Jens Greiser (2), (1) NaWoTec GmbH Rossdorf Germany
More informationFIB mask repair technology for EUV mask 1. INTRODUCTION
FIB mask repair technology for EUV mask Tsuyoshi Amano*, Yasushi Nishiyama*, iroyuki Shigemura*, Tsuneo Terasawa*, Osamu Suga*, Kensuke Shiina**, Fumio Aramaki**, Anto Yasaka** Tsukasa Abe***, iroshi Mohri***
More informationBlisters formation mechanism during High Dose Implanted Resist Stripping
Blisters formation mechanism during High Dose Implanted Resist Stripping Marion Croisy a,b,c*, Cécile Jenny a, Claire Richard a, Denis Guiheux a, Sylvain Joblot a, Alain Campo b, Erwine Pargon c, Nicolas
More informationFrom microelectronics down to nanotechnology.
From microelectronics down to nanotechnology sami.franssila@tkk.fi Contents Lithography: scaling x- and y-dimensions MOS transistor physics Scaling oxide thickness (z-dimension) CNT transistors Conducting
More information125nXT Series. EMD PeRFoRmaNce MaTeRIaLs. technical datasheet. Photopolymer Negative Tone Photoresists APPLICATION TYPICAL PROCESS THICKNESS GRADES
EMD PeRFoRmaNce MaTeRIaLs technical datasheet AZ 125nXT Series Photopolymer Negative Tone Photoresists APPLICATION Thick photopolymer photoresists featuring aspect ratios and photospeed not possible with
More informationSurface micromachining and Process flow part 1
Surface micromachining and Process flow part 1 Identify the basic steps of a generic surface micromachining process Identify the critical requirements needed to create a MEMS using surface micromachining
More informationSU Permanent Epoxy Negative Photoresist PROCESSING GUIDELINES FOR:
SU-8 2000 Permanent Epoxy Negative Photoresist PROCESSING GUIDELINES FOR: SU-8 2100 and SU-8 2150 www.microchem.com SU-8 2000 is a high contrast, epoxy based photoresist designed for micromachining and
More informationLecture 6. Through-Wafer Interconnect. Agenda: Through-wafer Interconnect Polymer MEMS. Through-Wafer Interconnect -1. Through-Wafer Interconnect -2
Agenda: EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie Lecture 6 Through-wafer Interconnect EEL6935 Advanced MEMS 2005 H. Xie 1/21/2005 1 Motivations: Wafer-level packaging CMOS 3D Integration
More informationOptimizing spray coater process parameters
Optimizing spray coater process parameters Dr. Eleonora Storace, Florian Palitschka, Dr. Dietrich Tönnies SUSS MicroTec Lithography GmbH Germany Published in the SUSS report 01/2014 E-mail: info@suss.com
More informationPROCESSING OF INTEGRATED CIRCUITS
PROCESSING OF INTEGRATED CIRCUITS Overview of IC Processing (Part I) Silicon Processing Lithography Layer Processes Use in IC Fabrication (Part II) Integrating the Fabrication Steps IC Packaging (Part
More informationSimple method for formation of nanometer scale holes in membranes. E. O. Lawrence Berkeley National Laboratory, Berkeley, CA 94720
Simple method for formation of nanometer scale holes in membranes T. Schenkel 1, E. A. Stach, V. Radmilovic, S.-J. Park, and A. Persaud E. O. Lawrence Berkeley National Laboratory, Berkeley, CA 94720 When
More informationFABRICATION FOR MICRO PATTERNS OF NICKEL MATRIX DIAMOND COMPOSITES USING THE COMPOSITE ELECTROFORMING AND UV- LITHOGRAPHY
16 TH INTERNATIONAL CONFERENCE ON COMPOSITE MATERIALS FABRICATION FOR MICRO PATTERNS OF NICKEL MATRIX DIAMOND COMPOSITES USING THE COMPOSITE ELECTROFORMING AND UV- LITHOGRAPHY Tsung-Han Yu, Shenq-Yih Luo,
More informationProcess Flow in Cross Sections
Process Flow in Cross Sections Process (simplified) 0. Clean wafer in nasty acids (HF, HNO 3, H 2 SO 4,...) --> wear gloves! 1. Grow 500 nm of SiO 2 (by putting the wafer in a furnace with O 2 2. Coat
More informationAvatrel Stress Buffer Coatings: Low Stress Passivation and Redistribution Applications
Avatrel Stress Buffer Coatings: Low Stress Passivation and Redistribution Applications Ed Elce, Chris Apanius, Jeff Krotine, Jim Sperk, Andrew Bell, Rob Shick* Sue Bidstrup-Allen, Paul Kohl Takashi Hirano,
More informationFilling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology
Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology R.K. Trichur, M. Fowler, J.W. McCutcheon, and M. Daily Brewer Science, Inc. 2401 Brewer Drive Rolla, MO
More informationPositive Photoresists
Positive Photoresists Gesellschaft für chemische Materialien spezieller Photoresistsysteme mbh Positive Photoresists map 1200 series Thick resists map 1275, map 1275 HV Unique features of the positive
More informationBulk MEMS Fabrication Blog 2017 Dr. Lynn Fuller, Casey Gonta, Patsy Cadareanu
ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Bulk MEMS Fabrication Blog 2017 Dr. Lynn Fuller, Casey Gonta, Patsy Cadareanu Webpage: http://people.rit.edu/lffeee 82 Lomb Memorial Drive
More informationFabrication Technology
Fabrication Technology By B.G.Balagangadhar Department of Electronics and Communication Ghousia College of Engineering, Ramanagaram 1 OUTLINE Introduction Why Silicon The purity of Silicon Czochralski
More informationMultiphoton lithography based 3D micro/nano printing Dr Qin Hu
Multiphoton lithography based 3D micro/nano printing Dr Qin Hu EPSRC Centre for Innovative Manufacturing in Additive Manufacturing University of Nottingham Multiphoton lithography Also known as direct
More informationLeveraging the Precision of Electroforming over Alternative Processes When Developing Nano-scale Structures
VOLUME 4 - ELECTROFORMING Leveraging the Precision of over Alternative Processes When Developing Nano-scale Structures Electrical and mechanical component and subsystem designers generally have five techniques
More informationUltra High Barrier Coatings by PECVD
Society of Vacuum Coaters 2014 Technical Conference Presentation Ultra High Barrier Coatings by PECVD John Madocks & Phong Ngo, General Plasma Inc., 546 E. 25 th Street, Tucson, Arizona, USA Abstract Silicon
More informationAdvances in Intense Pulsed Light Solutions For Display Manufacturing. XENON Corporation Dr. Saad Ahmed Japan IDW 2016
Advances in Intense Pulsed Light Solutions For Display Manufacturing XENON Corporation Dr. Saad Ahmed Japan IDW 2016 Talk Outline Introduction to Pulsed Light Applications in Display UV Curing Applications
More informationDuPont MX5000 Series
DuPont MX5000 Series DATA SHEET & PROCESSING INFORMATION High Performance Multi-Purpose Polymer Film for MEMS Applications PRODUCT FEATURES/ APPLICATIONS Negative working, aqueous processable dry film
More informationEV Group 300mm Wafer Bonding Technology July 16, 2008
EV Group 300mm Wafer Bonding Technology July 16, 2008 EV Group in a Nutshell st Our philosophy Our mission in serving next generation application in semiconductor technology Equipment supplier for the
More informationHybrid BARC approaches for FEOL and BEOL integration
Hybrid BARC approaches for FEOL and BEOL integration Willie Perez a, Stephen Turner a, Nick Brakensiek a, Lynne Mills b, Larry Wilson b, Paul Popa b a Brewer Science, Inc., 241 Brewer Dr., Rolla, MO 6541
More informationApplication of Coating Technology on the Zirconium-Based Alloy to Decrease High-Temperature Oxidation
Application of Coating Technology on the Zirconium-Based Alloy to Decrease High-Temperature Oxidation Hyun-Gil Kim*, Il-Hyun Kim, Jeong-Yong Park, Yang-Hyun Koo, KAERI, 989-111 Daedeok-daero, Yuseong-gu,
More informationDeforming water droplet with a superhydrophobic silica coating
Supplementary Information for Deforming water droplet with a superhydrophobic silica coating Xiaoguang Li*, Jun Shen Shanghai Key Laboratory of Special Artificial Microstructure Materials and Technology,
More informationVertically aligned Ni magnetic nanowires fabricated by diblock-copolymer-directed Al thin film anodization
Vertically aligned Ni magnetic nanowires fabricated by diblock-copolymer-directed Al thin film anodization Researcher: Kunbae (Kevin) Noh, Graduate Student, MAE Dept. and CMRR Collaborators: Leon Chen,
More informationAlternative Methods of Yttria Deposition For Semiconductor Applications. Rajan Bamola Paul Robinson
Alternative Methods of Yttria Deposition For Semiconductor Applications Rajan Bamola Paul Robinson Origin of Productivity Losses in Etch Process Aggressive corrosive/erosive plasma used for etch Corrosion/erosion
More informationFabrication and STM Nanostructuring of tetrahedral amorphous Carbon. Teja Roch
Fabrication and STM Nanostructuring of tetrahedral amorphous Carbon Teja Roch Fabrication and STM Nanostructuring of tetrahedral amorphous Carbon (ta-c) Content: Who are we? What are we doing? Why are
More informationTSV Interposer Process Flow with IME 300mm Facilities
TSV Interposer Process Flow with IME 300mm Facilities Property of Institute of Microelectronics (IME)-Singapore August 17, 2012 Outline 1. TSV interposer (TSI) cross sectional schematic TSI with BEOL,
More informationInnovation Creativity customer-specific solutions. Product information PHOTORESISTS
Product information PHOTORESISTS 1 Customer-specific solutions THE ALLRESIST GMBH Company for chemical Products OUR NEWS for Microstructuring As of January 2016 The executive board The company is represented
More informationFabrication Techniques for Thin-Film Silicon Layer Transfer
Fabrication Techniques for Thin-Film Silicon Layer Transfer S. L. Holl a, C. A. Colinge b, S. Song b, R. Varasala b, K. Hobart c, F. Kub c a Department of Mechanical Engineering, b Department of Electrical
More informationKGC SCIENTIFIC Making of a Chip
KGC SCIENTIFIC www.kgcscientific.com Making of a Chip FROM THE SAND TO THE PACKAGE, A DIAGRAM TO UNDERSTAND HOW CPU IS MADE? Sand CPU CHAIN ANALYSIS OF SEMICONDUCTOR Material for manufacturing process
More informationOptical Waveguides In BenzoCyclobutene (BCB ) Polymer
Jurnal Teknologi, 53 September 2010: 49 56 Universiti Teknologi Malaysia Optical Waveguides In BenzoCyclobutene (BCB 4024-40) Polymer Mohd Haniff Ibrahim 1*, Norazan Mohd Kassim 2, Abu Bakar Mohammad 3,
More informationLecture 19 Microfabrication 4/1/03 Prof. Andy Neureuther
EECS 40 Spring 2003 Lecture 19 Microfabrication 4/1/03 Prof. ndy Neureuther How are Integrated Circuits made? Silicon wafers Oxide formation by growth or deposition Other films Pattern transfer by lithography
More informationGenesis of Friction between Macroscale contacts. Reference: Chapter 3 of the text books
Genesis of Friction between Macroscale contacts Reference: Chapter 3 of the text books What is friction? F = W s µ varies as a function of the sliding distance. 1 0.6 0.2 0 0 20 40 60 80 Di stan ce slid
More informationHow To Write A Flowchart
1 Learning Objectives To learn how you transfer a device concept into a process flow to fabricate the device in the EKL labs You learn the different components that makes up a flowchart; process blocks,
More informationTowards scalable fabrication of high efficiency polymer solar cells
Towards scalable fabrication of high efficiency polymer solar cells Hui Joon Park 2*, Myung-Gyu Kang 1**, Se Hyun Ahn 3, Moon Kyu Kang 1, and L. Jay Guo 1,2,3 1 Department of Electrical Engineering and
More informationUTILIZATION OF ATMOSPHERIC PLASMA SURFACE PREPARATION TO IMPROVE COPPER PLATING PROCESSES.
SESSION 14 MATERIALS AND PROCESSES FOR ADVANCED PACKAGING UTILIZATION OF ATMOSPHERIC PLASMA SURFACE PREPARATION TO IMPROVE COPPER PLATING PROCESSES. Eric Schulte 1, Gilbert Lecarpentier 2 SETNA Corporation
More informationElectron Beam Lithography - key enabling technology in nanofabrication. Frank Dirne
Electron Beam Lithography - key enabling technology in nanofabrication Frank Dirne Moore s Law (x2/2 yr) Moore s Law EBL Electron Beam Lithography - key enabling technology in nanofabrication - Principles
More informationSoft-lithography for Preparing Patterned Liquid Crystal Orientations
2007 KIDS Soft-lithography for Preparing Patterned Liquid Crystal Orientations Hak-Rin Kim **a, Jong-Wook Jung **a, Min-Soo Shin **a, Myung-Eun Kim a, You-Jin Lee **a, and Jae-Hoon Kim *b Abstract We demonstrate
More informationApplication of ultra-thin aluminum oxide etch mask made by atomic layer deposition technique
IOP Publishing Journal of Physics: Conference Series 61 (2007) 369 373 doi:10.1088/1742-6596/61/1/074 International Conference on Nanoscience and Technology (ICN&T 2006) Application of ultra-thin aluminum
More informationTransient-Enhanced Surface Diffusion on Native-Oxide- Covered Si(001) Nano-Structures during Vacuum Annealing
Transient-Enhanced Surface Diffusion on Native-Oxide- Covered Si(001) Nano-Structures during Vacuum Annealing H. Lichtenberger, M. Mühlberger, and F. Schäffler Institut für Halbleiterphysik, Johannes Kepler
More informationSpecimen configuration
APPLICATIONNOTE Model 1040 NanoMill TEM specimen preparation system Specimen configuration Preparing focused ion beam (FIB) milled specimens for submission to Fischione Instruments. The Model 1040 NanoMill
More informationLaser damage threshold of AR coatings on phosphate glass
Laser damage threshold of AR coatings on phosphate glass Optical Coatings for Laser Applications Wednesday, 12 th April 2017, Buchs SG, Switzerland dirk.apitz@schott.com, SCHOTT Suisse SA, Advanced Optics,
More informationPresented at the 28th European PV Solar Energy Conference and Exhibition, 30 September 4 October, 2013, Paris, France
INTEGRATING DIFFRACTIVE REAR SIDE STRUCTURES FOR LIGHT TRAPPING INTO CRYSTALLINE SILICON SOLAR CELLS J. Eisenlohr 1*, H. Hauser 1, J. Benick 1, A. Mellor 2, B. Bläsi 1, J.C. Goldschmidt 1, M. Hermle 1
More informationBIOACTIVE SILICIUM-CONTAINING COATINGS ON TITANIUM SUBSTRATE
Powder Metallurgy Progress, Vol.11 (2011), No 3-4 271 BIOACTIVE SILICIUM-CONTAINING COATINGS ON TITANIUM SUBSTRATE O. S. Antonova, V. V. Smirnov, S. M. Barinov, N. V. Bakunova, Ľ. Medvecký, J. Ďurišin
More informationChapter 1.6. Polished Single-Crystal Silicon, Prime Wafers (all numbers nominal) Wafer Specification Table. Diameter 100 mm 4-inch 150 mm 6-inch
Chapter 1.6 I - Substrate Specifications Polished Single-Crystal Silicon, Prime Wafers (all numbers nominal) Wafer Specification Table Diameter 100 mm 4-inch 150 mm 6-inch Thickness 525 µm 20.5 mils 675
More information3.155J / 6.152J Micro/Nano Processing Technology TAKE-HOME QUIZ FALL TERM 2005
3.155J / 6.152J Micro/Nano Processing Technology TAKE-HOME QUIZ FALL TERM 2005 1) This is an open book, take-home quiz. You are not to consult with other class members or anyone else. You may discuss the
More informationNorth America Europe, Middle East and Africa Latin America Asia-Pacific. Table 1. Photo-BCB Formulations
Processing Procedures CYCLOTENE 4000 Series Advanced Electronics Resins (Photo BCB) Processing Procedures for CYCLOTENE 4000 Series Photo BCB Resins DS2100 Puddle Develop Process Regional Product Availability
More informationFiltration on block copolymer solution used in directed self assembly lithography
Filtration on block copolymer solution used in directed self assembly lithography Toru Umeda*, Tomoyuki Takakura and Shuichi Tsuzuki Nihon Pall Ltd., 46 Kasuminosato, Ami-machi, Inashiki-gun, Ibaraki,
More informationReport 1. B. Starting Wafer Specs Number: 10 Total, 6 Device and 4 Test wafers
Aaron Pederson EE 432 Lab Dr. Meng Lu netid: abp250 Lab instructor: Yunfei Zhao Report 1 A. Overview The goal of this lab is to go through the semiconductor fabrication process from start to finish. This
More informationNanocoating close to the market
Nanocoating close to the market Moritz Graf zu Eulenburg Introduction Market overview Overview of most important coating aspects Description of different coating systems Description of different drying
More informationULTRA-SMALL VIA-TECHNOLOGY OF THINFILM POLYMERS USING ADVANCED SCANNING LASER ABLATION
ULTRA-SMALL VIA-TECHNOLOGY OF THINFILM POLYMERS USING ADVANCED SCANNING LASER ABLATION Michael Töpper Fraunhofer Research Institution for Reliability and Microintegration IZM Germany Martin Wilke, Klaus-Dieter
More informationME 189 Microsystems Design and Manufacture. Chapter 9. Micromanufacturing
ME 189 Microsystems Design and Manufacture Chapter 9 Micromanufacturing This chapter will offer an overview of the application of the various fabrication techniques described in Chapter 8 in the manufacturing
More informationMICROFABRICATION OF OPTICALLY ACTIVE InO X MICROSTRUCTURES BY ULTRASHORT LASER PULSES
Journal of Optoelectronics and Advanced Materials Vol. 4, No. 3, September 2002, p. 809-812 MICROFABRICATION OF OPTICALLY ACTIVE InO X MICROSTRUCTURES BY ULTRASHORT LASER PULSES Foundation for Research
More informationEXPLORING VACUUM CASTING TECHNIQUES FOR MICRON AND SUBMICRON FEATURES. Campus Ker Lann, av Robert Schumann Bruz, France
EXPLORING VACUUM CASTING TECHNIQUES FOR MICRON AND SUBMICRON FEATURES M. Denoual *, P. Mognol **, B. Lepioufle * * Biomis-SATIE ENS-Cachan antenne de Bretagne, Campus Ker Lann, av Robert Schumann 35170
More informationInnovation Creativity Customer-specific solutions. Product information PHOTORESISTS
Product information PHOTORESISTS 1 THE ALLRESIST GMBH The executive board The company is represented worldwide with an extensive product range. In addition to our standard products, we also manufacture
More information5.8 Diaphragm Uniaxial Optical Accelerometer
5.8 Diaphragm Uniaxial Optical Accelerometer Optical accelerometers are based on the BESOI (Bond and Etch back Silicon On Insulator) wafers, supplied by Shin-Etsu with (100) orientation, 4 diameter and
More informationAtomic Layer Deposition(ALD)
Atomic Layer Deposition(ALD) AlO x for diffusion barriers OLED displays http://en.wikipedia.org/wiki/atomic_layer_deposition#/media/file:ald_schematics.jpg Lam s market-leading ALTUS systems combine CVD
More informationELECTRON MICROSCOPY MODERN SURFACE, LAYER AND DEFECT ANALYSIS USING REM, FIB, EDX, STEM
FRAUNHOFER INSTITUTE FOR MANUFACTURING ENGINEERING AND AUTOMATION IPA ELECTRON MICROSCOPY MODERN SURFACE, LAYER AND DEFECT ANALYSIS USING REM, FIB, EDX, STEM 1 METHOD Electron microscopy is the favourable
More informationNTT-AT Optical Adhesives Lineup. Adhesives / Resins and Sealants for Optical Component Assembly
NTT-AT Optical Adhesives Lineup Adhesives / Resins and Sealants for Optical Component Assembly The adhesive technology used in optical communications is one of the key technologies we offer. Ask us anything
More informationCMOS FABRICATION. n WELL PROCESS
CMOS FABRICATION n WELL PROCESS Step 1: Si Substrate Start with p- type substrate p substrate Step 2: Oxidation Exposing to high-purity oxygen and hydrogen at approx. 1000 o C in oxidation furnace SiO
More informationVacuum Plasma Deposition of Water and Oil Repellent Nano-coatings
Vacuum Plasma Deposition of Water and Oil Repellent Nano-coatings AIMCAL Web Coating & Handling Conference 2014 Europe Dr Nicholas Rimmer P2i 127 Olympic Avenue, Milton Park, Abingdon, Oxfordshire, OX14
More informationNIL defect performance toward High volume mass production
NIL defect performance toward High volume mass production Masayuki Hatano a, Kei Kobayashi a, Hiroyuki Kashiwagi a, Hiroshi Tokue a, Takuya Kono a, Nakasugi Tetsuro a, Eun Hyuk Choi b, Wooyung Jung b a
More informationVacuum casting, a new answer for manufacturing biomicrosystems
1 Vacuum casting, a new answer for manufacturing biomicrosystems M Denoual 1 *, P Mognol 2, and B Lepioufle 1 1 Biomis-SATIE ENS-Cachan antenne de Bretagne, Bruz, France 2 IRCCyN Nantes, France The manuscript
More informationABSTRACT: INTRODUCTION:
ABSTRACT: Nano-Composite Polymer Optical Coatings Tom Faris Vampire Optical Coatings, Inc. P.O. Box 240 Kirkersville, Ohio 43033 (740)-927-5257 f(740)-927-5032 vampirecoatings@earthlink.net Traditionally
More informationPeakForce Tapping and ScanAsyst An introduction to the technique featuring Bruker s Dimension Edge. Bede Pittenger, Ph.D.
PeakForce Tapping and ScanAsyst An introduction to the technique featuring Bruker s Dimension Edge Bede Pittenger, Ph.D. Dimension Edge with ScanAsyst: High performance AFM breaking down cost and productivity
More information