Cypress Semiconductor Mold Compound Qualification Report

Transcription

1 Cypress Semiconductor Mold Compound Qualification Report QTP# VERSION 2.0 (G3) October Lead SOJ/20-32 Lead SOIC/28 Lead SNC s Sumitomo EME 6600HR Mold Compound, MSL3 Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben T-zur Staff Reliability Engineer (408)

2 : SOJ/ SOIC/SNC Page 2 of 8 Assembly: Cypress Philippines () PRODUCT QUALIFICATION HISTORY Qual Report Description of Qualification Purpose Qualify EME 6600HR Molding Compound for lead SOJ, 20/28/32 lead SOIC and 28 lead SNC package, MSL 3 at Date Comp. Aug 01

3 : SOJ/ SOIC/SNC Page 3 of 8 Assembly: Cypress Philippines () MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Designation: S20 Outline, Type, or Name: 20-lead Plastic Small Outline IC (SOIC) Mold Compound Name/Manufacturer: Sumitomo EME 6600HR Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: >28% Lead Frame Material: Cu Lead Finish, Composition / Thickness: Solder plated, 90%Sn, 10%Pb Die Backside Preparation Method/Metallization: N/A Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik / QMI Die Attach Material: Ablestik 8361H, QMI 509 Die Attach Method: Epoxy Bond Diagram Designation Wire Bond Method: Ultrasonic Wire Material/Size: Au / 1.0 Mil Diameter Thermal Resistance Theta JA C/W: 79 C/W Cross Section Yes/No: No Assembly Process Flow: M Name/Location of Assembly (prime) facility: RoHS PPM level: Weight Solder Plating Assembly Site Lead (Pb) Mercury (Hg) Chromium (Cr VI) Cadmium (Cd) SOIC gm Sn/Pb CML 3.2 ppm < 0.05 ppm < 2 ppm < 1 ppm Polychlorinated biphenyls (PCB) Polybrominated biphenyls (PBB) Polybrominated diphenylethers (PBDE) < 1 ppm < 1 ppm < 1 ppm ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Fault Coverage: 100% Note: Please contact a Cypress Representative for other packages availability.

4 : SOJ/ SOIC/SNC Page 4 of 8 Assembly: Cypress Philippines () MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Designation: S32 Outline, Type, or Name: 32-lead Small Outline IC package (SOIC) Mold Compound Name/Manufacturer: Sumitomo EME 6600HR Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: >28% Lead Frame Material: Cu Lead Finish, Composition / Thickness: Solder Plated, 90%Sn, 10%Pb Die Backside Preparation Method/Metallization: N/A Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik / QMI Die Attach Material: Ablestik 8361H, QMI 509 Die Attach Method: Epoxy Bond Diagram Designation Wire Bond Method: Ultrasonic Wire Material/Size: 1.0 mil Thermal Resistance Theta JA C/W: 41 C/W Cross Section Yes/No: No Assembly Process Flow: M Name/Location of Assembly (prime) facility: RoHS PPM level: Weight Solder Plating Assembly Site Lead (Pb) Mercury (Hg) Chromium (Cr VI) Cadmium (Cd) SOIC gm Sn/Pb CML 2.7 ppm 0.1 ppm < 2 ppm <1 ppm Polychlorinated biphenyls (PCB) Polybrominated biphenyls (PBB) Polybrominated diphenylethers (PBDE) < 1 ppm < 1 ppm < 1 ppm ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Fault Coverage: 100% Note: Please contact a Cypress Representative for other packages availability.

5 : SOJ/ SOIC/SNC Page 5 of 8 Assembly: Cypress Philippines () MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Designation: V28 Outline, Type, or Name: 28-lead Plastic Small Outline J-Bend (SOJ) Mold Compound Name/Manufacturer: Sumitomo EME 6600HR Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: >28% Lead Frame Material: Cu Lead Finish, Composition / Thickness: Solder Plated, 90%Sn, 10%Pb Die Backside Preparation Method/Metallization: N/A Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik / QMI Die Attach Material: Ablestik 8361H, QMI 509 Die Attach Method: Epoxy Bond Diagram Designation Wire Bond Method: Ultrasonic Wire Material/Size: Au, 1.3 Mil Diameter Thermal Resistance Theta JA C/W: 58.7 C/W Cross Section Yes/No: No Assembly Process Flow: M Name/Location of Assembly (prime) facility: RoHS PPM level: Weight Solder Plating Assembly Site Lead (Pb) Mercury (Hg) Chromium (Cr VI) Cadmium (Cd) SOJ gm Sn/Pb CML 2.4 ppm 0.1 ppm < 2 ppm 1 ppm Polychlorinated biphenyls (PCB) Polybrominated biphenyls (PBB) Polybrominated diphenylethers (PBDE) < 1 ppm < 1 ppm < 1 ppm ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Fault Coverage: 100% Note: Please contact a Cypress Representative for other packages availability.

6 : SOJ/ SOIC/SNC Page 6 of 8 Assembly: Cypress Philippines () MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Designation: V444 Outline, Type, or Name: 44-lead Plastic Small Outline J-Bend (SOJ) Mold Compound Name/Manufacturer: Sumitomo EME 6600HR Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: >28% Lead Frame Material: Cu Lead Finish, Composition / Thickness: Solder Plated, 90%Sn, 10%Pb Die Backside Preparation Method/Metallization: N/A Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik / QMI Die Attach Material: Ablestik 8361H, QMI 509 Die Attach Method: Epoxy Bond Diagram Designation Wire Bond Method: Ultrasonic Wire Material/Size: 1.0 Mil Diameter Thermal Resistance Theta JA C/W: 41 C/W Cross Section Yes/No: No Assembly Process Flow: M Name/Location of Assembly (prime) facility: RoHS PPM level: Weight Solder Plating Assembly Site Lead (Pb) Mercury (Hg) Chromium (Cr VI) Cadmium (Cd) SOJ gm Sn/Pb CML 9 ppm < 0.05 ppm < 2 ppm < 1 ppm Polychlorinated biphenyls (PCB) Polybrominated biphenyls (PBB) Polybrominated diphenylethers (PBDE) < 1 ppm < 1 ppm < 1 ppm ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Fault Coverage: 100% Note: Please contact a Cypress Representative for other packages availability.

7 : SOJ/ SOIC/SNC Page 7 of 8 Assembly: Cypress Philippines () RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) 130 C, 3.63V/5.5V, 85%RH Precondition: JESD22 Moisture Sensitivity Level Hrs., 85 C/85%RH+3IR-Reflow, 220 C+5, -0 C Result P/F P Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level Hrs., 85 C/85%RH+3IR-Reflow, 220 C+5, -0 C Pressure Cooker 121 C, 100%RH Precondition: JESD22 Moisture Sensitivity Level Hrs., 85 C/85%RH+3IR-Reflow, 220 C+5, -0 C High Temperature Storage 150C, no bias P Acoustic Microscopy, Level 3 Cypress Spec P X-Ray Cypress Spec P P

8 : SOJ/ SOIC/SNC Page 8 of 8 Assembly: Cypress Philippines () Reliability Test Data QTP #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC - MSL3 CY7C63001A-SC M COMP 15 0 CY7C199-VC COMP 15 0 CY7C1041BV33-VC COMP 15 0 CY7C62148-SC COMP 15 0 STRESS: HIGH TEMPERATURE STORAGE (150C) CY7C1041BV33-VC CY7C1041BV33-VC STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.63V / 5.5VV) 168 HRS., 85C/85%RH (MSL1) CY7C63001A-SC M CY7C1041BV33-VC STRESS: X-RAY CY7C63001A-SC M COMP 15 0 CY7C199-VC COMP 15 0 CY7C62148-SC COMP 15 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH, 168 Hrs., 85C/85%RH (MSL1) CY7C63001A-SC M CY7C1041BV33-VC STRESS: TC CONDITION C, -65C TO 150C, PRE COND. 168 HRS., 85C/85%RH (MSL1) CY7C63001A-SC M CY7C63001A-SC M CY7C63001A-SC M CY7C199-VC CY7C199-VC CY7C199-VC CY7C62148-SC CY7C62148-SC CY7C62148-SC