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1 - - page of 4 Contents Inner and outer layer features Description Capability Build-up / Multilayer Common capability... 3 Standard build-up Drilling/Routing/V-cut/Bevel Drilling Routing... Error! Bookmark not defined. 3.3 Scoring/V-cut Chamfer/Bevel Solder mask Capability (Rigid board) Finished solder mask type and thickness capability: Via hole plugging techniques: General Plug depth (solder mask IPC476 type VI) Solder mask capability: Green Solder resist features to ensure no encroachment Matte green Solder resist features to ensure no encroachment Red/blue/yellow Solder resist features to ensure no encroachment white/black Solder resist features to ensure no encroachment Marking capability Silkscreen/legend Soldermask defined text Etched coper text Peelable mark & Kapton tape Carbon..0 8 Surface finish... 9 Wrap... 0 E-Test... 2 HDI (Complete if applicable) Design features HDI... 3
2 - 2 - page 2 of 4 Inner and outer layer features. Description Etch Compensation Min. Track width Min. Space ( feature to feature ) Min. Annular Ring Min. Space: PTH hole to Min. Space: NPTH hole to A B C DD D E F.2 Capability thickness A B C D E F 8um / ½ oz um / oz Outer layer Inner layer 70um / 2oz um / 3oz um / 4oz um / 5oz um/ 6oz um/ /3oz um / ½oz um / oz um / 2oz um / 3oz um / 4oz um / 5oz um / 6oz Note: If the customer wishes to know circuitry characteristics for a specific finished weight (typically in ounces) then simply consider the base weight lower down than the finished and this will define the dimensional aspects of the characteristic in question. For example; for a 2oz. finished board, shall select oz. base. For a oz. finished board, select /2oz base.
3 - 3 - page 3 of 4 2 Build-up / Multilayer 2. Common capability Detail (max = 8 35um cu / min = free build) Thickness (mm) Best tolerance +/- % Max 4L thickness Min 4L thickness Max 6L thickness Min 6L thickness Max 8L thickness Min 8L thickness.0 0 Max 0L thickness Min 0L thickness.6 0 Max 2L thickness Min 2L thickness.6 0 Standard build-up Used for.6mm thick with 35µm Cu finish on all layers 4 Layer um 6 Layer um 8 Layer um Standard stock items Copper 8 Copper 8 Copper 8 PP Brand / type Detail / thickness Prepreg 26/080 Prepreg 26/080 Prepreg 080/080 VT um Copper 35 Copper 35 Copper 35 VT um Core.0 Core 0.4 Core 0.2 VT um Copper 35 Copper 35 Copper 35 VT um Prepreg 26/080 Prepreg 26/080 Prepreg 080/26 VT um Copper 8 Copper 35 Copper HR 06 50um Core 0.4 Core HR um Copper 35 Copper HR 23 98um Prepreg 26/080 Prepreg HR 26 27um Copper 8 Copper HR um Core 0.2 R um Copper 35 R um Prepreg 080/080 R um Copper 8 R um Core Brand Detail thickness VT HR R ROGERS
4 - 4 - page 4 of 4 3 Drilling/Routing/V-cut/Bevel 3. Drilling Size Best tolerance PTH Best tolerance NPTH Min. hole mechanically drilled 0.5 mm Max. hole mechanically drilled 6.3 mm Min. slot width mechanically drilled 0.5 mm Min. slot length mechanically drilled.0 mm True positional tolerance hole to hole Aspect Ratio 2.5: Min. space between holes 0.75 mm Min. space between NPTH and edge 0 mm Back drilling / Counter bore Depth tolerance (A) Min. remain thickness and tolerance (B) Counter sink holes Depth tolerance (A) Angle and tolerance (B) 4 +/-Degree 4 +/-Degree Min. remain thickness and tolerance (C) Countersink tolerance (D) Routing Rout Diameter Standard: 2.4 mm Other: mm
5 - 5 - page 5 of 4 Tolerance in mm (±) Board Edge NPTH PTH NP Slot PT Slot Cu Pad Board Edge A B C D E 0.2 F 0.5 NPTH G H 0.0 I J K PTH L 0.25 M N O NP Slot P 0.60 Q R 0.0 PT Slot S 0.55 T 0.0
6 - 6 - page 6 of Scoring/V-cut Feature type Nom (mm) Min (mm) Tolerance +/- (mm) Position accuracy A Blade offset B Keep out area C 0.5 Web D Angle E Min board thickness: 0.30mm Max board thickness: 2.40mm Min safe buffered distance from the cutting point to mm the beginning of jump v-cut 3.4 Chamfer/Bevel Feature type A - Bevel height tolerance 0. B - Bevel angle range degree Bevel angle tolerance 5 +/-degree
7 - 7 - page 7 of 4 4 Solder mask Capability (Rigid board) 4. Finished solder mask type and thickness capability: Brand + type Single print Double Available Semi gloss / Matte Gloss thickness print colors matte thickness Sun Chem XV50T Green Y 2-20um 24-40um Sun Chem XV50T Black Y 2-20um 24-40um Sun Chem XV50T Red Y 2-20um 24-40um Sun Chem XV50T Blue Y 2-20um 24-40um Sun Chem XV50T Yellow Y 2-20um 24-40um Sun Chem XV50T White y 2-20um 24-40um Electra EFP40/3044 Green y 2-20um 24-40um Electra EFP40/3044 Brown y 2-20um 24-40um 4.2 Via hole plugging techniques: 4.2. General Plugging techniques Detail Yes or No Max hole size Min hole size Soldermask IPC 476 Type VI Y 0.45mm 0.5mm Special via plugging ink (E.G. Taiyo N PF0) IPC476 Type VI Resin non conductive IPC476 Type VI Y 0.50mm 0.5mm Resin electrical conductive N Resin thermal conductive N Over plated/ capped IPC 476 type VII Y 0.50mm 0.5mm Plug depth (soldermask IPC476 type VI) Holes size(d) Board Thickness (H) mm.0 -.8mm.8-2.4mm mm 0.2mm D<0.6mm 80% 80% 70% 50% 0.6mm D 0.8mm
8 - 8 - page 8 of Solder mask capability: 4.3. Green Solder resist features to ensure no encroachment Feature type SMT to covered Copper to spacing Solder mask oversize Hoz oz 2oz 3oz 4oz A B C Minimum soldermask web D Not specified Not specified Matte green Solder resist features to ensure no encroachment Feature type Hoz oz 2oz 3oz 4oz SMT to covered A Copper to spacing B Solder mask oversize C Minimum soldermask web D
9 - 9 - page 9 of Red/blue/yellow Solder resist features to ensure no encroachment Feature type SMT to covered Copper to spacing Solder mask oversize Hoz oz 2oz 3oz 4oz A B C Minimum soldermask web D Not specified Not specified White/black Solder resist features to ensure no encroachment Feature type SMT to covered Copper to spacing Solder mask oversize Hoz oz 2oz 3oz 4oz A B C Minimum soldermask web D Not specified Not specified
10 - 0 - page 0 of 4 5 Marking capability 5. Silkscreen / Legend Colors White Yellow, Black, Red, Blue Standard Others Min legend width 0.25 mm Min legend height 0.25 mm Position accuracy 0. +/- mm 5.2 Soldermask defined text Min soldermask text width 0.00 mm Min soldermask text height.0 mm Position accuracy /- mm 5.3 Etched text Min etching text width 0.0 mm Min etching text height.0 mm Position accuracy /- mm 6 Peelable mask & Kapton tape Peelable Mask Kapton tape (to cover larger holes) Nominal Thickness: Minimum Thickness: Max covered hole diameter: Peelable mask used (UL approved) Min distance to not covered feature: Can Use: Nominal Thickness: >300um 300um 2.5mm SD2955.0mm JIT um
11 - - page of 4 7 Carbon Min space between carbon mm Min carbon opening bigger than pattern per side mm Min space between carbon edge to around mm Position accuracy 0.5 +/- mm 8 Surface finish Surface Finish YES/NO Sub-contracted? Thickness (um) Chemistry / Brand Pb-F HASL YES Solderable <20um DKL SN00CL SnPb HASL YES Solderable <20um DKL 63 / 37 Edge hard gold contacts YES As Below Schloetter Auruna 528 Internal hard gold YES 3-7um Nickel Schloetter Auruna contacts.5-3.0um Gold 528 Flash gold OSP NO ENIG YES 0.05um-0.um Gold OMG OMNiGuard 3um 7um Nickel Immersion Tin YES Atotech Paragon Plating Immersion Silver YES um Macdermid Sterling Silver 2.0 Carbon YES 5-25um Electra ED5000 OSP+ Immersion Gold NO 9 Wrap (based upon minimum wrap distance of 25um) IPC feature Demand Min trace width (mm) Min trace space (mm) /3 oz Wrap 5um /2 oz Buried via (IPC class 2) oz L, PTH and /3 oz blind via Wrap 2um /2 oz (IPC class 3) oz Microvia Wrap 5um /3 oz
12 - 2 - page 2 of 4 (blind and buried) Blind via cores (2L) (IPC class 2) /2 oz oz /3 oz Wrap 6um /2 oz (IPC class 3) oz /3 oz Wrap 5um /2 oz (IPC class 2) oz /3 oz Wrap 7um /2 oz (IPC class 3) oz E-Test Max test area 578*42 mm x mm Minimum Test board thickness 0.05 mm Minimum test PAD width 0.05 mm Minimum test pad pitch 0. mm High voltage test N V Automated segregation of pass / fail N Y/N HDI Laser drilled hole/mechanical Min. hole size 0.0 mm Max. hole size 0.40 mm Aspect Ratio Normal 0.7: X:X Best : X:X Build-up material used RCC N Y/N RCC High Tg N Y/N LD Prepreg N Y/N LD Prepreg High Tg N Y/N Aramid N Y/N Polyimide Y Y/N No-Flow prepreg Y Y/N Speedboard C N Y/N Others Y Y/N Technique +N+ Y Y/N Technique (Cont.) 2+N+2 (staggered µvia) Y Y/N 3+N+3 (staggered µvia) N Y/N 4+N+4 (staggered µvia) N Y/N 2+N+2 (stacked µvia) Y Y/N
13 - 3 - page 3 of 4 3+N+3 (stacked µvia) N Y/N 4+N+4 (stacked µvia) N Y/N -2-3 (step down µvia N Y/N Filling technique µvia Copper filled Y Y/N Resin filled (over plated) Y Y/N Copper pillar N Y/N. Design features HDI Preferred Min. Entry pad (A) 300um 250um Target pad L (A) 300um 250um Hole L-L2 (B) 50um 00um Preferred Min. Entry pad (A) 300um 250um Target pad L2 (A) 300um 250um Entry pad L2 (A) 300um 250um Target pad L3 (A) 300um 250um Hole L-L2 (B) 50um 00um Hole L2-L3 (B) 50um 00um Hole Pitch (C) 400um 350um Preferred Min. Entry pad (A) 300um 250um Target pad L2 (A) 300um 250um Target pad L3 (A) 400um 350um Hole L-L2 (B) 200um 50um Hole L2-L3 (B) 200um 50um Preferred Min. Entry pad (A) 400um 350um Target pad L2 (A) 400um 350um Target pad L3 (D) 300um 250um Hole L-L2 (B) 50um 00um Hole L2-L3 (C) 50um 00um
14 - 4 - page 4 of 4 Preferred Min. Entry pad (A) 300um 250um Target pad L (C) 400um 350um µvia hole L-L2 (B) 200um 50um Buried hole (D) 300um 200um
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