Multek s lead free compatible and compliant material selection February 01, 2006

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1 Multek s lead free compatible and compliant material selection Helmut.Kroener@de.multek.com February 0, 2006

2 Overview I. Introduction II. Project setup III. Tested materials IV. Test vehicle V. Testing VI. Summary and conclusion 2

3 I. Major concerns when soldering lead free Via reliability (via cracking)? Low/ high CTE materials (filled/ unfilled) Low Tg (Tg ~ 35 ) / High Tg (Tg > 75 ) materials De-Lamination Resistance? Resin systems Alternative Oxide resin bond Glass resin bond De-Composition Resistance? Degradation of resin/ - components Out-gassing of solvents Electrical Degradation? 3

4 II. Project setup - Lead free evaluation program Phase I Pre-selection Information from raw material vendors Basic analysis on raw materials Setup of raw material matrix Definition/ Design Test vehicle I Phase II Repeated reflow evaluation First production run Repeated Reflow testing on board Phase III a Repeated reflow confirmation Second production run Repeated Reflow testing on board Phase III b Reliability Testing Thermal reliability testing Electrical characterization Phase IV Selection Reduction to preferred materials Phase V Capability Testing Process optimization Definition/ Design Test vehicle II Higher layer count Increased Thickness Re-lamination step µ via Jan 2005 Apr 2005 Jul 2005 Dec Jan

5 II. Project setup - Lead free compatible materials selection Materials Materials Materials Capability testing Pre-selection FAIL Preffered Materials Approved materials First Production Run Reflow Testing Conditional Pass Reliablitiy testing PASS Second Production Run Reflow Testing Process improvement 5

6 III. Tested materials Low and High Tg Material A-A* A-B A-C A-D A-E A-F A-G A-H A-I A-J Location Europe USA Asia Asia Europe USA Japan Japan Japan Japan Resin Epoxy/ Dicy Epoxy/ Novolac Epoxy/ Novolac Epoxy/ Novolac Epoxy/ Novolac Epoxy/ Anhydride Epoxy/ Novolac Epoxy/ Novolac Epoxy/ BT Epoxy/ Novolac Filler no yes no yes yes no no yes yes yes Filler type Inorganic Inorganic Inorganic Inorganic Inorgani c Tg DSC 80 > TMA DMA CTE α pp m/ K α2 pp m/ K z-axis expansion % 3,8 3,2 3,5 2,8 Td TGA DK MHz 4,3 4,3 4,7 4,8 4,7 4,7 GHz 4, 4, 4,4 4,6 4,5 4,2-4,3 4,3-4,5 4,3 Df MHz GHz 0,023 0,06 0,023 0,04 0,08 0,04 0,06 * Current standard High material in production 0,07 0,020 0,05 0,0 0,05 * Multek Germany standard material Values taken from vendor data sheets 6

7 III. Tested materials Low Loss, high speed Material B-A* B-B B-C B-D B-E B-F Location USA USA USA USA Japan Japan Resin CyanateEster/ Epoxy CyanateEster/ Epoxy BT/Epoxy BT/Epoxy CyanateEster/ Epoxy PPO Filler no no yes no no no Filler Type Inorganic Tg DSC TMA DMA CTE α ppm/k α2 ppm/k z-axis expansion % 3,5 3,6 2,3 2,5 Td TGA DK MHz 3,9 GHz 3,7 3,7 3,5 2GHz 3,74 3,5 Df MHz 0,0 GHz 0,005 2GHz 0,0083 0,002 * Multek Germany standard material Values taken from vendor data sheets 7

8 IV. Test Vehicle Number of layers: 26 Thickness: 3.2 mm Prepreg : Two ply construction 06 and 080 glass High resin content (65 70 %) Core layers: 3 mil H/H oz 2.5 mil 2/2 oz 2.5 mil 2/ oz Surface finish: Immersion silver (coupons) ENIG (signal integrity coupon) Top COMPONENT 5 prepreg / & 06 3,85 35 pln 2 PWR/GND 5 core 3mil H/H TBD 080 3,9 76 sig 3 SIGNAL 5 prepreg / & 06 3,85 26 pln 4 PWR/GND 5 core 3mil H/H 6, ,9 76 sig 5 SIGNAL 5 prepreg / & 06 3,85 26 pln 6 PWR/GND 5 core 3mil H/H 6, ,9 76 sig 7 SIGNAL 5 prepreg / & 06 3,85 26 pln 8 PWR/GND 30 core 2.5mil /2 55, pln+ 9 PWR/GND 70 prepreg x06 3,8 02 pln 0 PWR/GND 70 core 2.5mil 2/2 55, pln PWR/GND 70 prepreg x06 3,8 02 pln 2 PWR/GND 70 core 2.5mil 2/2 55, pln 3 PWR/GND 70 prepreg x06 3,8 02 pln 4 PWR/GND 70 core 2.5mil 2/2 55, pln 5 PWR/GND 70 prepreg x06 3,8 02 pln+ 6 PWR/GND 70 core 2.5mil /2 55, pln 7 PWR/GND 30 prepreg / & 06 3,85 26 sig 8 SIGNAL 5 core 3mil H/H 6, ,9 76 pln 9 PWR/GND 5 prepreg / & 06 3,85 26 sig 20 SIGNAL 5 core 3mil H/H 6, ,9 76 pln 2 PWR/GND 5 prepreg / & 06 3,85 26 sig 22 SIGNAL 5 core 3mil H/H 6, ,9 76 pln 23 PWR/GND 5 prepreg / & 06 3,85 26 sig 24 SIGNAL 5 core 3mil H/H 6, ,9 76 pln 25 PWR/GND 5 prepreg / & 06 3,85 35 Bot 5 8

9 IV. Test Vehicle Multek Pb Free TV Hole Ǿ 0,3 mm Distance 32mil H-H Distance 32mil Reflow/ AATC/ LLTC Soldershock Distance 32mil Tg/CTE/Peel-strength Signal Integrity IST CAF (IPC) 9

10 IV Test Vehicle Cross Section Locations H-H Distance.0 mm Sample 2 H-H Distance 0.75 mm Hole Ǿ 0.35 mm 3 Distance Pad 0.55 mm Hole Ǿ = 0.35 mm Sample 4 Reflow Solder Shock T260 T288 0

11 V. Testing Test program lead free compatibility Lead free assembly test - repeated reflow Electrical properties Thermal Reliability Thermal properties Cross section 5x/ 7x/ 260 Peel Strength As rec/ 260 Signal integrity CAF As rec/ Solder shock 3x/ 6x IST with preconditioning 260 AATC with preconditioning 260 Tg TMA/DSC TGA CTE/ z-axis exp LLTC with preconditioning 260 T260/T288

12 V. Testing Repeated Reflow Method: Internal profile (following customer profile) Sample size: 5 boards st run/ 7 boards 2nd run Pre-condition: All testing coupons are baked at 20, 4hrs and tested within 24 hrs after baking. Pass criteria: Min. 6x neither visual delamination nor delamination from cross-section at above critical area board: cross-sectioned after 5x reflow (7 cross-sections see picture) board: cross-sectioned after 7x reflow (7 cross-sections see picture) 3 boards/ 5 boards: after failure or after 0x reflow (7 cross-sections see picture) Reflow number: min. 7 x without visual delamination. Check with cross sections in critical areas (LGA s, BGA s, plane areas which will be specified). Max. 0x without delamination. 2

13 V. Testing - Reflow 260 3

14 V. Testing Repeated Reflow Low/high Tg Material A-F A-F Reflow Run 2 Reflow Temp. in Reflow Process Pass 0x reflow Pass 0x reflow With small issues A-J A-J 2 Pass 7x reflow without delamination A-G A-G 2 Shows delamination before 5x reflow A-H A-H A-I A-B A-B A-A* A-E A-E No process modification needed Slight process modification needed Large process improvement needed Significant improvement Needed A-C A-C 2 * Multek Germany Standard 4

15 V. Testing Repeated Reflow Low, High Tg Material A-H B3/4 BGA 0xreflow 50x Material A-J B5/4 0x reflow 00x Material A-E B5/4 BGA 0x reflow 50x Material A-B B6/6 LGA 0x reflow 00x 5

16 V. Testing Repeated Reflow, Low Loss, High Speed Material B-F B-F Reflow Run 2 Reflow Temp. in Reflow Process Pass 0x reflow Pass 0x reflow With smaller problems Pass 7x reflow without delamination B-D Shows delamination before 5x reflow B-D 2 B-C Rev.2 B-C Rev.3 B-B No modification needed Slight modification needed B-B B-A* 2 Room for improvement Heavier improvements Needed * Multek Germany Standard 6

17 V. Testing Repeated Reflow Low Loss, High Speed Material B-F B9/4 BGA 0x reflow 00x Material B-C B3/4 BGA 3x reflow 50x Material B-B B5/4 BGA 0x reflow 50x Material B-D B/4 BGA 0x reflow 00x 7

18 V. Testing Thermal properties Tg by TMA Method: IPC-TM Sample size: 2 out of coupon (different panels) Tg / Tg2 Pass criteria: No negative Delta Tg, Delta Tg < 5, Tg > 60 Tg by DSC Method: IPC-TM Sample size: 2 out of coupon (different panels) Tg / Tg2 Pass criteria: No negative Delta Tg, Delta Tg < 5 CTE/ z-axis expansion Method: IPC-TM Samples size: 2 out of board with inner layer copper (out of different panels) Range: 50- Pass criteria: CTE below and after Tg will be reported Z-axis-expansion < 4% T260, T288 Method: IPC-TM Samples: 2 samples taken out of board (as received) Pass criteria: T260: > 25 min T288: > 2 min 8

19 V. Testing Thermal Properties - low, high Tg Material A-A* A-B A-C A-D A-E A-F A-G A-G A-H A-I A-J Glass transition temperature DSC, IPC-TM-650 Method c TG N/A TG Delta Tg Glass transition temperature TMA, IPC-TM-650 Method c TG TG Delta Tg Z-axis expansion (calculated) ,4 % 5,3% 5,5% 5,2% 4,7% 4,5% 5,0% 4,8% 3,5% 2,40% 5,8% CTE (z-axis), IPC-TM-650 Method c CTE < Tg ppm/ K CTE > Tg ppm/ K T260, IPC-TM-650 Method min hold time min < 5 9 3,5 25,75 no no no no no T288, IPC-TM-650 Method min hold time min <,65,25 3,45 0,4 7,35 0,9 2,75 * Multek Germany Standard 9

20 V. Testing Thermal Properties Low loss, high speed Material B-A* B-B B-D B-C Rev. 2 B-C Rev.3 B-F Glass transition temperature DSC, IPC-TM-650 Method c TG TG Delta Tg Glass transition temperature TMA, IPC-TM-650 Method c TG TG Delta Tg Z-axis expansion (calculated) ,5% 4,9% 4,9% 6,8% 4,4% CTE (z-axis), IPC-TM-650 Method c CTE < Tg ppm/ K CTE > Tg ppm/ K T260, IPC-TM-650 Method min Holding time min no no T288, IPC-TM-650 Method min Holding time min 3,4 3,5 20

21 V. Testing Thermo Gravimetric Analysis (TGA) Method: TGA Dynamic measurement (0 / min or 20 / min) Isothermal measurement (constant temperature) -> degradation time Samples size: ~ 35 mg (30/ 50 mil core material) Industry references decomposition temperature, T D, when a 5% loss in weight occurs as one of the key characteristics for base laminates Multek found that a material will delaminate at a much lower temperature (lower weight loss) than the material s T D. Delamination can occur at a weight loss closer to only %. 2

22 V. Testing - TGA Sample: IS620 Issue_20605 Size: mg Method: TGA Comment: TGA 20 TGA File: IS620 Issue (0C Min 700C)_ Operator: AMD Run Date: 6-Dec-05 3:0 Instrument: 2950 TGA HR V5.4A 00 Weight (%) ISOLA 620 (TGA) 0C/min % % % % % % % % % % % Temperature () Universal V3.8B TA Instruments Isothermal measurement (constant temperature) degradation time at given temperature for example reflow peak temp. 260 Sample: IS620 Issue_20605 Size: mg Method: TGA Comment: TGA 24.46min TGA File: IS620 Issue (0C Min 270C-Hold 50').00 Operator: AMD Run Date: 6-Dec-05 6:5 Instrument: 2950 TGA HR V5.4A Dynamic measurement (constant heat up rate) degradation temp/ progress Weight (%) Temperature () min 99.58% Time (min) Universal V3.8B TA Instruments 22

23 V. Testing - TGA Analysis 00 Dynamic measurement curve for various materials (heat up rate 0 / min) 99 weight loss [%] A-A A-B A-C A-E A-F A-G A-J B-A B-B B-C B-D B-F Tem perature [] 23

24 V. Testing Interconnect Stress Testing Method: IPC-TM Sample size: 24 coupons reflow pre-condition (customer request) Test cycle RT 50. Comparison to standard High-Tg-FR4 preconditioned with eutectic soldering (230 peak temp) and similar test procedure. Evaluate data as Weibull or Lognormal base e plot. Failure criteria: 0% resistance increase of the resistance value measured after preconditioning as failure criterion. Pass criteria: Both intersection with x-axis (0.% failure rate or % failure rate) and slope of the graph have to be better compared to the standard materials. Material should meet: 75 cycles 99% CL Weibull/ LogN or Minimum 300 cycles 24

25 V. Testing - IST Results Probability Plot for A-C-A-H Lognormal base e Distribution - LSXY Estimates - 95,0% CI Type (Time) Censored at 2500, A-C A-E Percent A-B B-B A-H Location Scale r F/C 5,00 0,400 0,953 2/0 6,024 0,3003 0,990 24/0 5,0530 0,537 0,780 24/0 5,60 0,228 0,982 24/0 7,780 0,3994 0,96 9/ Time to Failure

26 V. Testing - IST Results Material A-E Material A-C 26

27 V. Testing - IST Results Material A-B Material B-B 27

28 V. Testing - AATC/ LLTC AATC Method: IPC-TM-650 Sample size: 5 coupons reflow pre-condition -55 / +25. Dwell and transition times have to be fixed with the actual coupons to make sure, that the boards reaches the target temperature also in its center. LLTC Method: IPC-TM-650 Sample size: 5 coupons reflow pre-condition 55 to 25 (5min / 5min dwell time and 5 second hold time) LLTS Failure criteria for AATC and LLTC: Resistance change less than 0%. Pass criteria for AATC and LLTC: Minimum 500 cycles and maximum 000 cycles. 28

29 V. Testing Air to Air Thermal Cycling (AATC) Probability Plot for A-B-A-E Lognormal base e Distribution - LSXY Estimates - 95,0% CI Complete Data 99 A-B B-B Percent A-J A-G A-C A-F A-E Time to Failure 000 A-H coupons ran 000 cycles without resistance change except coupon that Failed at 64 cycles. All other coupons exceeded 000 cycles. Test was stopped 29

30 VI. Summary/ Conclusion Lead Free Compliance do not automatically imply Lead Free Compatibility. Lead Free Compatibility do not imply the need for a High Tg laminate. CTE (α and α2) values have an significant influence on lead free compatibility and performance. Weight loss/ Degradation tendency between 200 and 280 affects survival at thermal stress. Within the same resin family significant difference could be observed in lead free compatibility and thermal reliability. Process windows for key processes are narrower. Optimized process conditions are necessary to withstand repeated reflow. Multek's test strategy can characterize and differentiate the level of lead free compatibility. MULTEK is able to offer lead free compatible materials for a wide range of applications. 30

31 MATERIAL COST Does Lead Free Material Cost More??

32 Some Comments About Cost Material cost is only a part of the total cost of a PCB Can be up to 60 % on high end applications Can be as low as 0 % on low end applications Material cost ALLWAYS depends on stack up (BOM) Glass Styles Prepreg thickness Copper thickness Copper profiles (ZBC, RTF, ) Balanced vs. unbalanced (oz/2oz..) Material cost is changing constantly Raw material prices go up (oil, copper, glass..) Material cost is volume depending Preferred supplier status is important Volume (worldwide base) is important Material cost typically is regional not global today Japan vs. Europe vs. Americas vs. Asia 32

33 Stack Up TV 26 Layer Cost Assumptions Layer count: 26 Thickness: 3.75 mm (25 mil) Prepreg layer: 06 (74 % RC) 9 pieces 080 (68 % RC 7 pieces Core layer: 3.0 mil H/H oz 7 pieces 2.5 mil 2/2 oz 3 pieces 2.5 mil 2/ oz 2 pieces Material Description ME Material # resin content glass style dielectric constant nominal thickness. [%] [um] soldermask 0 plating 30 Top COMPONENT 5 prepreg P-BF342+P-BF / & 06 3,85 35 pln 2 PWR/GND H 5 core 3mil H/H C-BF734 TBD 080 3,9 76 sig 3 SIGNAL H 5 prepreg P-BF342+P-BF / & 06 3,85 35 pln 4 PWR/GND H 5 core 3mil H/H C-BF734 TBD 080 3,9 76 sig 5 SIGNAL H 5 prepreg P-BF342+P-BF / & 06 3,85 35 pln 6 PWR/GND H 5 core 3mil H/H C-BF734 TBD 080 3,9 76 sig 7 SIGNAL H 5 prepreg P-BF342+P-BF / & 06 3,85 35 pln 8 PWR/GND #N/A #N/A core 2.5mil /2 C-BF500 #N/A 080 #N/A #N/A pln+ 9 PWR/GND #N/A #N/A prepreg 2xP-BF x06 3,8 02 pln 8copy PWR/GND #N/A #N/A core 2.5mil 2/2 C-BF50 #N/A 080 #N/A #N/A pln 9copy PWR/GND #N/A #N/A prepreg 2xP-BF x06 3,8 02 pln 0 PWR/GND #N/A #N/A core 2.5mil 2/2 C-BF50 #N/A 080 #N/A #N/A pln PWR/GND #N/A #N/A prepreg 2xP-BF x06 3,8 02 pln 0copy PWR/GND #N/A #N/A core 2.5mil 2/2 C-BF50 #N/A 080 #N/A #N/A pln copy PWR/GND #N/A #N/A prepreg 2xP-BF x06 3,8 02 pln+ 2 PWR/GND #N/A #N/A core 2.5mil /2 C-BF500 #N/A 080 #N/A #N/A pln 3 PWR/GND #N/A #N/A prepreg P-BF342+P-BF / & 06 3,85 35 sig 4 SIGNAL H 5 core 3mil H/H C-BF734 TBD 080 3,9 76 pln 5 PWR/GND H 5 prepreg P-BF342+P-BF / & 06 3,85 35 sig 6 SIGNAL H 5 core 3mil H/H C-BF734 TBD 080 3,9 76 pln 7 PWR/GND H 5 prepreg P-BF342+P-BF / & 06 3,85 35 sig 8 SIGNAL H 5 core 3mil H/H C-BF734 TBD 080 3,

34 Relative Material Cost Boeblingen, Status Feb 06 Relative Material Cost (26LTV) Relative % BBN Material Type 34

35 Summary Lead Free does not come for FREE BUT Materials AND Finishes are available that meet customers needs 35

36 Outlook There is still lots of work ahead for the industry to satisfy the entire supply chain AND the entire product spectrum 36

37 37

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