TRANSFER MOULDING & EPOXY MOULD COMPOUND TECHNOLOGY WORKSHOP

Transcription

1 TRANSFER MOULDING & EPOXY MOULD COMPOUND TECHNOLOGY WORKSHOP

2 TRANSFER MOULDING & EPOXY MOULD COMPOUND TECHNOLOGY WORKSHOP INTRODUCTION This workshop will provide participants with knowledge and understanding of the roles and effect of different generic additives and fillers used in IC encapsulation and their impact on properties and specifications. The changes in properties and the metrology used for testing will be highlighted for participants to interpret the specification sheets and understand the appropriate properties required for material selection, finite element modelling and product qualification. Issues encountered in qualification of transfer moulding process and materials, including interaction with other packaging material such substrate, lead frame, die attach, gold and copper wire interconnection, and their root causes will also be highlighted. TARGET AUDIENCE Packaging, Process, R&D/NPI, Materials, Sub-Con, Quality Control, Reliability, and Failure Analysis Managers and Engineers TRAINING OUTLINE Session 1 a. Generic manufacturing process and parameters of clear and epoxy mould compound b. Understand why compound shipments are always partially cured on arrival and how it affects your transfer moulding parameters and yield c. Introduction to key mould compound properties and analysis and understand their implications d. Understand why you should never use TDS data for new product BoM e. Storage and proper handling of clear and epoxy mould compound f. Understanding shelf life and implication of extended storage in fridge g. Thawing procedure that you should be aware to avoid moisture exposure and voiding h. Understanding pot life and implication of extended exposure to production floor i. Understand the effects of longer staging time to your advantage while managing the risk j. Handling of left-over thawed batch and expired material and understand implication of usage k. Precaution required when extending shelf life of expired material

3 TRAINING OUTLINE (cont) Session 2 a. Overview of additives and fillers used in clear and epoxy mould compound b. Understand the difference between formulation change and formulation tweak and consequences that affects your transfer moulding parameter and yield c. Understand cost structure of ingredients as well as manufacturing cost d. Addressing cost reduction and potential implications arising from alternative sourcing e. Role of additives and fillers in influencing key material properties f. Impact of silica fillers to address MSL requirements, incomplete fill, wire sweep, warpage and co-planarity issues g. Impact of ultrafine fillers in clear compound h. Role of coupling agent in increasing modulus and fracture toughness i. Concept of elastomer particle as stress modifier in low stress mould compound j. Introduction to test methods and specimens used by compound suppliers to provide modulus and CTE making it difficult to compare between prospective grades Session 3 a. Understand choice of resin and hardener type use in commercial grades and influence on key material properties such as glass transition temperature and moisture absorption b. Influence of catalyst on cure kinetics of clear and epoxy mould compound c. Transfer mould process optimisation of clear compound and epoxy mould compound d. Addressing crazing induced yield loss in clear compound e. Explore post mould cure elimination with minimal risk f. Monitoring the degree of cure and glass transition temperature (Tg) of mould compound batches using differential scanning calorimeter (DSC) g. Understand influence of adhesion promoter to enhance adhesion to different finishing and at the expense of curability h. Introduction to the different adhesion test specimens and methods adopted by compound suppliers which makes it difficult to compare between prospective grades i. Balancing mould sticking, mould release and mould cleaning j. Role and type of mould release agent to facilitate release and their influence on Tg k. Understand and addressing delamination, mould sticking, premature cull break, stain mark and laser marking contrast issues l. Understand role of low cost, conductive pigment to enhance laser marking contrast but introduce issues for fine pitch wire interconnection m. Understand role of ion getters as a cost effective means to lower ionic impurity and protect gold and copper interconnection

4 TRAINING OUTLINE (cont) Session 4 a. Selection of EMC to pass appropriate MSL requirement b. Moisture saturation under normal and equivalent accelerated soak conditions c. Swelling stresses arising from moisture absorption and saturation Selection of EMC to pass lead-free reflow temperature d. Short exposure during reflow induce further residual cure far exceeding degree of cure achieve by traditional oven post mould cure e. Bending stresses arising from cure shrinkage and warpage of IC package f. Mismatch stresses arising from thermal excursion during IC package assembly processes g. Selection of EMC to address HTS failures in gold wire interconnection h. Understand mould compound property changes during extended heat exposure and consequences i. Ensure additive(s) in EMC do not retard growth of Au-Al inter-metallic compound j. Selection of EMC to address HAST and autoclave failures using copper wire interconnection k. Ensure additive(s) in EMC continue to protect copper wire in the field as during wire bonding l. Selection of EMC for moulded underfill (MUF) applications m. New applications where compromise between solder bump protection and die passivation delamination is essential in addition to low bump height filling requirement n. Worst and best case scenario of processing parameters to ensure successful qualification and short time-to-market new products o. Concept of finger-printing successful product that pass qualification as a record of known good product DURATION 2 Days (9.00 am 5.00 pm) TRAINING DATE(S) & VENUE 6 7 December PSDC, Penang COURSE FEE RM3,200/participant (excluding 6% GST). Course fees are HRDF claimable under the SBL Scheme.

5 TRAINER S PROFILE DR SPENCER CHEW Dr Spencer Chew has thirty years of experience in new product design and qualification, material characterization, failure analysis, and reliability in the semiconductor industry. He spent 15 years working as a Designer at Philips Singapore, a Scientist at Perkin-Elmer, and a member of the Technical Staff at the Institute of Microelectronics before joining Hewlett-Packard/Agilent Technologies in 1998 as Technology Manager (ASIC Package and Optical Product Development). As Global R&D Director at Cookson Electronics between 2003 and 2008, he led R&D teams in the US, India, and Singapore in the development of underfill and epoxy mold compound. His other appointments include Director of Avago Technologies and CTO of Inari-Amertron Bhd. He is currently an adjunct lecturer for material science and engineering modules. Dr Chew graduated with a BEng and a PhD in Materials Engineering from Monash University, Australia. He has authored more than 30 publications in journals and international conferences on thermal characterization and failure analysis of IC packaging materials. ADMINISTRATIVE DETAILS Cancellation Policy: The PSDC reserves the right to cancel or postpone the program but with due notice to the participating company. For any cancellation or postponement of training by the participating company, a written notification by must be sent to the PSDC. Cancellation/postponement charges are calculated based on the following: Receipt of Cancellation/Postponement Notification Seven (7) working days prior to the commencement of training Less than seven (7) working days prior to the commencement of training On the day of the training Charges/Penalty Nil 50% of package fee Full package fee Online Registration: To register, log on to or contact our sales personnel below. Enquiries: For further information, please contact: Elly Leong (ext 523/ellyleong@psdc.org.my) Yuki Lee (ext 517/yukilee@psdc.org.my)

6