Statement of Work (SOW) inemi Packaging TIG SiP Module Moldability Project

Transcription

1 Statement of Work (SOW) inemi Packaging TIG SiP Module Moldability Project Version #1.0 Date: April 22, 2016 Project Leader: Billy Ahn, STATS ChipPAC Co-Project Leader: Anthony Yang, Moldex3D inemi Staff: M. Tsuriya Basic Project Information Background/Context A number of integrated and minimized package solutions has been developed in IC package industry. Markets such as the mobile, consumer and wearable devices are requiring smaller and thinner package solutions. One of the solutions to meet this challenging assessment is System in Package (SiP). SiP is able to meet low package profile which is required of thinning die, small pitches of each components. Because SiP solutions address the market trend of smaller size with high performance, and allow designers to have various options to place components and add more components with less cost and less cycle time with using existing components and changing components position, SiP packaging solutions will form a large segment of the packaging industry in the future. SiP package solutions can be very complex due to the increasing number of IC packages and passive components in given space, and the narrower gap between die-to-passive or passive-topassive, the narrower clearance between mold top to components top as well. High density and complexity of components in the package can increase the risk of molding process. There needs to be a good understanding of the filling characteristics relative to the density of components and of the failure modes such as incomplete fill, void and solder bridges. Purpose of Project Provide basic design rules based on mold flow simulation for a variety of cases with component of different geometries. Verify the validity of the simulation results through experimental work. Page 1 of 6

2 Scope of Work This project will focus on comparing the mold flow ability for different component geometries in substrate by simulation and actual experiment. The mold flowability will be compared as outlined below: 3 different component densities. 3 different gaps between mold top and the highest components top. 3 different clearances between passive-to-passive and IC-to-passive in mold flow simulation and actual experiment. 2 different unit arrays of vertical and horizontal unit array to compare the mold flow and voiding performance. 4 different EMC types. 2 different substrate thicknesses to compare the warpage performance by component density. The simulation will be performed with several factors of substrate layout, mold compound resins and molding condition. Component density difference: The density of components will be approximately 42%, 49% and 65% coverage in 9x15mm PKG size. Mold clearance between mold top and the highest passive top: Clearance is from 10um to 37um. Clearance of passive-to-passive or passive-to-ic: clearance is from 75um to 125um distance. The various geometries will provide guidelines for mold flow with SiP products and give indications on how to optimize the component layout and the gap and distance between components without any failure issues. The experiment will be performed per below DoE plan. Experiment results will be compared with the simulation results, which associates with flow ability and void level. It will be evaluated by visual inspection, scanning acoustic microscopy, X-ray inspection, and scanning electron microscopy to compare with simulation result. Furthermore, the warpage of the test vehicle will be measured to study the impact of the component density on warpage. NOTE: All changes to SOW must be approved by the Technical Committee for version control Page 2 of 6

3 IS / IS NOT Analysis SiP Module Moldability Project This Project IS: To conduct the mold flow simulation, examining several key factors To conduct molding experiments on test vehicles based on the output from the simulation results To evaluate the moldability through the inspection of void and incomplete filling of resin To evaluate the warpage performance by component density and substrate stack-up This Project IS NOT: To conduct a solder joint reliability study To evaluate the substrate materials for moldability study To evaluate the surface finish of substrate for the moldability study To develop a specific standard(s) Biased towards specific suppliers, geographies, or market segments Business Impact This project will provide the industry with better understanding of moldability of SiP modules with various component designs. Participating Organizations OEMs Package assembly houses Material manufacturers Simulation companies Inspection / test house Outcome of Project This project will provide a correlation between simulation and experiment which can be reduced by the experimental time and costs for the team members. This project will be able to provide design guidelines to achieve higher performance to meet market requirements with less development time. Previous Related Work There are some published papers and reports about moldability with single die or multiple dies with a few components. However, there is limited information about moldability study with various SiP designs. This inemi project will provide the guideline or comprehensive ideas about mold flowability with various SiP designs by simulation and experiment. NOTE: All changes to SOW must be approved by the Technical Committee for version control Page 3 of 6

4 Resources Required from Participants: The resources required are listed below. Potential participants and in-kind contributions are identified during the project formation. The detailed resource allocations will be managed in a separate table based on the project sign-up. Materials: Substrates Stack-up: 2 layer and 4 layer Substrate designs Layout: unit placed in vertical and horizontal in a strip Component keep-out: 75um, 100um, 125um Component density: 42%, 19%, 65% Mold compound resins 4 different types (filler size, spiral flow) IC chips (dummy dies) Capacitors Modeling and Simulation Assembly Use the different mold machines Inspection and Measurement Visual inspection (optical, SAM) Warpage The resources required are solder pastes, component test vehicles, board test vehicle design and fabrication. Potential participants and in-kind contributions are identified during the project formation. The detailed resource allocation will be managed in a separate table based on the project sign-up. Project Plan Schedule with Milestones Simulation Task 1 Task 2 Task 3 Task 4 Q1 Q2 Q3 Q4 Q5 Q6 Experiment Task 5 Task 6 Task 7 Task 8 NOTE: All changes to SOW must be approved by the Technical Committee for version control Page 4 of 6

5 Moldability Simulation Study Task 1 BOM Selection (4 weeks) BOM will be decided by participants proposal o EMC material - Some candidates which are recommended by EMC manufacturer o Silicon die - Dummy die will be provided by Assembly company o Passive components - Use passive components per DoE plan o Substrate - Manufacture substrates based on DoE legs Task 2 DoE Planning (4 weeks) Proposed substrate design o Component density and keep-out design (gap between components) o Unit array (vertical and horizontal unit array) o 2 layer and 4 layer substrate Proposed passive design o Passive size and height need to be considered for the clearance between mold top to component top. Design the experiment on the following: o Component density - 3 design o Mold clearance between highest components - 3 design o Component keep-out design study - 3 design o Unit array study (vertical and horizontal unit array of flow direction) - 2 design o EMC type - 4 candidate Task 3 Mold Compound Characterization (4 weeks) Perform mold compound property analysis and characterization for mold filling simulation. o Viscosity and reaction kinetic and thermal properties are required to measure by special test instruments Task 4 Mold Filling Simulation (8 weeks) Mold filling simulations are performed by participants who can use CFD software. Based on DoE planning, simulation will be implemented Moldability Experiments Study Task 5 Experiment Design (4 weeks) Determine the DoE with Phase 1 results. o Material screening o Substrate design o Assembly process conditions Task 6 Manufacturing and Assembly (12 weeks) Mold compound formulation Substrate fabrication for selected design options SiP Assembly o Chip attach and components attach process will be optimized parameter from assembly company NOTE: All changes to SOW must be approved by the Technical Committee for version control Page 5 of 6

6 o Molding processes are based on optimized parameter or parameter from simulation or optimized parameter from assembly company Task 8 Inspection and Measurement (8 weeks) Visual inspection, scanning acoustic microscopy, X-ray inspection. Dynamic thermal moiré warpage measurement (substrate before/ after assembly) Task 9 Data Analysis, Data Review and Reporting (4 weeks) Test executors analyze data and review the result with team Designated work group members to write up designated sections and conclusions for final report Publish final report Project Monitoring Plans Ensure open lines of communication among participants. Review all project requirements with participants before the project begins. Project participants will meet bi-weekly to review various aspects of the project and make plans for next phases of the project. Meeting minutes provided through . Follow-up with individuals on an as-needed basis. Provide any project specific monitoring or communications plans, e.g., multiple project meetings to cover multiple regions (EMEA, Asia, Americas). Workshops and face-to-face meetings as determined by the project team. Progress reports will be provided upon request for presentation at regularly scheduled inemi meetings (e.g., a short series of PowerPoint slides showing the work in progress at member council meetings). Track and document approximate man-months per quarter per team member (this will require the active members of the team to provide estimates). Track and document approximate number of people on the project per quarter (this can be tracked through inemi's WebEx account.) General and Administrative Guidelines for this project and all other inemi Projects are documented at NOTE: All changes to SOW must be approved by the Technical Committee for version control Page 6 of 6