中國集成元件生產製造設備之開發條件. The Development Requirements of Semiconductor Equipmentfor the China IC Industry. Fusen Chen, John Arima and Shawming Ma

Transcription

1 Semicon China 2016 Build China IC Manufacturing Ecosystem 做大做大做强中国集成中国集成电路产业链 中國集成元件生產製造設備之開發條件 The Development Requirements of Semiconductor Equipmentfor the China IC Industry Fusen Chen, John Arima and Shawming Ma

2 Agenda About Mattson Technology China s Semiconductor Environment Equipment Supplier Focus, Today Equipment Supplier Focus, Tomorrow Conclusion March 10, 2016 slide 1

3 About Mattson Technology March 10, 2016 slide 2

4 Long Standing Technology & Productivity Leader Business Snapshot Designs, manufactures and markets semiconductor wafer processing equipment used in IC fabrication Fremont, CA - Headquarters - Strip/Etch - RTP Mfg Global Presence Dornstadt, Germany - MSA Company Profile Founded in HQ in Fremont, CA Products: Etch, Dry Strip, RTP and MSA Diversified customer base: Memory (DRAM, NAND, 3D NAND) Foundry and logic Key customers: Samsung, TSMC, UMC, SMIC, SK hynix, Toshiba/SanDisk, Infineon Extensive IP Portfolio: > 300 patents worldwide Revenue: 2014: Revenues increased 49% over 2013 for the first profitable year since : Maintained revenue levels from 2014 and continued financial health Employees: ~ Etch market share growth driven by advanced memory, including 3D NAND Improved device yield and productivity driving flash MSA adoption for 20nm foundry/logic Compelling CoO driving RTP to expand from memory to sub 20nm foundry/logic High productivity and process extendibility enabling steady dry strip market share March 10, 2016 slide 3 Business Drivers

5 Mattson Technology Product Lines DRY STRIP ETCH RTP MSA DESCRIPTION Clean wafer by removing Photoresist from wafer surface Remove material from wafer surface to create device structures Rapidly heat and cool wafers to lock-in wafer surface properties Heat and cool wafers within timescales of 10 milliseconds or less KEY PRODUCTS SUPREMA SUPREMA XP paradigme paradigme XP Helios Helios XP Millios 2016 TOTAL MARKET SIZE* $200 - $240 million $ $6.25 billion $230 - $270 million $80 -$100 million DIFFERENTIATION Meeting and Exceeding sub-20nm Requirements Technical Capability with Industry Leading Cost of Ownership Superior Productivity and Minimal Pattern Loading Effects Superior Electrical Device Results over Competitors MARKET POSITION Maintaining Leading Market Share into 3D Device Production Tool of Choice for Semi-critical Memory Volume Production Maintaining Market Share in Advanced Memory, Foundry, and Logic Production Tool of Choice for sub- 20nm Logic and Foundry Production COMPETITORS LRCX, PSK AMAT, LRCX, TEL AMAT AMAT, DNS, UTEK * Source: Gartner, SEMI, Mattson 4 March 10, 2016 slide 4

6 Mattson s Upcoming Ownership Transition Mattson has entered a merger agreement with Beijing E-Town Dragon Semiconductor Industry Investment Center (Limited Partnership) New ownership and corporate structure will better support Mattson s long-term goals Product innovation to provide value to our existing customers and to expand our customer base Growth of the business for our employees and partners Operationally, there will be no changes All field operations will continue without interruption Customers will continue to work with the same Mattson personnel Mattson is committed to improving our customer satisfaction throughout the merger process and beyond March 10, 2016 slide 5

7 China s Semiconductor Environment March 10, 2016 slide 6

8 Worldwide & China IC Market Forecast IC Market Forecast by Region ($B) IC Market $ $ $ $ $ $ $ Korea $ 16.2 $ 16.0 $ 16.0 $ 16.2 $ 16.7 $ 17.6 $ 17.6 Taiwan $ 36.2 $ 36.1 $ 36.9 $ 38.1 $ 39.9 $ 43.1 $ 44.2 Japan $ 24.2 $ 21.2 $ 20.8 $ 20.4 $ 20.4 $ 21.2 $ 21.2 Americas $ 65.2 $ 65.2 $ 69.3 $ 73.4 $ 79.5 $ 88.6 $ 92.7 Europe $ 31.7 $ 27.3 $ 27.0 $ 27.2 $ 27.9 $ 29.1 $ 29.0 Other $ 18.3 $ 17.8 $ 17.8 $ 17.6 $ 17.6 $ 18.4 $ 18.2 China $ 99.3 $ $ $ $ $ $ % of Share of IC Market by Region 34% 36% 38% 40% 43% 48% 51% China IC Market by Product ($B) $40 $30 $20 $10 $0 MPU Analog Logic DRAM NAND MCU Other WSTS, IC insight, MTSN (Jan,2016) March 10, 2016 slide China Korea Taiwan Japan Americas Europe Other Worldwide IC market growth in China region China share of IC market will be over 50% by In 2020, China IC market by products will be 1.5 times bigger than 2015

9 China Production Trends China IC Market&Production($B) Supply/Demand (%) $160 China IC Market China IC Production Supply/Demand 40% $140 35% $120 30% $100 25% $80 20% $60 15% Production share of China market: 2009: 7.8% 2015: 12.7% 2020: 18.1% $40 $20 $0 $26.9 $ % 5% 0% TSMC plans to invest $3B to construct first 300mm wafer fab in Nanjing, China $7 $6 China Major IC Manufactures Sales ($B) $6.1 $ $5 $4 $3 $2 $1 $0 $4.1 Hynix (Wuxi) $2.4 $2.2 Samsung (Mpjt) $3.4 $1.8 $4.3 $1.0 $0.7 $0.6 SMIC Intel Hua Hong Semi $2.6 $0.2 $0.3 $0.2 $0.3 $0.2 $0.3 $0.2 $0.1 TSMC CR Micro Diodes-BCD XMC ASMC IC Insight (Jan, 2016), MTSN March 10, 2016 slide 8

10 China Wafer Starts Per Month Forecast mm 300mm China WSPM (K) Gartner (Oct,2015), SEMI (Nov, 2015), MTSN 1Q14 2Q14 3Q14 4Q14 1Q15 2Q15 3Q15 4Q15 1Q16 2Q16 3Q16 4Q16 From beginning 2014 to end mm capacity increased approximately 20% 200mm capacity increased >15% Over calendar 2016, prior year over year growth expected to remain consistent 300mm capacity expected to increase approximately 10% 200mm capacity expected to increase >5% March 10, 2016 slide 9

11 China Wafer Fab Equipment Forecast China WFE ($M) $1,200 $800 $400 $890 $789 $540 $560 $427 $484 $432 $363 $170 $140 $128 $128 $99 $106 $109 $92 $649 $568 $430 $430 $60 $60 $65 $64 $0 1Q14 2Q14 3Q14 4Q14 1Q15 2Q15 3Q15 4Q15 1Q16 2Q16 3Q16 4Q16 Gartner (Oct,2015), SEMI (Nov, 2015), MTSN To support capacity growth calendar mm WFE will accelerate in the 2 nd half of the year 200mm WFE will remain steady through the year Total WFE spending in China is forecast to be >60% higher in 2020 compared to WFE ($M) $ 27,473 $ 31,953 $ 31,799 $ 31,017 $ 33,881 $ 36,615 $ 38,403 $ 41,023 China WFE ($M) $ 2,212 $ 3,213 $ 2,246 $ 2,325 $ 2,723 $ 3,094 $ 3,309 $ 3,602 March 10, 2016 slide 10

12 Equipment Supplier Focus, Today Support of the 200mm Wafer Fab Equipment Producing Internet of Things March 10, 2016 slide 11

13 Helios XP: 200mm Re-Invent Enhanced 200mm Tool from 300mm Learning Applications: S/D Anneal, Spike Anneal, Silicidation Temperature range 450ºC ºC Features and Benefits Wafer Stress Reduction with Symmetric Dual Side Heating Differential Thermal Energy Control (DTEC) Closed Loop Temperature Control with Automatic Compensations of Emissivity (ACE) High efficient purge for ambient <1ppm Closed loop wafer rotation Automation: Dual chamber configuration High throughput EFEM (>120wph) 200mm/300mm Bridge Tools Capability Full factory automation Open cassette / SMIF front load configuration Mattson Re-Invent an Enhanced 200mm tool from 300mm Learning to meet multiple tech nodes requirement in 200mm customers March 10, 2016 slide 12

14 Aspen II Product Refresh to Fulfill 200mm Production Fabs Needs Spares End-of-Life and Obsolescence Parts Support Parts Refresh Program Services Critical Parts Refurbishment or Repair Program Global Field Service Support Factory Technical Support Software Development Support Upgrades Continuous Improvement Programs to extend product lifecycle Guaranteed Tool Availability Program Tool refurbishment program via Suppliers or Licensing Partners Sales of Refurbished Tools through Licensing Partners New tools from Suppliers Mattson commits to Aspen II Product Refresh to Support 200mm Customers March 10, 2016 slide 13

15 Aspen III CES to Support WLP and 200mm /300mm Bridge Tool Applications: Strip in Memory, Logic, Foundry and Advanced Wafer Level Packaging Requirements: Industry Leading Proven Productivity High Throughput and Low Cost Flexible Configuration Support R&D requirement and High Volume Manufacturing 200mm/300mm Bridge Tools Capability Warp Wafer Handling (>5mm) / Translucent Wafer Handling Features and Benefits ICP Strip (Resist and Residue) March 10, 2016 slide 14 Proprietary ICP Source Damage Free Photoresist Removal Reducing the Need to Post-Strip Chemical Processing Advanced Applications -Residue Removal and Surface Cleaning o Including Oxygen and Non-Oxygen based Process ICP HT Enhanced High Throughput Strip Advanced RF Plasma Source Wider Process Window for both FEOL and BEOL Dry Strip Applications Mattson Continues to Develop Products Supporting WLP and Bridge Tool

16 Equipment Supplier Focus, Tomorrow Focus on 300mm Wafer Fab Equipment Productivity March 10, 2016 slide 15

17 RTP Platform Enhancement Consolidation of BOM for reduced standard lead time Improved serviceability and reliability Existing Helios XP Capabilities Throughput improvement >25% BOM level cost reduction >10% Foot print reduction >10% March 10, 2016 slide 16

18 RTP Product Detailed Platform Program 5.2m² Footprint Reduction Total >10% smaller 4.6m² Cost Reduction Total ~10% BOM cost reduction Soak Spike Silicidation Throughput improvement Between 15% and 20% higher throughput March 10, 2016 slide 17

19 Strip Platform Enhancement Consolidation of BOM for reduced standard lead time Improved serviceability and reliability Existing SupremaXP Capabilities Throughput Equivalent to SupremaXP BOM level cost reduction > 10% Foot print reduction >30% March 10, 2016 slide 18

20 Strip Product Detailed Platform Program 6.21m² Footprint Reduction Total >30% smaller SupremaXP Suprema XP Chamber 4.07m² New platform Cost Reduction Total ~12% BOM cost reduction Serviceability improvement Integrated transfer chamber reduces parts March 10, 2016 slide 19

21 Conclusion Strong semiconductor production need in China for next 5 years Internet of Things (IoT) Advanced node development/production Mattson s Equipment development/support strategy Support of the 200mm Wafer Fab Equipment Producing IoT Focus on 300mm Wafer Fab Equipment Productivity March 10, 2016 slide 20

22 Thank you