End of Project Webinar Feb 27, 2014 Co-chairs: Thomas Homorodi (Dell) Aamir Kazi (Dell)

Transcription

1 inemi Project on Assembly-Level Reliability Qualification for Enterprise PCBAs End of Project Webinar Feb 27, 2014 Co-chairs: Thomas Homorodi (Dell) Aamir Kazi (Dell)

2 Agenda Industry Participants Acknowledgments Background and Impetus Goals Benefits Scope: Is/ Is Not Schedule Document Walk-through & Link Wrap up and Next Steps 1

3 Industry Participants 2

4 Acknowledgments The chairs profusely thank the project participants: Fubin Song, Celestica Mitchell Ferrill, IBM Jeffrey Lee, ist Integrated Service Technology, Inc. Tomy Dong, Lenovo Vico Duan, Lenovo Leo Zhao, Lenovo John Godfrey, Microsoft Ander Hsieh, Wistron Jimmy Yang, Wistron And our Project Manager Mark Schaffer, inemi 3

5 Background and Impetus Enterprise PCBA Qualification: Pain Points Addressed Proliferation of PCBA assembly sites worldwide Concurrent intro of new materials with assembly and feature complexity Opaque, non-standard qualification test suites Inconsistent OEM requirements and ODM/EMS/CM responses for similar assembly complexity ODMs receive diverging and conflicting guidance from the multiple OEMs, leading to Multiple qualification cycles at a single ODM/CM add time, costs and delays time-to-market 4

6 Problem Statement, Opportunity and Goal Problem Statement Inconsistency in the qualification of new technology, materials, suppliers/factories at EMS and ODM firms by OEMs (Each OEM has their own, and different, qualification process). Opportunity Level the playing field -- Standardize PCBA reliability qualification methods at the ODM/CM/EMS level Improve supplier capabilities Goal Develop an industry-wide set of common qualification elements and processes for consistent ODM/CM/EMS PCBA reliability 5

7 Benefits Standardize OEM qualification suites Analogous to the automotive industry s QS-9000 Reduce cost by avoiding repeated qualification tests Satisfy demand for qualifying similar technologies across various OEMs Level playing field Across OEM supply base and industry as a whole Reduce ambiguity With qualification suites at ODM/CM/EMS Streamline, simplify Negotiation of qualification suite requirements Instill supplier responsibility Establish qualification level When OEM s are all aligned it administers a consistent minimum qualification requirement across supply base 6

8 IS / IS NOT Analysis This document IS: Defining an OEM/industry-wide Enterprise (inlc telecom datacenter) PCBA reliability qualification methods and processes (toolbox) for developed products using: new suppliers new technologies new materials new processes Intended for Outdoor-telecom Military/aerospace Medical This document IS NOT: For supplier qualifications intended to evaluate capability and quality. The document is meant to qualify new technologies where process development work is complete. Identification of Best Known Methods/ Practices in reliability of electronic OEMs for new qualifications. Utilizes existing industry standards/procedures wherever appropriate. PCBA-level qualification, with evaluation of risk sites on PCBs that depend on solder-assembly process A reliability qualification of newly developed solder assembly processes, technologies, materials at manufacturing facilities of new and existing suppliers. Early R&D for new technology/process or materials viability; not for process definition/development or material evaluation Developing new reliability test standards/procedures/test methods Testing/materials resources commitment Regulatory/environmental materials compliance Re-creation of component qualification test methods and processes Failure Analysis requirement/procedure development Raw PCB material/ construction evaluation Definition of test-level failure criteria. Definition of qualification-suite level failure criteria this is the domain of each OEM, and defined by them 7

9 Project Schedule & Tasks The Timetable for this project was 12 months TASK LIST Q1-13 Q2 Q3 Q4 Q1-14 J F M A M J J A S O N D J F M Task 1: Disseminate current document Task 2: Review OEM documents Task 3: Gap analyses Task 4: Develop Flow, of qualification Task 5: Develop agreement/modifications Task 6: Editing/rewriting Task 7: Approval by team Task 8: Invite EM/CM/ODM feedback Task 9: Release completed document 8

10 Document Walk-through inemi Project Link (and document download): 9

11 Wrap up and Next Steps Develop database of qualification results Classify results by Materials: solders, PCBA Technology/ complexity: Feature sets affected by processes and factory capabilities BGA density and spread on single assembly Layer count and PCB thickness Assembly Processes Reflow, Wave, Selective solder Database will help ODM/ CMS business development Helps OEMs assess EMS/CM by minimizing reliability uncertainty Leverage qualification results for new product using previously qualified processes 10

12 Thank you for attending! Questions and Comments 11

13 contacts: Mark Schaffer