Collaborative Alliance for Semiconductor Test

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1 CAST Update and Outreach Collaborative Alliance for Semiconductor Test Tom Morrow, Vice President, Marketing and Expositions, SEMI 1 10/8/2009 Event, Venue information

2 Agenda Background Vision and Objectives Overview and Structure Working Group Overview and Status Going Forward Objective: Building European participation and optimizing benefits for all regions 2

3 Background Led by Advantest and Intel, the Semiconductor Test Consortium (STC) was established in 2003 to promote open test architecture and other initiatives. The Collaborative Alliance for Semiconductor Test (CAST) was formed in Oct to foster precollaboration and standards development (and overcome STC negative perceptions). In December, CAST decided to join SEMI as a special interest group. CAST 3

4 Vision A single, inclusive, active community of industry leaders to engage a dialog on key challenges, influence strategy and drive toward common solutions to common problems while fostering innovation and differentiation 4

5 Benefits of Standards DIN (German Institute for Standardization). "Economic Benefits of Standardization" : Standards contribute more to economic growth than patents and licenses Companies that participate actively in standards work have a head start on their competitors in adapting to market demands and new technologies Research risks and development costs are reduced for companies contributing to the standardization process 5

6 Opportunities for Test NIST Study on Semiconductor Industry Software standards resulted in $2 billion in benefits, Calibration and standard test methods helped generate another nearly $7.6 billion in benefits for the same period. Planning Report 07-2, Economic Impact of Measurement in the Semiconductor Industry, Prepared by: RTI International for NIST, December

7 CAST CAST, a SEMI Special Interest Group Charter members: Advantest, Amkor, Infineon, Intel, LTX- Credence, Qualcomm, Roos Instruments, Teradyne, and Verigy, ST Microelectronics Unique Charter and Bylaws (SEMI membership not required) dues: Voting Member $3500 (SEMI discount available) Liaison Member - free (requires steering committee invitation) Advisory - free (requires steering committee invitation) Individual - free 7

8 CAST Structure Steering Committee Provisional Chair: Don Edenfeld Executive Committee Technical Committee North American ATE Standards Committee Chair: Karl Stuber Chair: Guenther Jeserer Chair: Paul Roddy Technical WG Standards WG Technical WG Standards WG 8

9 2009 Objectives Foster pre-competitive collaboration Maintain an open and inclusive stance toward membership, enable non-member participation while protecting the voting rights of members Stay visible to the industry, communicate our efforts Research, develop and promote standards that enable industry productivity improvement Perform pre-competitive benchmarks Establish an efficiency baseline using new and established metrics Limited initial scope to refine the process of data collection, analysis and reporting Use results to drive improvement opportunities and integrated with technical agenda Act as a representative and advocate for members Interface with government, academia, other associations, institutions and companies to a meet member needs 9

10 2009 Schedule 10 April 1, Kickoff meeting High attendance (80) and participation July 15, 2009 SEMICON West Host all 6 WG meetings October 6, 2009 Test Cell Software Integration 3 WGs: Yield Enhancement, Test Cell Comm, STDF extensions October 8, 2009 SEMICON Europa CAST Kickoff meeting November 1-6, 2009 International Test Conference WG meetings SEMICON Japan 2-4, December WG meetings

11 CAST Working Groups CAST WG agenda includes: Docking and Mounting Test Cell Communications/Ethernet Protocol STIL: Common Dialects Common STDF Format & Customization Syntax Standard Probe Card Standards Yield Enhancement Correlation Standards Benchtop instrument and Portable Test Instrument Module (PTIM) integration standards Efficiency Benchmarking Criteria Development 11

12 Yield Enhancement WG update The WG problem statement break down: #1: ATE Control Interface Definition Test program flow has become antiquated given emerging trends. Automation and yield tools require a new level of control over the test program. Each tester has a unique software environment. Lack of convergence in tester software interfaces drives complexity and risk. An area of opportunity is in definition of a standard software Application Programming Interface (API) to enable external control of the test program. 12

13 Yield Enhancement WG Update #2: Yield Tool Data Interchange Trend of disaggregation within the semiconductor manufacturing environment continues to accelerate traditional IDMs aligning to outsource models need to efficiently share and consume manufacturing data to enable yield optimization for advanced process technologies is growing. Combining this need for data exchange with the increase in company to company transactions creates a significant opportunity for standards definition for test and/or yield data. Next Steps There was general agreement in the session with respect to the problem statements. Need input from the manufacturers of yield tools to determine the opportunity and motivation to attack the standards opportunities in this area. 13

14 Test Cell Communications WG Update Date-centric Test Cell the main logical functions in the test cell the question "where is it done today and is this the best place for it to be done?". The following was a first attempt to define these logical blocks: Interfaces Binning Datalogging - This point was broken into two possibilities - "Critical" Data - required for binning - this type could be processed immediately - "Interesting" Data - not required for binning - process latest for things like statistical analysis 14

15 Test Cell Communications WG Update Goals Off-load the test cell from a great deal of datalog processing that simply is not needed. Define expanded capability and added value that would drive customers and suppliers alike to implement. Legacy equipment could be accommodated in the new model via software modules or adaptors of some kind. 15

16 STDF Datalog WG Update Deployment status Currently supported by Verigy Teradyne plans to support starting 8.0 Advantest need customer pull EDA companies are also waiting for customer pull Deployment efforts have been affected by the downturn Memory extension going to ballot this year 16

17 Docking & Mounting WG Update Key areas for initial focus: Terminology of docking and interface components and technical references for communication among tester and material handler suppliers Standardization of a superset of alignment and mounting features on probers and handlers that production interface solutions will use 17

18 Docking & Mounting WG Update Issues and trends identified for consideration: Double-sided packaging for stacked die applications Cost of standards development Must trade off cost to simplify designs Vs. cost elimination that will be realized by customers and suppliers in the future Handler companies need to play a key role Working group needs to identify key companies and handler models for inclusion in the focused work ITRS roadmap, and the impact on requirements for interface standards and solutions going forward. 18

19 Docking & Mounting WG Update Multitest now chairs this group Additional members needed to achieve critical mass Suggested Group Structure: Tester company representation: 4-5 Handler companies: 2-5 Customers: 2-4, inclusive of IDM s, Subcons, and Fabless customers 3rd party interface suppliers: 2 19

20 Portable Test Instrument Module (PTIM) WG Update Goal of producing a guidelines document ~Half of the document is drafted several key sections remain to be developed Remaining areas of document will require strong participation from some "regular" PTIM members NI and Aeroflex are only consistent participants ATE participation in the creation of the guidelines document is necessary 20

21 Next Steps Join CAST Membership applications: European Participation Through International WGs European Chapter? DATE, Dresden, Germany 8-12 March, 2010 Questions: Karl Stuber, Sr. Director of Packaging and Test 21