Printed Circuit Boards

Transcription

1 Printed Circuit Boards Division Pascal Keller Investor Conference I I 1

2 Cicor Printed Circuit Boards Applications, capabilities, markets Capabilities!! Lines/spaces down to down 40!m!! Min. thickness 25!m!! Up to 50 layers Main markets!! Medical!! Watches!! Industrial!! Telecom!! IC testing!! Automotive!! Aerospace & defense!! Scientific!! Sensors Investor Conference I I 2

3 Global Market Development, Regions K USD Regions 2011 TAM * 2011 SAM ** SAM Region % 2011 Cicor PCB % Americas 5'901 1'180 29% 7% Europe 6' % 90% China 17' % 0 Japan A 9' % 0 S Taiwan 6' % 0 I Korea A 5' % 0 RoAsia 2' % 3% RoW % 0 Total 54'587 4'033 * source ZVEI '** Assumption Total Available Market (TAM) Market penetration Europe. Main regions targeted for growth: Americas & China Servable Available Market (SAM) Investor Conference I I 3

4 Units within PCB Division Cicorel SA Boudry, Switzerland Cicorel SA Moudon, Switzerland Photochemie AG Unterägeri, Switzerland High-end flex, rigid-flex, and rigid MLBs HDIs: laser drilling Reel-to-reel flex 3D-MID Competence Center Mid and high volume production of complex single and double layer PCBs with high service content and quick response Quick-turn, small volume production of complex rigid and rigidflex MLBs and HDIs Investor Conference I I 4

5 Cicor PCB Division Revenue per Market Watches 27% Medical 17% Hearing Aids 10% Testing 15% Automotive 12% Space&Defense 8% Industrial 7% Others 5% Investor Conference I I 5

6 Medical Market Unit Boudry Competences!! Serving the very demanding implant market with flex, rigid-flex PCB s!! Engaged and supporting the PCB needs of top innovators in the Medical Market!! Production specific features: 25!m lines & spaces, very high complexity Investor Conference I I 6

7 Medical Market Hearing Aids Unit Boudry Competences!! Established know-how about flex PCB s tailored to hearing aids!! Support to growing complexity and miniaturization!! Support to fast production volumes rump-up!! Prod specific feactures: hi-end multi-layers flex, miniaturization Investor Conference I I 7

8 Automotive Safety Market Unit Boudry Competences!! 100% SPC!! 0 PPM in Safety and Security!! High volume productions (ap.1 mio units per week)!! Prod specific features: Reliability, Process stability Investor Conference I I 8

9 Watch Market Unit Moudon Competences!! Historical customers and long term relation (>95% market share)!! High volumes (approx. 2 Mio. Units per week)!! Service & quality!! Prod specific features: Reel to reel, complex 2 layers Investor Conference I I 9

10 Testing Market Unit Unterägeri Competences!! High Layer counts (up to 50 layers)!! Stacked vias!! Quick turn-around!! Low volumes - high Mix Investor Conference I I 10

11 Aerospace & Defense Market Unit Unterägeri Competences!! Optimized design to manufacture by internal Application Engineering!! Offer of advanced technical solutions!! Fast development possible due to short response times!! Quick turn-aroung and high flexibility!! Monitored quality, 0-fault deliveries policy Investor Conference I I 11

12 Military Products Strong customer base in Military applications!! Medium volumes!! Long term relation ship!! High quality demands!! Advanced Technology!! High frequency applications!! Special materials!! Tight specifications Investor PCB Conference Technology I I 12

13 Unique selling proposition Reel to reel production Solutions for!! High volume applications!! Consumer markets!! Double side contacts with blind vias Investor Conference I I 13

14 Application (I)!!Aircraft 6 meter long PCB Investor Conference I I 14

15 Application (II) Smartcards!! 2-layer PCB with laser drills!! very high volumes!! With solder mask Investor Conference I I 15

16 Reel-to-Reel: Overview!!Reels for continuous high volume PCB production!! Continuous laser drilling!! Structuring 2-layer-PCBs Investor Conference I I 16

17 Unique selling proposition 3D-MID Technology Center Injection Molding Laser Structuring Chemical Plating Electronic Assembly One Stop Shop: from injection molding to electronic assembly Competence Center 3D-MID Technology: Product and process development in Boudry/Switzerland Manufacturing: in Boudry as well as in other cicor facilities in Europe and Asia Investor Conference I I 17

18 Unique selling proposition 3D-MID Technology Center Injection Molding Laser Structuring Chemical Plating Electronic Assembly Cicor has many years of experiences in all process steps which are needed for the production 3D MID products Cicor has many years of application s Know-how in the markets in which 3D-MID is used! Our experiences in the whole process chain combined with our application s know-how enable us to offer tailor-made solutions to our Customers Investor Conference I I 18

19 Integration Capabilities by 3D-MID 1.! Connector 2.! Battery 3.! EM-Shielding 4.! Assembly of diverse electronic parts 5.! Labelling 6. WLAN antenna 7. Data matrix (2D code) 8. LEDs 9. Mechanical switch 10. Capacitive switch 11. Warning sign 12. Centre hole 13. Fiducials 14. BGA 15. Contact switch 16. Vias Investor PCB Conference Technology I I 19

20 3D MID - Historical Overview Estimated MID-Turnover in Mio. Euro MID PCB Research phase Development phase Growth phase PCB patent registration First serial PCB Doublesided PCB Dry film process Assembly machines Investor PCB Conference Technology I I 20

21 Main Drivers of the 3D-MID Technology!!Miniaturization!! Opportunity to solve space problems (e.g. automotive, medical, telecommunication etc.)!!rationalization and system simplification!! Reduction of process steps, number of parts and mounting time!!functionality!! New additional functions possible due to various functional integration options, design flexibility and precision provided by 3D-MID Investor Conference I I 21

22 Manufacturing Processes / LDS Laser Direct Structuring Injection molding Single shot injection molds parts doped with a metal-complex Laser activation The layout is structured by laser processing Investor PCB Conference Technology I I 22

23 Manufacturing Processes / LDS Laser Direct Structuring Plating Metallization grows on the laser processed structures Electronic assembly Electronic components are assembled via treatments like soldering, bonding etc. Investor PCB Conference Technology I I 23

24 Product, application examples medical Source: Kavo Hand-piece for Kavo Dental: integration of electrical and mechanical functions on closest space Source: 2E Mechatronic Lampe with LED luminous element for dental application Investor PCB Conference Technology I I 24

25 Product, application examples Automotive Source: Kroschu Source: BMW Source: BMW Multifunctional switch for BMW K1300: Integration of various functions like turn signal, lighting, horn and navigation Source: TRW Automotive Multifunctional steering control switches for BMW Z4 Investor Conference I I 25

26 Unique selling proposition Fineline Technology Standard Volume Production Standard HDI Technology Cicor Flex Technology Cicor Rigid Technology Cicor Flex Technology Introduction of liquid resist technology 75µm 50µm 25µm Linewidth Investor Conference I I 26

27 Conclusion Global Network Europe / America Asia Top Customers Market Leaders Fast Prototypes to High Volume runs Unique offer through one supplier Reel to Reel High End Line and Spaces Fully integrated 3D-MID Investor Conference I I 27

28 Thank you Investor Conference I I 28