9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

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1 9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) info@systemplus.fr - website : September Version 1 Written by: Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. Akustica AKU230 MEMS Microphone 1

2 Table of Contents Glossary 1. Overview / Introduction Executive Summary Reverse Costing Methodology 2. Akustica Company Profile Akustica Profile AKU230 Specifications Akustica Business Model 4. Physical Analysis Synthesis of the Physical Analysis Physical Analysis Methodology Package Characteristics & Markings Package Pin-Out Package X-Ray Package Cross-Section Device Structure Package Opening Die Dimensions Die Markings Die Overview Bond Pads Membrane & Vent Holes Membrane Details Back Cavity & Vent Holes Delayering MEMS Structure MEMS Cross-section CMOS/MEMS Process Characteristics Physical Data Summary 5. Manufacturing Process Flow Global Overview CMOS Process Flow Description of the CMOS Wafer Fabrication Unit MEMS Process Flow Description of the MEMS Wafer Fabrication Unit Packaging Process Flow 6. Cost Analysis Synthesis of the Cost Analysis Main Steps of Economic Analysis Yields Explanation Yields Hypotheses CMOS Front-End : Hypotheses CMOS Front-End Cost MEMS Front-End : Hypotheses MEMS Front-End Cost MEMS Front-End Cost per Process Steps MEMS Front-End : Equipment Cost per Family MEMS Front-End : Material Cost per Family Back-End 0 : Probe Test & Dicing Die Cost (Front End + Back End 0) Back-End 1 : Packaging Cost Back-End 1 : Final test & Calibration Cost AKU230 Component Cost (FE + BE 0 + BE 1) 7. Estimated Price Analysis Definition of Prices Manufacturer Financial Ratios AKU230 Estimated Manufacturer Price Contact by SYSTEM PLUS CONSULTING, all rights reserved. Akustica AKU230 MEMS Microphone 2

3 Package Characteristics & Markings Package type: 6-pin LGA Dimensions: Marking: 3.76mm x 4.72mm x 1.25mm <Akustica logo> AK230 Q474X 2511C Package Top view Package side view Package back view 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Akustica AKU230 MEMS Microphone 3

4 Package Cross-Section Cross-section Overview MEMS Cavity 115µm Package Cavity Package Cross-section 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Akustica AKU230 MEMS Microphone 4

5 Package Opening Bonding material: Gold Bonding diameter: 20µm Bonding number: 5 Package top portion CMOS/MEMS Chip Package bottom portion Wire bonding Package Opening Optical view 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Akustica AKU230 MEMS Microphone 5

6 Package Opening CMOS/MEMS Chip Silver-filled adhesive Package Opening SEM views 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Akustica AKU230 MEMS Microphone 6

7 Die Overview According to the die side pattern, we assume that the dicing of the wafer is realized with a stealth dicing process. Die Overview SEM view Die side SEM View 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Akustica AKU230 MEMS Microphone 7

8 Membrane Details Mesh membrane Membrane contact SEM view M3 M1 Mesh membrane Membrane contact SEM view 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Akustica AKU230 MEMS Microphone 8

9 MEMS Process Flow CMOS area MEMS area CMOS area MEMS Process CMOS wafer As received from foundry Oxide SiN IMD 3 M3 IMD 2 M2 IMD 1 M1 Oxide Si Substrate MEMS Process Back side masking 2 masking steps Photoresist Photoresist 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Akustica AKU230 MEMS Microphone 9

10 Contact Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates. Given the hypothesis presented in this analysis the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated) IC +/- 8% MEMS +/- 5% Packaging +/- 10% Test +/- 20% These results are open for discussion. We can re-evaluate this circuit with your information. Please contact us: 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Akustica AKU230 MEMS Microphone 10