Co-Tech. The First Choice Of Copper Foil Solution Provider. Copper Oxide (II) Co-Tech Copper Foil P A

Size: px
Start display at page:

Download "Co-Tech. The First Choice Of Copper Foil Solution Provider. Copper Oxide (II) Co-Tech Copper Foil P A"

Transcription

1 Copper Oxide (II) Copper Foil P A

2 Agenda Company overview Product & technology roadmap Production line Quality Assurance Certificates P 1

3 Company Overview Taiwan Stock market : OTC 8358 Date Established : 1998 May Capital : NTD 2.1 Billion Products : Copper Foil / CuO No. of Employees : 295 P 2

4 Company Milestone established, started to build manufacturing site Site 1 started production ISO-9001 / ISO Site 2 started production Shen Zhen customer svc & logistics commenced operations 1/3oz(12u)started production Successfully developed Copper Foil for hi-speed digital PCB (Microwave) Taiwan (Patent NO:199216) China (Patent NO: Successfully developed Halogen Free & Lead Free Copper Foil P 3

5 Company Milestone 2006 ISO-14001: 2004 certified Honored with Sustainable Development Awards No 1 ranking Honored with Green Products Award 2007 Started trading in Taiwan emerging stock market Ticker : Successfully produced Batch formulation Switch to trade in OTC Annual production capacity 18,000 Ton From Lead anode to Titanium anode 2012 VLP - FPCB, FR4, BGA, Double Shinny LIB, COF, 2014 Double treatment Copper Oxide P 3

6 Company Philosophy Philosophy Integrity 誠信 Innovation 創新 Commitment 承諾 Quality 品質 Technology 技術 Service 服務 Delivery 運送 P 4

7 Organization Sales & Marketing Jack Yam R&D Bruce Lu Customer Service Sales & Marketing R&D QC General area Director C.H. Chen President Tony Ke Sr. Vice President Bruce Lu Production site 1 Production Site 2 Processing Project Auditor Grace Lee Production Purchasing Operation Personnel Finance Golden Wang M I S Finance/Accounting P 6

8 Production Sites (Copper Foil) Production site 1 (Yunlin Technology Industrial District) Year Built : 1998 Total floor space: 24,998 m2 Quality Cert: ISO-9001, ISO Products: ED copper foil - SD, HB, RT Series---9u,18u, 35u, 70u,105u,140u Production site 2 (Yunlin Technology Industrial District) Year Built : 2002 Total floor space: : 39,999 M2 Quality: ISO-9001, ISO Products: ED copper foil- LP, HB, VLP, AKH LP RT Series---9u, 18u, 35u, 70u,105u,140u P 8

9 Production Sites (CuO) CuO factory (Yunlin Technology Industrial District) Photographic on 2014/2/10 Year Built : 2014 Quality: ISO-9001, ISO-14001, TS16949 Products: CuO HDI Capacity : 300 ton/month (total 600 ton/month est 2016)

10 Application of Copper Foil Lithium-ion Bat 5.2% CCL PCB 77.2% Others 11.2% EMI. Paper. PDP Copper Foil FCCL FPCB 2.6% Packaging 3.8% Battery Assembly

11 Technology Roadmap 1. CuO 2.VLP 3.AS-free 4. Double treatment 5. Profile free 1.Flexible PCB 2. BGA 3. HDI 4.Battery 無鹵素 & 無鉛製品用銅箔 - Green product Yates Technology 超高頻 PCB 用銅箔 - Microwave. 通訊基地台 2000 低陵線 & 反轉銅箔 - Flex. Automotive. Military. Portable 高溫延展標準銅箔 - Computer. Notebook. Peripheral. Electronic Devices.

12 電子級氧化銅粉介紹 產品特性 /Product Features 1) 優越的性能 /Excellent Performance - 低氯含量 (Low Chloride-Cl Content ) - 快速溶解 (Rapid Dissolution Rate) - 電鍍表面光滑 (Smooth Plating Surface) - 低金屬雜質含量 (Low Metal Contents ) - 優越的流動率 (Superior Flow ability) - 高純度銅含量 (High Cu Content) 2) 可靠的供貨 /Reliable Supply - 準時交貨 (Right Time Delivery) - 客製化品質管控 (Customized Quality Control) 3) 全方位的服務 /Total Solution Services - 內外部品質檢驗 & 保證 (In/External Quality Inspection & Assurance) - 終端 ( 電鍍 ) 產品技術服務 (Technical Services on the final (plated) product)

13 金居電子級氧化銅粉規格 應用 & 規格 /Application & Specification - 常見名稱 (Name): Copper Oxide Black, Copper(II) Oxide, Cupric Oxide - 分子量 (Molecular Weight): CAS No.: 項目 CuO Cl 含水率 (Mois.) Items(ppm) 測試步驟 & 方法 (Procedure & Test Method) - 銅純度 (Cu Content): 滴定法 (Titration, EDTA) - 氯含量 (Cl Content): 滴定法 (Titration, Potentiometric Method) - 金屬雜質 (Metals): ICP,AA 溶解速率 (Dissolution rate) (%) (ppm) (%) Pb Fe Zn Ni (Sec) 業界規格 (PCB Spec) 金居規格 ( Spec) 代表性能 (Typical Data) ) 包裝 (Packaging): 袋裝 25kg(25kg/paper bag), 棧板 1,000 kg(1,000 kg/jumbo bag)

14 氧化銅粉生產流程圖 無廢水! 無廢渣!

15 產品特性介紹 1) X 光繞射分析 (XRD Analysis CuO) - 高純度氧化銅晶體 (High CuO purity through XRD Analysis) 儀器資訊 : 廠牌 : BRUKER D8 Discover 工作電壓為 40kV 工作電流為 40mA 分析條件 : θ/2θ 掃描模式 ; 掃描速率為 2 度 / 分鐘 ; 掃描範圍為 度使用金屬銅靶波長為 Å 圖中黑線爲樣品 XRD 測試曲線, 籃色柱線爲 CuO 的標準衍射峰, 二者吻合的很好, 爲純度很高的 CuO 圖中紅色柱線爲 Cu 2 O 的標準衍射峰位元, 測試曲線在該位置無衍射峰出現, 表明本式樣所含結晶物主體為 CuO

16 2) 多孔隙結構 (Porous Structure) 產品特性介紹 - 多孔性活性大, 溶解速率高 (High Dissolution Rate through High Porosity) - 金居活性優於競爭同業 (Superior activity to competitor) A 社 B 社 C 社 x300 x3000

17 產品特性介紹 3) 標準篩分析 200 Mesh 通過率 (Sieve Fineness(200 mesh)) : 99 % min. CuO Sieve Test * Sample weight : 100g Sieve No. Opening (um) 留篩百分比 (%) 累計留篩重百累計通過百分留篩重量 (g) 分比 (%) 比 (%) % 0.02% 99.98% % 0.07% 99.93% % 0.36% 99.64% % 2.57% 97.43% % 22.50% 77.50% % 96.51% 3.49% > 500 < % % 0.00% Sieve Fineness(200 Mesh) : 99.64%

18 產品特性介紹 4) 快速溶解速率 (Rapid Dissolution Rate) 測試方法 Test Method: (1) 氧化銅 (CuO Input):4.00 g (2) 硫酸 (H 2 SO 4 10%) 體積 :200ml (3) 溫度 (Temeperature):25 (4) 攪拌 (Stirring Rate):400rpm

19 產品特性介紹 4) 快速溶解速率 (Rapid Dissolution Rate) 檢驗氧化銅溶解速率 Checking the initial dissolution rate after the input of copper oxide in copper sulfate solution 測試方法 (Test Method) - 氧化銅 (CuO Input):4.00 g - 硫酸 (H2SO4(10%) 體積 :200ml - 溫度 (Temeperature):25 - 攪拌 (Stirring Rate):400rpm

20 產品特性介紹 5) 優越的流動速率 (Superior Flow ability) - 適合自動添加系統 (Suitable for the Auto Supply System)

21 產品特性介紹 6) 哈氏槽測試 (Hull Cell Test) 測試方法 (Test Method) - 以金居 CuO 配製 Initial Make-up by Co-tech CuO - VMS(230/100/50) 25-2A - 結果 (Results): 亮度 (Brightness) OK

22 產品特性介紹 7) 填孔性能測試 (Via-Filling Performance Test- Beaker Test) 測試方法 (Test Method) - LVF(200/75/50), B(3ml/L),C(35ml/L),L(3ml/L) - 電流密度 : 20 ASF(1.01 A), 45min ( 目標厚度 : 20 μm ) - 空氣 (Air) 攪拌 : 2LPM - 測試板 (Test Panel) 尺寸 : 120 μm φ~70 μm d 測試結果 (Test Result) - 鍍層厚度 (Film Thickness): μm - 凹陷 (Dimple): 8.94 μm

23 實驗室儀器設備 UV Spectrophotometer Cu,Cl - Titrator Metallurgical Microscope AA (Atomic Absorption Spectrometer)

24 實驗室儀器設備 TOC 分析儀 CVS 分析儀 電解分析儀 GC (Gas Chromatography)

25 實驗室儀器設備 高溫灰化爐 ICP (Inductively Coupled Plasma) Sieve Tester Haring Cell Hull Cell

26 Structure Analysis SEM/EDX EDX Analysis

27 品質管理系統認證 Honor ISO/TS Certificate ISO-9001 Certificate ISO Certificate OHSAS Certificate

28 謝謝您的詳閱! 金居台灣代理商 :PCB-Solution Inc. 聯絡人 : 田毓祺手機 : 電話 : 傳真 : george@pcb-solution.net Home page:

29 THANK YOU