ANSYS, Inc. ANSYS Icepak R18 Update

Transcription

1 ANSYS, Inc. ANSYS Icepak R18 Update

2 Icepak R18 Highlights Enhancements to SIwave <-> Icepak solution Added automated iterative loop Improved Via handling capabilities Individually modeling vias no K averaging Via Drill holes imported RedHawk CTM import with back annotation of Temps into RH Meshing Improvements Solver Improvments Vacuum -> enable radiation control in fluid zones Support for Streamwise Periodicity Inputs for Mass Flow or Pressure Gradient Cu-brass SpaceClaim Direct Modeler incorporates DME Simplify Functions ECXML support for data exchange Improved HPC performance Arbitrary Board Outline Imports using IDF Improved Krylov ROM for efficient network modeling Post Processing LED Efficiency as a function of temp. Solar Heat Flux reporting Improved Surface Probing Smooth 3D Contours Optimized Manhattan displays Transient option for Full Reports Node-weighted interpolation for accurate facet-based post-processing ANSYS, Inc.

3 SIwave-Icepak Workflow Improvements From ANSYS SIwave: Conduction only analysis Natural convection analysis Forced convection (fan) analysis Multi-phase VRM design support IDF boundary conditions & Heat Sink creation Geometry pre-processing for standalone Icepak Component power (Watts) allocation during setup Joule heating power mapping into Icepak & Mechanical Cut plane temperature monitoring in XY-, XZ-, and YZ-planes Ability to Open and perform more detailed analysis & reporting in standalone Icepak! Thermal Cut-Planes Joule Heating ANSYS, Inc.

4 SIwave-Icepak Workflow Improvements Icepak Setup in SIwave ANSYS Icepak is solved directly in SIwave for conduction only and basic convection models After setting up in SIwave, an Icepak project is built and run in the background and the temperatures are post-processed in the SIwave GUI Automation of iterative loop until DC convergence ANSYS, Inc.

5 SIwave-Icepak Workflow Improvements Icepak Setup in SIwave Filter added to delete all RLC components below a certain power Helps reduce number of components in Icepak ANSYS, Inc.

6 SIwave-Icepak Workflow Improvements Icepak Setup in SIwave Button added for convection to auto-size the Cabinet in the ANSYS Icepak project ANSYS, Inc.

7 SIwave-Icepak Workflow Improvements Icepak Setup in SIwave Updated Mesh settings for improved robustness Spatial Profile implementation for the power dissipation map has resulted in major improvements in overall turnaround time and robustness If available, most generic setups (old Automatic setup in ANSYS Icepak) can be run directly in the SIwave project setup ANSYS, Inc.

8 SIwave-Icepak Workflow Improvements Icepak Enhancements Improved usability and robustness Spatial Profile implementation (using PCB primitive in Icepak) for the power dissipation map has resulted in major improvements in overall turnaround time and robustness Boards can be offset or rotated from their original location ANSYS, Inc.

9 SIwave-Icepak Workflow Improvements Icepak Enhancements Support for Multiple Boards Boards of same setup can point to the same initial SIwave project The macro will launch the initial run, create the individual sitemp files and then queue the individual launches of new SIwave projects Each board/substrate must have a separate SIwave project ANSYS, Inc.

10 SIwave-Icepak Workflow Improvements Icepak Enhancements Improved Usability Macro now only requires pointing to the board in Icepak and the project file for the SIwave project ANSYS, Inc.

11 Chip Package System Workflow Enhancements ANSYS Redhawk CTM Import into Icepak CTM View in Icepak ANSYS, Inc.

12 Chip Package System Workflow Enhancements Back annotation from Icepak to Redhawk Main Menu/Report/Export/RedHawk Back Annotation Export the temperature at each tile to RedHawk Select the die block. Select the CTM file Select location for output ANSYS, Inc.

13 MCAD to Icepak Enhancements ANSYS SpaceClaim is the new de facto CAD Cleanup Tool for all ANSYS products Geometry simplification, repair, and modification is significantly streamlined compared to ANSYS DesignModeler At v18, several of the DesignModeler Electronics Utility capabilities have been incorporated into ANSYS SpaceClaim. SpaceClaim Icepak ANSYS, Inc.

14 MCAD to Icepak Enhancements Auto-Identify Simple Icepak Shapes in SpaceClaim After initial geometry cleanup is complete, the Identify Objects command can automatically create simple Icepak shapes Input Geometry Structure Tree Icons are Updated Before After Icepak block icon ANSYS, Inc.

15 MCAD to Icepak Enhancements Icepak Simplification Levels in SpaceClaim Level 0: Converts geometry to a bounding box prism Level 0 Level 1 Level 1: Converts geometry to a collection of prisms and cylinders Level 2: Converts geometry to a polygonal approximation Level 2 Level 3 Level 3: Keeps the geometry as-is (use only when needed) ANSYS, Inc.

16 MCAD to Icepak Enhancements Modify Icepak Object Type in SpaceClaim Sometimes it makes sense to change the object type, some examples are Icepak Plate Source, Wall, Opening Icepak Block PCB Icepak Block Icepak PCB Level 2 simplification already done Structure tree icon is updated The geometry remains the same, but the object options are different in Icepak ANSYS, Inc.

17 ECXML: Icepak Flotherm Data Exchange Format Supported Features: Cabinet, Plates, Blocks, Walls, Sources, PCBs, Grilles, Resistances, Enclosures, Heatsinks, 2R Network Blocks, 2D & 3D Fans Materials: Solid Assemblies Monitor Points Implemented cross-platform encryption algorithm Joint testing effort with Mentor ANSYS, Inc.

18 Solver Enhancements Improved HPC Performance Icepak Model highlights: MCAD, ECAD, Non-conformal Assemblies, 734 objects Icepak Mesh highlights: ~11 M cells using unstructured, non-conformal, multi-level, hex-dominant meshing scheme Icepak Solution highlights: Steady state, Turbulent Flow, Conjugate Heat Transfer, Double Precision. Desktop Server Setup in Icepak ANSYS, Inc.

19 Solver Enhancements Improved HPC Performance System Information Intel Xeon CPU E5-4650L 2.6 GHz processors, 512 GB RAM 4 processors, 32 cores Running Windows Server 2012 R2 Standard. HPC Test Summary Trials were run using ANSYS Icepak v18.0 and ANSYS Icepak v17.0. Each trial was run for 250 iterations. Solution time tracking: Overall Run Time: Includes Case Setup and Computational Effort ANSYS, Inc.

20 Overall Run Time (Hrs) Solver Enhancements Improved HPC Performance Icepak R17 vs R18 Overall Run Time vs Number of Cores Number of Cores R17 - Overall Run Time R18 - Overall Run Time ANSYS, Inc.

21 Speed-up Solver Enhancements Improved HPC Performance Icepak R17 vs R18 Speed-up vs Number of Cores Overall run time for 1 core taken as reference to calculate Speed-up Number of cores Speed-up - v17 Speed-up - v ANSYS, Inc.

22 Solver Facet-based Post Processing: Object Faces Enable facet-based post processing for object face contours Temperature, Heat flux, Heat transfer coefficient variables available Export values to profile files Option to display contours on wall and wall-shadow ANSYS, Inc.

23 Legal Disclaimer ANSYS product information is highly confidential and proprietary. By proceeding with ANSYS product discussions, recipients agree not to use or disclose this information for any purpose. ANSYS product information is not a binding commitment, and is subject to change in ANSYS sole discretion. ANSYS undertakes no obligation to update product information. Purchase decisions, investments and other actions should not be taken in reliance on ANSYS product information, which may be prospective in nature, forward-looking and not guaranteed to occur ANSYS, Inc.

24 Icepak Vision -> R18.1 & Beyond Create an Automated, Streamlined Electro-Thermal Multi-Physics Solution that utilizes Native MCAD/ECAD for First Pass Mesh/Solve Success Key Drivers/Mandates Modern UI, Ease-of-Use Integration into AEDT Rapid Release Cycles R18.1 First release Initial exposure with most common feature set CPS with Enclosure Steady-state thermal Improved Workflow Native MCAD Modeler ECAD-MCAD Assembly Integrated Electro-Thermal Workflow Geometry Clean Up & Simplification ANSYS Electronics Desktop (AEDT) AEDT-Icepak ANSYS, Inc.