FLIP-CHIP TECHNOLOGIES AND GLOBAL MARKETS
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1 FLIP-CHIP TECHNOLOGIES AND GLOBAL MARKETS SMC089B July 2016 Sinha G. Project Analyst ISBN: BCC Research 49 Walnut Park, Building 2 Wellesley, MA USA (toll-free within the USA), or (+1) information@bccresearch.com
2 TABLE OF CONTENTS CHAPTER 1 INTRODUCTION 2 STUDY GOALS AND OBJECTIVES 2 REASONS FOR CONDUCTING THE STUDY 2 SCOPE OF REPORT 2 INTENDED AUDIENCE 3 INFORMATION SOURCES 3 ANALYST'S CREDENTIALS 4 RELATED BCC RESEARCH REPORTS 4 BCC RESEARCH WEBSITE 4 DISCLAIMER 5 CHAPTER 2 SUMMARY 7 SUMMARY TABLE GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, SUMMARY FIGURE GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 8 8 CHAPTER 3 OVERVIEW 10 MARKET DEFINITION 10 EVOLUTION OF FLIP-CHIP WAFER BUMPING TECHNOLOGIES 10 FIGURE 1 DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, SOLDER EVAPORATION 10 FIGURE 2 SOLDER EVAPORATION PROCESS 11 ELECTROPLATING OF SOLDER ALLOYS 11 FIGURE 3 SOLDER ALLOY ELECTROPLATING PROCESS 11 SOLDER PASTE SCREENING 12 FIGURE 4 SOLDER PASTE SCREENING PROCESS 12 SOLDER BALL REPLACEMENT 13 C4NP PROCESS 14 SIGNIFICANT PATENTS ON FLIP-CHIP TECHNOLOGIES 14 METHOD FOR FLIP CHIP PACKAGING CO-DESIGN 14 Abstract 14 USE OF ELECTROLYTIC PLATING TO CONTROL SOLDER WETTING 14 Abstract 15 LEADLESS MULTI-LAYERED CERAMIC CAPACITOR STACKS 15 Abstract 15 FLIP-CHIP LED PACKAGE 15 Abstract 15 MEMS SENSOR INTEGRATED WITH A FLIP-CHIP 16 Abstract 16 COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER Abstract 17 LOW NOISE FLIP-CHIP PACKAGES AND FLIP-CHIPS THEREOF 17 Abstract 17 COPPER POST SOLDER BUMPS ON SUBSTRATES 17 16
3 Abstract 18 MATRIX LID HEATSPREADER FOR FLIP CHIP PACKAGE 18 Abstract 18 FLIP-CHIP MMIC HAVING MOUNTING STIFFENER 18 Abstract 18 FLIP-CHIP BONDER AND FLIP-CHIP BONDING METHOD 19 Abstract 19 RED FLIP-CHIP LIGHT EMITTING DIODE, PACKAGE AND METHOD OF MAKING THE SAME Abstract 19 FLIP-CHIP TYPE LASER DIODE 20 Abstract 20 SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE 20 Abstract 20 COPPER PILLAR SIDEWALL PROTECTION 20 Abstract 21 ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT Abstract 21 METHOD OF FORMING COPPER PILLAR BUMP WITH NON-METAL SIDEWALL SPACER AND METAL TOP CAP Abstract 22 SUBSTRATES FOR PACKAGING FLIP-CHIP LIGHT EMITTING DEVICE AND FLIP-CHIP LIGHT EMITTING DEVICE PACKAGE STRUCTURES Abstract 22 FLIP-CHIP SOLAR CELL CHIP AND FABRICATION METHOD THEREOF 23 Abstract 23 FLIP CHIP OVERMOLD PACKAGE 23 Abstract 23 FLIP-CHIP LIGHT EMITTING DIODE PACKAGE STRUCTURE 24 Abstract 24 ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF FABRICATING THE SAME, AND ELECTRICAL CONNECTING STRUCTURE COMPRISING THE SAME Abstract 24 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER Abstract 25 LEAD-FREE SOLDER ALLOY 25 Abstract 26 DUMMY FLIP CHIP BUMPS FOR REDUCING STRESS 26 Abstract 26 ELECTRONIC ASSEMBLY WITH COPPER PILLAR ATTACH SUBSTRATE 26 Abstract 26 FLIP-CHIP ASSEMBLY COMPRISING AN ARRAY OF VERTICAL CAVITY SURFACE EMITTING LASERS (VCSELSS), AND AN OPTICAL TRANSMITTER ASSEMBLY THAT INCORPORATES THE FLIP-CHIP ASSEMBLY Abstract 27 LEAD-FREE SOLDER BUMP BONDING STRUCTURE
4 Abstract 28 EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD Abstract 28 APPARATUS FOR LEAD FREE SOLDER INTERCONNECTIONS FOR INTEGRATED CIRCUITS Abstract 29 HIGH VOLTAGE FLIP-CHIP LED STRUCTURE AND MANUFACTURING METHOD THEREOF Abstract 29 FLIP-CHIP INTERCONNECTION STRUCTURE 30 Abstract 30 STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 30 Abstract 30 FLIP-CHIP PACKAGE 30 Abstract 31 LOCALIZED HEATING FOR FLIP CHIP BONDING 31 Abstract 31 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 31 Abstract 32 CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION 32 Abstract 32 FLIP-CHIP PACKAGE FOR MONOLITHIC SWITCHING REGULATOR 32 Abstract CHAPTER 4 FLIP-CHIP TECHNOLOGY MARKET BY WAFER BUMPING PROCESS 35 INTRODUCTION 35 MARKET DYNAMICS 35 DRIVERS 35 Expansion of Semiconductor Business 35 Application of Flip Chips in Packaging 35 End-User Demand Among Consumers 35 RESTRAINTS 36 Stringent Government Regulations 36 European Union 36 High Investment Cost 36 Structural Problems in Solder Bumps 37 OPPORTUNITIES 37 Lead-Free Flip-Chip Assembly 37 TABLE 1 GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%) FIGURE 5 GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%) TABLE 2 GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH 2021 (MILLION UNITS) FIGURE 6 GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, (MILLION UNITS) TABLE 3 GLOBAL FLIP-CHIP TECHNOLOGY AVERAGE PRICE PER UNIT BY WAFER BUMPING PROCESS, ($)
5 Copper Pillar 40 TABLE 4 GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, FIGURE 7 GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, Copper Bumping Features 42 Tin-Lead Eutectic Solder 43 TABLE 5 MECHANICAL PROPERTIES OF TIN-LEAD (SN-PB) 43 TABLE 6 PHYSICAL PROPERTIES OF TIN-LEAD (SN-PB) 43 TABLE 7 GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, FIGURE 8 GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, Advantages of Tin-Lead Eutectic Solder 45 Lead-Free Solder 45 TABLE 8 CHARACTERISTICS OF VARIOUS ELEMENTS 46 TABLE 9 CHARACTERISTICS OF VARIOUS MIXED COMPOSITIONS 46 Properties of Some Commonly Used Alloy Systems 48 58Bi-42Sn 48 52In-48Sn 48 TABLE 10 GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, FIGURE 9 GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, Gold Stud Bumping 49 TABLE 11 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, FIGURE 10 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, CHAPTER 5 FLIP-CHIP TECHNOLOGY MARKET BY APPLICATION 53 INTRODUCTION 53 FIGURE 11 MARKET SEGMENTATION BY APPLICATION 53 MARKET DYNAMICS 53 DRIVERS 53 New and Improved 3-D Integrated Circuits 53 Invention of Double Data Rate Fourth-Generation (DDR4) Memory 54 RESTRAINTS 54 Challenges in Transition 54 OPPORTUNITIES 54 DDR5 Memory for the Future 54 TABLE 12 GLOBAL MARKET DEMAND FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, FIGURE 12 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, 2-D LOGIC SYSTEM-ON-A-CHIP 56 FIGURE 13 STRUCTURE OF MULTI-CHIP MODULE 56 FIGURE 14 STRUCTURE OF SYSTEM-ON-CHIP 57 TABLE 13 GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION,
6 FIGURE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, MEMORY 59 TABLE 14 COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY 59 TABLE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, FIGURE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, IMAGING 62 TABLE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, FIGURE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, HIGH-BRIGHTNESS LIGHT-EMITTING DIODE (HB-LED) 64 FIGURE 18 STRUCTURE OF HB-LED 65 TABLE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, FIGURE 19 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, SMALL LOGIC, RADIO FREQUENCY, POWER, ANALOG, AND MIXED-SIGNAL INTEGRATED CIRCUITS TABLE 18 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, FIGURE 20 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, 2.5-D AND 3-D SYSTEM-IN-PACKAGE/SYSTEM-ON-A-CHIP 68 FIGURE 21 ARCHITECTURE OF 2.5-D INTEGRATED CIRCUIT 68 FIGURE 22 STRUCTURE OF 3-D INTEGRATED CIRCUIT 69 TABLE 19 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, FIGURE 23 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, CHAPTER 6 FLIP-CHIP TECHNOLOGY MARKET BY END USE 72 INTRODUCTION 72 MARKET DYNAMICS 72 DRIVERS 72 Increased Application of Flip Chip in Automotive 72 Application of Smart Technologies 73 Extensive Research and Development 73 RESTRAINTS 73 Time Consumption for New Innovation 73 OPPORTUNITIES 73 Household Robots in the Future 73 TABLE 20 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, THROUGH FIGURE 24 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, ($ SMARTPHONES
7 TABLE 21 GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, FIGURE 25 GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, LAPTOPS 77 TABLE 22 GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, FIGURE 26 GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, DESKTOP CENTRAL PROCESSING UNITS 78 TABLE 23 GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, FIGURE 27 GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, GRAPHICS PROCESSING UNIT AND CHIPSETS 79 TABLE 24 GLOBAL FLIP-CHIP MARKET IN GRAPHIC PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, FIGURE 28 GLOBAL FLIP-CHIP MARKET IN GRAPHICS PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, OTHER COMPUTING DEVICES 81 TABLE 25 GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, FIGURE 29 GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, AUTOMOTIVE 82 TABLE 26 GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, FIGURE 30 GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, ROBOTICS 84 TABLE 27 GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, FIGURE 31 GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, MEDICAL DEVICES 85 TABLE 28 GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, FIGURE 32 GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, SMART TECHNOLOGIES 87 TABLE 29 GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, FIGURE 33 GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, INDUSTRIAL APPLICATIONS 88 TABLE 30 GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, FIGURE 34 GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, CHAPTER 7 FLIP-CHIP TECHNOLOGY MARKET BY REGION 91
8 INTRODUCTION 91 FIGURE 35 REGIONAL SEGMENTATION OF THE FLIP-CHIP MARKET 91 MARKET SNAPSHOT 91 TABLE 31 GLOBAL MARKET FOR FLIP-CHIP PRODUCTION BY REGION, THROUGH TABLE 32 GLOBAL MARKET FOR FLIP-CHIP END-USE DEMAND BY REGION, NORTH AMERICA 92 OVERVIEW 92 TABLE 33 NORTH AMERICAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, TABLE 34 NORTH AMERICAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, TABLE 35 NORTH AMERICAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH TABLE 36 NORTH AMERICAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ RULES AND REGULATIONS IN NORTH AMERICA 95 EUROPE 95 OVERVIEW 95 TABLE 37 EUROPEAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, TABLE 38 EUROPEAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, TABLE 39 EUROPEAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ TABLE 40 EUROPEAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ RULES AND REGULATIONS IN EUROPE 98 RoHS 98 RoHS 2 98 ASIA-PACIFIC REGION 99 OVERVIEW 99 TABLE 41 ASIA-PACIFIC MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, TABLE 42 ASIA-PACIFIC MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, TABLE 43 ASIA-PACIFIC FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ TABLE 44 ASIA-PACIFIC FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ RULES AND REGULATIONS OF VARIOUS ASIA-PACIFIC ECONOMIES 101 China 101 REST OF THE WORLD 102 OVERVIEW 102 TABLE 45 ROW FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ TABLE 46 ROW FLIP-CHIP MARKET BY APPLICATION, CHAPTER 8 INDUSTRY STRUCTURE AND COMPETITIVE ANALYSIS 105
9 INDUSTRY STRUCTURE 105 INFLUENTIAL FACTORS 105 FORECAST COMPONENTS 105 FIGURE 36 INDUSTRY REVENUE MODEL 105 MARKET SHARE ANALYSIS 106 TABLE 47 GLOBAL FLIP-CHIP MARKET SHARES BY KEY PLAYERS, 2014 (%) 107 FACTORS IMPACTING THE FLIP-CHIP MARKET 108 SUPPLIERS' POWER 108 BARGAINING POWER OF BUYERS 108 THREAT FROM SUBSTITUTES 108 THREAT FROM NEW ENTRANTS 108 DEGREE OF COMPETITION 109 PATENT ANALYSIS 109 PATENTS BY REGION 109 FIGURE 37 REGIONAL ANALYSIS OF PATENTS, DECEMBER 2012-DECEMBER PATENTS BY YEAR 110 FIGURE 38 NUMBER OF PATENTS FILED BY YEAR, DECEMBER 2012-DECEMBER 2015 (NO OF PATENTS) 110 CHAPTER 9 COMPANY PROFILES 112 AMKOR TECHNOLOGY INC. 112 OVERVIEW AND PRIMARY BUSINESS 112 FINANCIALS 112 BUSINESS STRATEGIES 112 Innovation in Product Portfolio Through Research and Development 112 RECENT DEVELOPMENTS 113 ASE GROUP 113 OVERVIEW AND PRIMARY BUSINESS 113 FINANCIALS 113 BUSINESS STRATEGIES 113 Business Expansion Through Licensing Agreement 113 RECENT DEVELOPMENTS 114 FARADAY TECHNOLOGY CORP. 114 OVERVIEW AND PRIMARY BUSINESS 114 FINANCIALS 114 BUSINESS STRATEGIES 114 Strengthening Product Portfolio 115 RECENT DEVELOPMENTS 115 FLIPCHIP INTERNATIONAL LLC 115 OVERVIEW AND PRIMARY BUSINESS 115 FINANCIALS 116 BUSINESS STRATEGIES 116 Expanding Business Portfolio Through Agreements 116 RECENT DEVELOPMENTS 116 GIGPEAK INC. 116 OVERVIEW 117 FINANCIALS 117 BUSINESS STRATEGIES 117
10 Business Expansion by Acquisition 117 RECENT DEVELOPMENTS 117 GLOBALFOUNDRIES INC. 118 OVERVIEW AND PRIMARY BUSINESS 118 FINANCIALS 118 BUSINESS STRATEGIES 118 Strengthening Product Portfolio 118 RECENT DEVELOPMENTS 118 IBM CORP. 119 OVERVIEW AND PRIMARY BUSINESS 119 FINANCIALS 119 BUSINESS STRATEGIES 119 Business Expansion Through Acquisition 120 RECENT DEVELOPMENTS 120 INTEL CORP. 120 OVERVIEW AND PRIMARY BUSINESS 120 FINANCIALS 121 BUSINESS STRATEGIES 121 Acquisitions to Extend Product Portfolio 121 RECENT DEVELOPMENTS 121 KYOCERA AMERICA INC. 121 OVERVIEW AND PRIMARY BUSINESS 122 FINANCIALS 122 BUSINESS STRATEGIES 122 New Product Development 122 RECENT DEVELOPMENTS 122 NANIUM SA 123 OVERVIEW AND PRIMARY BUSINESS 123 FINANCIALS 123 BUSINESS STRATEGIES 123 New Product Development 123 Business Expansion Through Partnership 123 RECENT DEVELOPMENTS 124 NICHIA CORP. 124 OVERVIEW AND PRIMARY BUSINESS 124 FINANCIALS 124 BUSINESS STRATEGIES 124 Expanding Business Through Agreements 124 RECENT DEVELOPMENTS 125 NTK TECHNOLOGIES INC. 125 OVERVIEW AND PRIMARY BUSINESS 125 FINANCIALS 125 BUSINESS STRATEGIES 126 Business Expansion 126 RECENT DEVELOPMENTS 126 PHILIPS LUMILEDS LIGHTING CO. 126 OVERVIEW AND PRIMARY BUSINESS 126
11 FINANCIALS 126 BUSINESS STRATEGIES 127 Innovation in Product Portfolio 127 RECENT DEVELOPMENTS 127 POWERTECH TECHNOLOGY INC. 127 OVERVIEW AND PRIMARY BUSINESS 127 FINANCIALS 128 BUSINESS STRATEGIES 128 Business Expansion Through Agreements 128 RECENT DEVELOPMENTS 128 RENESAS ELECTRONICS AMERICA INC. 128 OVERVIEW AND PRIMARY BUSINESS 128 FINANCIALS 129 BUSINESS STRATEGIES 129 New Product Development 129 RECENT DEVELOPMENTS 129 SAMSUNG ELECTRONICS CO. LTD. 129 OVERVIEW AND PRIMARY BUSINESS 130 FINANCIALS 130 BUSINESS STRATEGIES 130 New Product Development 130 Business Expansion Through Acquisition 130 RECENT DEVELOPMENTS 131 SIGNETICS CORP. 131 OVERVIEW AND PRIMARY BUSINESS 131 FINANCIALS 131 BUSINESS STRATEGIES 131 Business Expansion 132 RECENT DEVELOPMENTS 132 SILICONWARE PRECISION INDUSTRIES CO. LTD. 132 OVERVIEW AND PRIMARY BUSINESS 132 FINANCIALS 133 BUSINESS STRATEGIES 133 Strategic Business Agreement 133 RECENT DEVELOPMENTS 133 SK HYNIX INC. 133 OVERVIEW AND PRIMARY BUSINESS 133 FINANCIALS 134 BUSINESS STRATEGIES 134 New Product Development 134 Research and Development 134 RECENT DEVELOPMENTS 134 STATS CHIPPAC PTE. LTD. 135 OVERVIEW AND PRIMARY BUSINESS 135 FINANCIALS 135 BUSINESS STRATEGIES 135 New Product Development 135
12 RECENT DEVELOPMENTS 136 STMICROELECTRONICS NV 136 OVERVIEW AND PRIMARY BUSINESS 136 FINANCIALS 136 BUSINESS STRATEGIES 136 Strengthening Product Portfolio 136 RECENT DEVELOPMENTS 137 SUSS MICROTEC AG 137 OVERVIEW AND PRIMARY BUSINESS 137 FINANCIALS 137 BUSINESS STRATEGIES 138 New Product Development 138 RECENT DEVELOPMENTS 138 TAIWAN SEMICONDUCTOR MANUFACTURING CO. 138 OVERVIEW AND PRIMARY BUSINESS 138 FINANCIALS 139 BUSINESS STRATEGIES 139 Business Expansion Through Collaboration 139 RECENT DEVELOPMENTS 139 TEKTRONIX COMPONENT SOLUTIONS INC. 139 OVERVIEW AND PRIMARY BUSINESS 140 FINANCIALS 140 BUSINESS STRATEGIES 140 Strengthening Product Portfolio 140 RECENT DEVELOPMENTS 140 TESSERA TECHNOLOGIES INC. 141 OVERVIEW AND PRIMARY BUSINESS 141 FINANCIALS 141 BUSINESS STRATEGIES 141 Strengthening Product Portfolio 141 RECENT DEVELOPMENTS 141 TEXAS INSTRUMENTS INC. 142 OVERVIEW AND PRIMARY BUSINESS 142 FINANCIALS 142 BUSINESS STRATEGIES 142 Strengthening Product Portfolio 142 RECENT DEVELOPMENTS 143 TOKYO ELECTRON LTD. 143 OVERVIEW AND PRIMARY BUSINESS 143 FINANCIALS 144 BUSINESS STRATEGIES 144 Strengthening Product Portfolio Through New Product Development 144 RECENT DEVELOPMENTS 144 TOSHIBA ELECTRONICS EUROPE GMBH 144 OVERVIEW AND PRIMARY BUSINESS 144 FINANCIALS 145 BUSINESS STRATEGIES 145
13 New Product Development 145 RECENT DEVELOPMENTS 145 UNISEM (M) BERHAD 146 OVERVIEW AND PRIMARY BUSINESS 146 FINANCIALS 146 BUSINESS STRATEGIES 146 Business Expansion 146 RECENT DEVELOPMENTS 147 UTAC HOLDINGS LTD. 147 OVERVIEW AND PRIMARY BUSINESS 147 FINANCIALS 147 BUSINESS STRATEGIES 148 Strengthening Product Portfolio 148 RECENT DEVELOPMENTS 148
14 LIST OF TABLES TABLE HEADING SUMMARY TABLE GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, TABLE 1 GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%) TABLE 2 GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH 2021 (MILLION UNITS) TABLE 3 GLOBAL FLIP-CHIP TECHNOLOGY AVERAGE PRICE PER UNIT BY WAFER BUMPING PROCESS, ($) TABLE 4 GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, TABLE 5 MECHANICAL PROPERTIES OF TIN-LEAD (SN-PB) 43 TABLE 6 PHYSICAL PROPERTIES OF TIN-LEAD (SN-PB) 43 TABLE 7 GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, THROUGH TABLE 8 CHARACTERISTICS OF VARIOUS ELEMENTS 46 TABLE 9 CHARACTERISTICS OF VARIOUS MIXED COMPOSITIONS 46 TABLE 10 GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, THROUGH TABLE 11 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, TABLE 12 GLOBAL MARKET DEMAND FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, TABLE 13 GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, TABLE 14 COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY 59 TABLE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, TABLE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, TABLE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, TABLE 18 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, TABLE 19 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, TABLE 20 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, THROUGH TABLE 21 GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, TABLE 22 GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, THROUGH TABLE 23 GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, TABLE 24 GLOBAL FLIP-CHIP MARKET IN GRAPHIC PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, TABLE 25 GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, TABLE 26 GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, TABLE 27 GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS,
15 TABLE HEADING TABLE 28 GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, TABLE 29 GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, TABLE 30 GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, TABLE 31 GLOBAL MARKET FOR FLIP-CHIP PRODUCTION BY REGION, THROUGH TABLE 32 GLOBAL MARKET FOR FLIP-CHIP END-USE DEMAND BY REGION, THROUGH TABLE 33 NORTH AMERICAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, TABLE 34 NORTH AMERICAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, TABLE 35 NORTH AMERICAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH TABLE 36 NORTH AMERICAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ TABLE 37 EUROPEAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH TABLE 38 EUROPEAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, TABLE 39 EUROPEAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ TABLE 40 EUROPEAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ TABLE 41 ASIA-PACIFIC MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, TABLE 42 ASIA-PACIFIC MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, TABLE 43 ASIA-PACIFIC FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ TABLE 44 ASIA-PACIFIC FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ TABLE 45 ROW FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ TABLE 46 ROW FLIP-CHIP MARKET BY APPLICATION, 103 TABLE 47 GLOBAL FLIP-CHIP MARKET SHARES BY KEY PLAYERS, 2014 (%)
16 LIST OF FIGURES FIGURE TITLE SUMMARY FIGURE GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, FIGURE 1 DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, FIGURE 2 SOLDER EVAPORATION PROCESS 11 FIGURE 3 SOLDER ALLOY ELECTROPLATING PROCESS 11 FIGURE 4 SOLDER PASTE SCREENING PROCESS 12 FIGURE 5 GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%) FIGURE 6 GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, (MILLION UNITS) FIGURE 7 GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, FIGURE 8 GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, FIGURE 9 GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, ($ FIGURE 10 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, FIGURE 11 MARKET SEGMENTATION BY APPLICATION 53 FIGURE 12 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, FIGURE 13 STRUCTURE OF MULTI-CHIP MODULE 56 FIGURE 14 STRUCTURE OF SYSTEM-ON-CHIP 57 FIGURE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, FIGURE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, FIGURE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, FIGURE 18 STRUCTURE OF HB-LED 65 FIGURE 19 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, FIGURE 20 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, FIGURE 21 ARCHITECTURE OF 2.5-D INTEGRATED CIRCUIT 68 FIGURE 22 STRUCTURE OF 3-D INTEGRATED CIRCUIT 69 FIGURE 23 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, FIGURE 24 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, ($ FIGURE 25 GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, FIGURE 26 GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, FIGURE 27 GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, FIGURE 28 GLOBAL FLIP-CHIP MARKET IN GRAPHICS PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, FIGURE 29 GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS,
17 FIGURE TITLE FIGURE 30 GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, FIGURE 31 GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, FIGURE 32 GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, FIGURE 33 GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, FIGURE 34 GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, FIGURE 35 REGIONAL SEGMENTATION OF THE FLIP-CHIP MARKET 91 FIGURE 36 INDUSTRY REVENUE MODEL 105 FIGURE 37 REGIONAL ANALYSIS OF PATENTS, DECEMBER 2012-DECEMBER FIGURE 38 NUMBER OF PATENTS FILED BY YEAR, DECEMBER 2012-DECEMBER 2015 (NO OF PATENTS)
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