Next Generation Factory Session Opening Remarks

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1 Accelerating Manufacturing Productivity Next Generation Factory Session Opening Remarks Sanjay Rajguru Associate Director, ISMI Copyright 2009 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

2 ISMI Economic Model 3 Year Recovery Positive news ahead 4 Year Recovery 11% Decline 7 Year Growth 23% Decline 7 Year Growth 30 November

3 ISMI Economic Model Area demand by wafer size 300 mm significant growth Past Future 30 November

4 Needed: Next Generation Factory strategy The demand for silicon resumes it s 7% growth. Need for immediate productivity gains are critical Time Waste elimination Enhanced data infrastructure Enhanced data usage 30 November

5 2009 ISMI Programs/Projects Metrology ESH Technology Center ISMI Councils Continuous Improvement Next Generation Factory 450 mm Transition Defect Metrology Lithography Metrology Films Metrology ESH Global Strategies ESH Resource Conservation ESH Technology Environmental Research Center (ERC) ESH Advanced Technology Assessments Five Operations Councils Seven Business Councils Productivity Workshops Lean Manufacturing Workshops Alternate Source Spare Parts 200 mm / 300 mm EPITeams Non-Product Wafer Reduction NGF Realization Factory Productivity and Cost Analysis NGF Data Collection (EDA/Data Quality) Predictive Preventive Maintenance Continuous Processing Enhanced Equipment Quality Assurance 450 mm Silicon Readiness 450 mm Test Wafer Generation 450 mm Equipment Demonstration 450 mm ESH Challenges 450 mm Factory Readiness / ITB Manufacturing Excellence 30 November

6 Accelerating manufacturing productivity Productivity Cost Reduction Sustainability 30 November

7 SEMICON Japan 2009 Accelerating Manufacturing Productivity ISMI Next Generation Factory Program Industry Briefing Olaf Rothe NGF Program Manager December 2, 2009 Tokyo Bay Makuhari Hall Copyright 2009 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

8 Outline Vision and Mission Capabilities & Infrastructure Metrics: Cost and Cycle Time ISMI NGF Project Updates 2010 Outlook NGF Key Messages 30 November

9 Accelerating Manufacturing Productivity ISMI NGF Program Vision and Mission Copyright 2009 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

10 300mm Fab Population Doubling 30 November

11 ISMI NGF Program 2009 Member Company Requirements Substantial productivity improvement is still required for 300mm factories New NGF capabilities are expected to be implemented in new and existing 300mm factories Most NGF capabilities are expected to be implemented in less than three years Availability & Predictability, Continuous Processing, First Wafer Delay & Set-up, and Access to Data are the most important NGF capabilities Waste reduction efforts and a systematic approach to improve Overall Equipment Efficiency (OEE) have become strategic parts of ISMI NGF program Enhanced Equipment Quality Assurance (EEQA) gained member company support as methodology to improve equipment performance Infrastructure development required to enable implementation of capabilities, waste reduction and OEE improvement 30 November

12 ISMI NGF Program Vision and Mission ISMI NGF Program Vision Enable an industry collaborative productivity improvement path for next generation factories that contributes to the ISMI member company targets of 30% cost reduction and 50% cycle time improvement by Mission The ISMI NGF Program is committed to accelerating cost-effective manufacturing through the collaborative development of infrastructure elements and industry guidance to enable the capabilities that improve next generation factories. 30 November

13 ISMI NGF Program Relation to CIP and 450mm Program Differences Similarities Continuous Improvement Program (CIP) Tactical Specific/Spot solutions Shared learning and best practices Next Generation Factory (NGF) Tactical and Strategic General capabilities and infrastructure development Focus on productivity improvement Equipment improvements Equipment & Factory improvements Waste reduction Strategic orientation 450mm Program Strategic Wafer size and material handling standardization Synergies 300mm equipment and factory productivity gaps identified 300mm equipment and factory infrastructure solutions NGF solutions implementable in 450 factories 30 November

14 Accelerating Manufacturing Productivity Capabilities and Infrastructure Copyright 2009 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

15 NGF Infrastructure Development Objectives : Develop NGF capabilities and infrastructure that help to achieve the ISMI member company targets ACTION Waste reduction KNOWLEDGE OEM / IDM collaborative visualization INFORMATION DATA Equipment data Productivity Improvements OEE improvements Collaborative Data Usage Standardized metrics and methods Common Metrics Standardized Data Collection Factory data Establish commonly accepted metrics to enable waste reduction Develop NGF capabilities to reduce waste; improve equipment availability and performance; and reduce costs of factory operations, equipment maintenance, facilities and consumables Develop infrastructure to support the identified capabilities NGF Capabilities Equipment Monitoring Access to Data Predictability and Availability Equipment Health Monitoring Equipment Efficiency Monitoring 2009 NGF Program Work Area Continuous Processing Equipment Cascading Capabilities Factory Wide Cascading Small Lot Size Single Wafer Processing 30 November

16 Data Collection and Usage Data Collection & Usage - Data to Information to Knowledge to Action EE Data Models & Data Usage Next generation data collection, data usage and waste reduction are key NGF enablers Data completeness and event driven data collection: Equipment (performance, parametric, context, consumption, control) and factory data Data Quality and Time Synchronization Data standardization: Metadata - structured, comprehensive Consolidation of data requirements 30 November

17 Waste Reduction and Metrics Waste Reduction and Metrics - Data to Information to Knowledge to Action WIP ITRS Equipment Output Waste (EOW) Target Cycle Time = AREA MTBG (Mean Time between good units) Current State ITRS Wait Time Waste (WTW) Waste as in muda (Lean): Transportation Inventory Motion Waiting Overproduction Over Processing Defects Wait Time Waste, Equipment Output Waste Equipment, factory, and wafer view Definition of waste elements Common metrics dictionary facilitates communication Measurement of current state and improvement Raw Processing Time Lot 1 (RPT1) Raw Processing Time Lot 2 (RPT2) TRPT = RPT1 + RPT2 The third lot starts a new cascade and benefits from overlapping of initial events up to setup. A new recipe requires the full setup time Initial Lot Setup Events Parameter Checking only Total Move In to Move Out time for two lots (TTOT) Raw Processing Time Lot 3 (RPT3) Full Setup time required For a new recipe 30 November

18 Collaborative Visualization Collaborative Visualization - Data to Information to Knowledge to Action Shared view by IDM and OEM Same data Same methodologies Same conclusions Raw Processing Time Lot 1 (RPT1) Raw Processing Time Lot 2 (RPT2) TRPT = RPT1 + RPT2 The third lot starts a new cascade and benefits from overlapping of initial events up to setup. A new recipe requires the full setup time Predictive Preventive Maintenance Maintenance waste reduction Prediction of failure Maintenance coordination Seamless Cascading Hot lot insertion End Of Lot prediction Setup reduction Enhanced Equipment Quality Assurance Equipment matching Acceptance time reduction Performance monitoring Initial Lot Setup Events Parameter Checking only Total Move In to Move Out time for two lots (TTOT) Raw Processing Time Lot 3 (RPT3) Full Setup time required For a new recipe 30 November

19 Accelerating Manufacturing Productivity NGF Productivity Metrics Cost and Cycle Time Copyright 2009 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

20 NGF Metrics - Modeling Results Ideal Throughput Standardization Cycle Time Value EEQA PPM SC Modeled, no likely project Current ISMI projects Future ISMI projects Innovative Solutions OEE (Cascading, U/A) Waste Reduction Cost Driver: OEE (Availability, Performance), Utilization, OWR 25k wspm base factory + 10k wspm through improved OEE / NPW / Utilization 25 wafer lots AV = 92% OEE = 56% U/A = 88% CT = 42 days Small Lot size Single Wafer Tools Innovative solutions Factory Cascading Advanced Material Management EEQA PPM SC NPW Cycle Time Driver: Availability, Cascading, Single Wafer Process Tools 30 November

21 Accelerating Manufacturing Productivity 2009 General Learning and Project Results Copyright 2009 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

22 2009 Project Learning 2009 data usage projects and pilots have been analyzed for their impact on NGF infrastructure development and capabilities requirements PPM EEQA SC VM Collaborative Data Usage NGDC Standardized Data Collection ISMI projects and pilots Common Metrics EDA required for next generation factory data collection (NGF enabler) EDA confirmed for data collection for a wide set of applications OEE as metric not sufficient Wait time waste elements and definitions do not exist Data to Information to Knowledge to Action 30 November

23 Standardized Data Collection EDA confirmed as a requirement for next generation factory data collection (NGF enabler) Metadata evaluation results More than a dozen major OEM tools evaluated (checklist defined, feedback to OEMs, scoring implemented) Backbone of EDA Common issues and errors Improvements (general and per tool type) Implementation guidance document (rules, recommendation) Difficult matching of factory and equipment data (by time stamp, wafer ID) Data to Information to Knowledge to Action 30 November

24 Common Metrics Collaborative Data Usage Next level of productivity improvements requires more granular and precise metrics OEE combines factory and equipment issues without enabling detailed analysis Common Metrics Performance and utilization contains non value-added time pieces Metrics for waste time elements Wait Time Waste vs OEE Non-scheduled time do not exist Multiple perspectives Equipment view Lot view Wafer view New SEMI Draft Document 4704A for ballot demonstrates broader industry interest outside of ISMI Unscheduled Downtime Scheduled Downtime FOUP1 Select for Tool A Transport Request / empty vehicle move Engineering time FOUP Pick-up / transport initiated Standby Time FOUP Placement on loadport 1 / ID & slot map verification initiated no material FOUP ID and slot map verified / notify Host Recipe, CJ / PJ Host Initiates Download to tool A Tool initiates CJ / PJ setup CJ / PJ start sent from host, Setup/FWD begins Setup/FWD complete / process start First wafer processing complete Wafer exchange time PJ complete, data collection CJ complete to host Transport Request FOUP pickup Non-Available Time Waste Time Operational Time VA time Manufacturing Time Productive Time Data to Information to Knowledge to Action E-10 and E-79 metrics contain value-added time and some wasted time 30 November

25 Project Results Next Generation Data Collection Metadata evaluation and feedback 12 key equipment types and supplier Average EDA implementation improvement is 16% Guidance document published from the learnings New requirements defined (context data, state machines, implementation) Initiated automated evaluation tool with NIST EDA standards have been updated to address identified issues EDA standards ready for a 2010 freeze level DATA EDA Viewer - Light weight, working EDA sample client example (delivered to the members) Equipment data Standardized Data Collection Factory data 30 November

26 Project Results Predictive Preventive Maintenance KNOWLEDGE OEM / IDM collaborative Predictive Preventive Maintenance visualization guidelines and requirements INFORMATION completed Guidance for semiconductor equipment suppliers and device makers Introduction of common PPM language Description of data requirements Extension of existing preventive maintenance (PM) factory systems to create an optimized maintenance system. Proof of concept demonstrations in progress Key supplier, university, and member company engagement Proof of concept of prediction of remaining useful life (RUL) Selected maintenance cases Collaborative Data Usage Cost Impact Availability (as part of OEE) 1.8% Cycle Time Impact 25 Wfr model 6% 12 Wfr model 9% Standardized metrics and methods Common Metrics 30 November

27 Project Results Seamless Cascading Equipment cascading capabilities List of cascading improvements Lot complete prediction Recipe change impact estimate Hot lot insertion Deterministic AMHS delivery Metrics Determined OEE not specific enough and no waste metrics available Draft of waste metrics in progress Enhanced Equipment Quality Assurance Development of an EEQA data usage scenario Demonstration of an EEQA implementation Definition of EEQA requirements KNOWLEDGE OEM / IDM collaborative visualization INFORMATION Collaborative Data Usage Standardized metrics and methods Common Metrics Cost Impact Performance (as part of OEE) 9.3% Utilization 4.6% Cycle Time Impact 25 Wfr model 19% 12 Wfr model 39% Cost Impact (combined with waste reduction approach) Performance and Utilization (as part of OEE) 7.4% Cycle Time Impact 25 Wfr model 3% 12 Wfr model 4% 30 November

28 Accelerating Manufacturing Productivity 2010 Outlook Copyright 2009 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

29 Program and Project Outlook Next Generation Data Collection SEMI EDA standards Freeze NGF data requirements consolidation Automated metadata evaluator Validate value and ROI of factory applications using EDA DATA Equipment data Standardized Data Collection Factory data Predictive Preventive Maintenance Finish Proof of concept demonstrations Validate economic value and ROI ACTION Waste reduction Feed data requirements into NGDC and standardize Define and demonstrate a methodology to optimize Scheduled maintenance Condition based Predictive maintenance Productivity Improvements OEE improvements 30 November

30 Program and Project Outlook Time Waste Metrics Development Support metrics definition Measurement methodologies KNOWLEDGE OEM / IDM collaborative visualization INFORMATION Collaborative Data Usage Standardized metrics and methods Common Metrics Requirements, scope and approach identified for future work Strive for consistency of different approaches (ISMI, ITRS, Selete) Enhanced Equipment Quality Assurance EEQA Equipment guidelines Equipment capability assessment EEQA Methodology Implementation Guidelines and Data Model Development ACTION Waste reduction Productivity Improvements OEE improvements 30 November

31 Accelerating Manufacturing Productivity NGF Key Messages Copyright 2009 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

32 Key Messages: ISMI NGF Program The ISMI NGF timeline and target remains 30% cost reduction and 50% cycle time improvement by 2012 OEE improvement is a key component to cost reduction The 30/50 target requires new capabilities. The most important NGF capabilities identified as OEE drivers by the ISMI member companies are Availability & Predictability Continuous Processing Access to Data First Wafer Delay & Set-up Reduction ISMI s contribution may not close the 30% cost reduction gap completely EEQA and Waste Reduction identified as key new areas to improve equipment performance Metrics and measurement methods for wait time waste (WTW) and equipment output waste (EOW) are needed 30 November

33 ISMI NGF Supplier Expectations The participating NGF member companies encourage suppliers to collaborate with ISMI to establish the capabilities and infrastructure needed to meet NGF targets (30% cost and 50% cycle time reduction) Key areas for collaboration are: Equipment data structure and collection Adherence to EDA standards and improvement of implementations Development of standardized metrics and measurement methods (WTW, EOW) Equipment data visualization and applications Predictive Preventive Maintenance (PPM), and Enhanced Equipment Quality Assurance (EEQA) to implement NGF capabilities Proposals for innovative solutions to fill the cost reduction gap 30 November

34 NGF/450mm Unified Messages The ISMI NGF program provides a complementary forward-compatible approach of 300mm NGF to 450mm to address the needs of our various member company constituencies and minimize the R&D expenditure by the industry Complementary converging paths are key to efficient use of industry resources ISMI continues to proceed consistent with the principle that NGF is a productivity continuum to 450mm 30 November

35 For more Information This presentation material will be made available for download at the SEMATECH public website: Meetings and News Past Meeting Proceedings ISMI Industry Briefings To initiate individual discussions with the ISMI Team, please contact: Olaf Rothe, NGF Program Manager Brad Van Eck, NGFR Project Manager 30 November

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