ECE414/514 Electronics Packaging Spring 2012 Lecture 2. Lecture Objectives

Transcription

1 ECE414/514 Electronics Packaging Lecture 2 James E. Morris Dept of Electrical & Computer Engineering Portland State University Lecture Objectives Introduce first-level interconnect technologies: wire-bond, TAB & flip-chip Introduce standard SMT & PTH packages (surface mount technology & pin through hole) Introduce MCM, COB, DCA, CSP, WLP, etc (multi-chip modules, chip on board, direct chip attach, chip-scale package, wafer-level packaging) Introduce basic packaging acronyms 2 1

2 Packaging Technologies Single-chip packages (SCPs) Multi-chip modules (MCMs) Encapsulation Wire Bond TAB (tape automated bonding) Flip-Chip New developments (SiP, PoP, etc) 3 Single-Chip Packages: 1st level interconnects: wire-bond, TAB, FC 2nd level interconnects: PTH & SMT MCMs (multi-chip modules) DCA (direct chip attach) CSP (chip scale packages) 4 2

3 Dual-in-line (DIL) plastic package (DIP) 4/2/2012 ECE414/514 Microsystem Integration & Packaging 5 First-level interconnect Wirebond TAB Flip-chip (Tape-automated bonding) 6 3

4 7 4/2/2012 ECE414/514 Microsystem Integration & Packaging 8 4

5 9 4/2/2012 ECE414/514 Microsystem Integration & Packaging Second-level package attach SMT & PTH 4/2/2012 ECE414/514 Microsystem Integration & Packaging 10 5

6 Substrate Vias PCB (printed circuit board) or PWB (printed wiring board) Multi-layer laminate Drilled, electroplated Cu Copper paste (ALIVH), silver loaded (ECA) epoxies, etc 11 Das et al, ECTC 2009, BaTiO 3 NPs 4/2/2012 ECE414/514 Microsystem Integration 12 & Packaging 6

7 4/2/2012 ECE414/514 Microsystem Integration & Packaging 13 PTH ECE414/514 Microsystem Integration & Packaging PGA SMT: J-lead Gull-wing Leadless COB/DCA flip-chip TAB 4/2/

8 BGA packages 15 Basic MCM/Microsystem concept 4/2/2012 ECE414/514 Microsystem Integration & Packaging 16 8

9 Cu/PI thin-film MCM-D 4/2/2012 ECE414/514 Microsystem Integration & Packaging 17 Flip-chip (C4) BGA (C5) MCM-C 18 9

10 19 Standard package MCMs (MCM-C or MCM-L) 20 10

11 21 MCM-L: Laminate (PWB) MCM-C: Ceramic MCM-D: (Deposited) Thin Film 22 11

12 Encapsulation: Glob-top 23 COB/DCA encapsulation Syringe dispense 24 12

13 Squeegee print 25 Encapsulation: Cavity-fill 26 13

14 Encapsulation: Transfer molding 27 Encapsulation: Underfill 28 14

15 Underfill (flip-chip) 29 4/2/2012 ECE414/514 Microsystem Integration & Packaging Spring

16 ECE414/514 Microsystem Integration & Packaging Spring 2012 CSP 4/2/

17 4/2/ ECE414/514 Microsystem Integration & Packaging 34 17

18 35 Wire Bond 18

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20 39 ECE414/514 Microsystem Integration & Packaging 4/2/

21 ECE414/514 Microsystem Integration & Packaging 4/2/

22 43 ECE414/514 Microsystem Integration & Packaging 4/2/

23 TAB (tape automated bonding) 4/2/2012 TAB tape chip carrier 46 ECE414/514 Microsystem Integration & Packaging 23

24 ECE414/514 Microsystem Integration & Packaging Inner lead bonding (to chip) 4/2/ ECE414/514 Microsystem Integration & Packaging Inner lead bonding 4/2/

25 Outer lead excision, bending, attach to board 4/2/2012 ECE414/514 Microsystem Integration & Packaging 49 Outer lead bonding (thermode) 4/2/2012 ECE414/514 Microsystem Integration & Packaging 50 25

26 51 TAB variations 52 26

27 53 ECE414/514 Microsystem Integration & Packaging 4/2/

28 TAB variations 55 ECE414/514 Microsystem Integration & Packaging 4/2/

29 ECE414/514 Microsystem Integration & Packaging 4/2/

30 ECE414/514 Microsystem Integration & Packaging Flip-Chip 4/2/ Solder bumps Self-alignment 60 30

31 ECE414/514 Microsystem Integration & Packaging 4/2/ Solder bumps As printed Re-flowed ECE414/514 Microsystem Integration & Packaging 4/2/

32 4/2/2012 ECE414/514 Microsystem Integration & Packaging Spring ECE414/514 Microsystem Integration & Packaging 4/2/

33 C4 = flip chip 65 4/2/2012 ECE414/514 Microsystem Integration & Packaging Spring

34 New developments WLP & Redistribution 68 34

35 4/2/2012 ECE414/514 Microsystem Integration & Packaging

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37 73 3D TSVs 74 37

38 Lecture Summary Standard packages Encapsulation First level interconnect (chip to package): Wire-bond, TAB, flip-chip (C4) Second-level interconnect (package to board): PTH, SMT, PGA, BGA (C4/C5), etc MCMs, CSPs, WLP, etc 75 Homework #1 Dally, Lall & Suhling: Problems: /2/2012 ECE414/514 Microsystem Integration & Packaging 76 38