Future Management Policies

Transcription

1 Future Management Policies Shoichi Tosaka President and Chief Executive Officer May 11, 2016

2 Our Vision To be an excellent company that enjoys the trust and highest regard from our customers. Smart Product High Quality Low Energy Consumption Down Sizing Abolition of Prohibited Substances Smart Product Safety First Follow Rules Efficient Energy Usage 100% Yield Reuse Recycle Minimization of Waste Smart Process System 2

3 Foreseeable Near Future of Electronics Markets IoT market predicted to grow explosively. Devices connected to the internet 10T Sensors 50T 20T Increase in the demand for ultra-small high- Q components 12.5B 50B Estimated by our company based on Cisco IBSG s prediction 20B 100B Estimated by our company based on TSENSORS SUMMIT s prediction year year Computerization and energy are the key to the automotive electronics market. Infotainment: 1.7 times Body: 1.6 times Automotive market: 18 trillion (CY2012) 30 trillion (CY2020) Estimated by our company based on JEITA s prediction (2013) Safety: 1.9 times Power-train: 1.7 times Rapid growth of electric and fuel-cell vehicles. Increasing demand for large-size, high voltage resistant, and highly-reliable components. 3

4 Future Direction of Our Business Profit Change the business model to establish a more profitable business structure. Large Capture the growing market by providing super high-end products and highly-reliable products. Capacitors, Inductors, Communication devices Outgrow simple circuit/mounting business. Create new business by providing solutions. Material Component Provide solutions and after-sales services Modularization Software Small Mounting Assembly 4

5 Future Direction of Capacitor Business 5

6 Future Direction of Inductor Business Strengthen the line-up with more sophisticated material and process technologies. Metallic material Communication (IoT ICT) Small size, large current Multilayer type EIA0201/0402 size Small, wire-wound type Automobiles/ industrial equipment Large size, large current Wire-wound type High reliability products Ferrite material, etc Ultra-small, ultra-thin, highfrequency components Thin-film hybrid type size Multilayer type Thin-film hybrid type Common mode choke coils High reliability Marketing new large wire-wound coil products Wire-wound type Common mode choke coils 6

7 Future Direction of Communication Device Business ~CY2014 CY2015 CY2016~ 4G LTE Carrier aggregation and multi-band LTE-Advanced CA 化 多ハ ント 化 (CA/MIMO) Band expansion (~5GHz LAA) 5 High frequency and narrow adjacent bandwidth ~1GHz 2GHz 3GHz~ B17,13,20,5,18,8 B11,21,3,9,39,25,2 B4,34,1,40,41,38,7,42,43 G TC-SAW+TC-SAW Dup. FBAR+TC-SAW Dup. Dielectric multilayer filters Points of differenciation Optimally commercialize various technologies to support all bands. Supply ultra-small high-frequency capacitors and inductors as a set. Commercialize the World s smallest FBAR/SAW hybrid duplexers. Accelerate the marketing of automotive products with high reliability, for millimeter wave band, etc. 7

8 New Business Development by Providing Solutions Cylinder type lithium ion capacitors Laminate-type lithium ion capacitors LITHOSION Optics technology Multilayer technology Integrating technology System solution proposals combining core technologies Surface treating technology Wireless technology Power source technology Multi functional fine surface coating Screen, metal mask etc. Energy PV monitoring Actuator (Multilayer piezoelectric materials) High-resolution earphone Sensor Sensor + MRLD Optical displacement sensor Power-assisted regeneration haptic technology Piezoelectric pressure wave sensor 8

9 Continuing Investment in Facilities Respond to growing markets. Continue investment to enhance the performance of our super high-end and high reliability products. Accelerate the innovation in production method. Make investment in IoT for production process and analyze big data. Further enhance our manufacturing strength. 9

10 Dividend Policy Aim for 30% total return ratio FYE March yen annual dividend(interim: 5 yen, year-end: 10 yen) FYE March 2017 (planned) 20 yen annual dividend(interim: 10 yen, year-end: 10 yen) 10

11 This document contains information about the plans, business results, and strategies of TAIYO YUDEN CO., LTD. and the TAIYO YUDEN Group. These forward-looking statements other than historical facts represent judgments made by the Company based on information available at present and are inherently subject to a variety of uncertainties. TAIYO YUDEN cannot provide any guarantee as to the attainment of certain figures in the future. The Company s actual activities and business results could differ significantly due to changes including, but not limited to, changes in the electronics market in which the Company s business activities are centered. Readers should not overly rely on the information contained in this document. 11

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