Ready For The Future 2016

Transcription

1 Ready For The Future 2016

2 Your Full Service, Time Sensitive, Printed Circuit Board Solution Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology and Innovation. We offer full service solutions for Rigid PCB s, Flex PCB s and Rigid-Flex PCB s in both Ultra Quick Turn options along with Standard Production lead times. You will find that Streamline holds the necessary certifications to insure the highest standards of workmanship while supporting your companies specifications. Mil / Aerospace DataCom TeleCom Medical Industrial 2

3 Streamline Circuit Corp s Facility Manufacturing all levels of technology Time sensitive prototyping through production The facility was established in 1982 New management team installed September ,000 sq. ft. PCB manufacturing facility Complete manufacturing process under one roof 1 mile from the San Jose Airport Delivery convenience for out of state customers Located in Silicon Valley Located in Silicon Valley Short car ride away for pick up & deliveries Financially secure in current market conditions Low cost infrastructure 3

4 The Team & Their Experience Chuck Dimick- CEO Founder Over 35 years of experience in PCB manufacturing. Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991) Greg Halvorson- President Founder Over 33 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic Circuits Inc. Tom Doslak-Vice President of Sales & Marketing Founder Over 25 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager for Dynamic Details Inc. Ed Pitney- Operations Manager Over with 34 years of PCB manufacturing experience. Ed spent his early career with NTI Inc. as a Director of Manufacturing Operations later purchased by DDI Global Inc. Steve Morris Director of Engineering Over 30 years of PWB Design & Engineering experiencing. Former VP of Advanced Technology for Multek (a division of Flextronics) and a key member of the HP PWB Corporate commodity team. JR Ramirez- Production Manager Founder Over 35 years of experience in the industry. Former Production Manager for both Dynamic Details Inc. and Dynamic Circuits Inc. Lorraine Hook - Director of Quality Over 44 years of industry experience. Former Director of Quality for many successful companies including DCI and DDI. She has held dual positions as Corp. Quality Systems Manager. 4

5 Customer Service Support Customer Service (24 hours - 7 days a week) Sales, Engineering, Manufacturing and Quality Dedicated customer service readily available-our support group s located onsite in the facility Inside Sales Customer Support Quick response to all requests such as: Job status Delivery pull-in Quantity Increases Engineering design modification 5

6 Proactive Engineering Services Manufacturing Capabilities Prototype though volume All time sensitive builds Cam Valor Stations 4 Laser Direct Imaging units DFM (Design for Manufacturability) DFM Software (reviews in 10 minutes) Net list compare to customer data Custom Verification programs Looking for customer design error In plan Smart data Collection System Controlled Impedance Verification Stack up assistance Copper distribution Material verification 6

7 Pre-Production Engineering Services In Plan planning software Customer Specific Rules Based Automation Valor front end CAM (Unlimited Seats) Industry Standard for front end engineering Stack up consultations, Service Offered No Charge $ Insight Frontline DFM s, Service Offered No Charge $ Tech Seminars /Webinars Material Science, Latest in Laminates and Pre Preg s R&D, Building the Toughest to Gain the Knowledge When you need it, we will be ready! 7

8 Automated Optical Inspection In house Mil & deliverable Lab Quality Reassurance Net list compare prior to MFG Matching Net list to Gerber data Front End DRC (design rule check) Searching for customer design mistakes AOI Automated Optical Inspection Verifying inner & outer layers X-Ray Verification After Lam (Inspecta), After Drilling Cross Section Verification Hole Integrity True-Chem Software Controlled Impedance Testing TDR test of panel coupons 100% Net List Test On All Product Eliminator Tester & flying probe Coordinate Measurement Machine First articles, 100% measurement verification 8

9 On Time Delivery Reassurance 100% In-house manufacturing from start to finish Control delivery & customer flexibility In-process quality verification system No out sourcing delivery delays 8 flying Probe Testers Employee Training program Performance evaluation every 6 months In-house Chemical Laboratory Cross Sections Chemical analysis Mil spec verification Vacuum Lamination press 9

10 Continuous Improvement Programs Management meetings Working daily on: Research and Development Pre-Engineering Programs Improvement Process Program Department Performance Reviews Preventative maintenance program Employee Training Program Planned Capital expense program 7 Laser drills 10

11 A Full PCB Solution Multilayer Rigid / Rigid- Flex / Flex 1 to 70 Layers Plus 28:1 High Aspect Ratio 3.23 Mils Hole to Copper Buried / Blind Vias 9 Sequential Laminations 13+ Stacked Vias 1 Mil Trace & Space Cavity Constructions 6 oz. + Copper Thickness Copper Filled Micro Vias +/- 5% Controlled Impedance Tol. AS9100 Rev. C / ISO 9001 / ISO Mil-Spec / ITAR RoHS & Halogen Free Materials IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency 3 Mil Mechanical Drills 24 x 30 Oversize Panel 2 Mil Laser Drill Vias Up to 345 Mils Board Thickness Via Under Pad (Conductive & Non- Conductive Filled) 65+ Materials (Hybrid Constructions) 11

12 PCB Technology Roadmap 1. Line and Space Line Width Line Space Tolerance Standard Advanced Emerging Future / / / / Drilled Via Size Drill Size Pad Diam Aspect Ratio : : : :1 3. Misc. Attributes Layer Count Thickness Board Size Up to 36 Up to.187 <16 X22 36 to 48 Up to.300 <19 X22 48 to 60 Up to.350 <22X28 > Laminate Materials Rigid FR4 Polyimide PTFE HC (Rogers) Interposer Substates UTR s Next Gen HSD Advanced Interposers Nano Foils Alternative Resin Systems *UTR = Ultra Thin Rigid Flex Flex Rigid Flex FR4 Stiffeners EMI Shield Conductive Bond Ply Thin Flex UL Approved High Speed Flex High Reliability Flex Data Security UL Multilayers 12

13 Technology Roadmap Cont. Standard Advanced Emerging Future 5. Micro Via Size Via Size Pad Dam Aspect Ratio : : : :1 6. Surface Finishes HASL Entek Imm Silver ENIG ENEPIG LF HASL Eless Au Sel Solder Imm tin Solder Bump TBD Registration 7. LDI Soldermask +/-.003 Min opening.006 +/ / Tangency 8. Conductive and Min hole Non-Conductive Via Fill.012 Aspect Ratio 8: : :1 < :1 13

14 Nadcap ISO 9001:2000 IPC 6012,13,15,16,18 Class 3 ITAR AS9100 Rev C Mil-Spec Mil-Spec in process

15 Q-Pulse Total Quality Management Quality Assurance Systems Q-Pulse Quality System NCMR s and Corrective Actions Audits Training Equipment Calibrations 15

16 Streamline s Capital Expenditures Laser Direct Imaging Cuposit & Electroless Line Use advanced equipment technologies to manufacture today's printed circuit board requirements The future in PCB manufacturing is about technology and automation Hire and Train equipment operators DES Inner Layer Stripline High percentage engineering personnel and staff 16

17 V-Stacks: Patented MicroVia technology that will change everything A combination of Streamline's engineering talent created V-Stack, a new MicroVia manufacturing process that will change everything we know about Via Stacking. This technology allows a manufacturer to create MicroVia structures greater than 4 layers deep with only 1 lamination cycle. V-Stack technology also yields finer features and higher layer to layer reliability. Due to the 30% - 60% reduction in processing, this MicroVia technology is a cost effective route for advanced technology. 17

18 6 Layer Rigid Flex Rigid-Flex Examples 8 Layer Rigid Flex Micro via 10 Layer Micro via BGA 6 Layer Rigid Flex with Cavity

19 IPC Manufacturing Class & Industries 4% 33% 63% Class 3 Class 2 Other 17% 15% 15% 25% 28% Military Aerospace Medical Communication Industrial 19

20 Streamline Circuits Corp Martin Ave, Santa Clara, CA USA (877)