610F AMENDMENT 1_FINAL INDUSTRY REVIEW_APRIL 2015

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1 Delete the criteria in Table 6-8 as follows: <90 O wrap Acceptable Defect 90 O wrap Acceptable Change the Acceptable - Class 2,3 criteria in Section as follows: Acceptable - Class 2,3 Wire wrap equal to or greater than 90º or wire contacts both sides of the terminal. Acceptable - Class 1 Defect - Class 2,3 Wire wrap less than 90º or wire does not contact both sides of the terminal. Wire does not pass through the eye of the terminal. Change the Acceptable - Class 1,2,3 criteria in Section as follows: Acceptable - Class 1,2,3 Continuous adhesion fillet to the mounting surface and component body. Adhesive is cured. No gap/separation/crack between staking and attachment surfaces. Staking material does not contact component body seals. On a horizontally mounted component the staking material: Adheres to component for at least 50% of its length (L). The buildup of staking material does not exceed 50% of the component diameter. Maximum fillet height allows for the top of the component to be visible for the entire length of the component body Minimum fillet height of 25% component diameter (D) on 1 side and approximately centered on component body On a vertically mounted component: The staking material bead(s) are continuous for least 25% of the component length (L) (height) with slight flow of staking material under the component body, see Figure The staking material adheres to the component: o For at least 3 beads spaced approximately evenly around the circumference OR o For a minimum of at least 25% 50% of the component circumference. Glass bodied components are sleeved, when required, prior to staking material attachment. Adhesives, e.g., staking, bonding, do not contact an unsleeved area of a sleeved glass body component. Sleeved component has staking material applied to both sides from 50% to 100% of the component length and minimum 25% of component height. Multiple vertically mounted components: Staking material adheres to each component for at least 50% of its length (L), and the adhesion is continuous between components. The staking material adheres to each component for a minimum 25% of its circumference, see Figure

2 Sleeved axial component (except glass body) have staking material in contact with both end faces of the component. Acceptable - Class 3 On a horizontally mounted component (sleeved or unsleeved) the staking material is applied to both sides of the component. Change the Not Established - Class 1, Process Indicator - Class 2, Defect - Class 3 criteria in Section as follows: Not Established - Class 1 Process Indicator - Class 2 Defect Class 3 For horizontally mounted components (sleeved or unsleeved), staking material in excess of 50% diameter provided the top of the component is visible for the entire length of the component body due to excess staking material. For sleeved glass bodied component the staking material is not applied to both sides of the component a minimum of 50% the component length. Change the Not Established - Class 1, Defect - Class 2, 3 criteria in Section as follows: Not Established Class 1 Defect Class 2,3 Sleeved axial leaded component (except glass bodied components): Does not have staking material in contact with both end faces of the component Staking material contacts component body seals On vertically mounted component, Aadhesive is less than 25% of the component diameter (height). Adhesive is greater than 50% of the component diameterlength (height). Top of the component body is not visible for the entire length due to staking material coverage. Vertically mounted component: There are less than 3 beads or staking material adhering to the component OR One bead of adhesive adhering to less than 25% of component circumference. Sleeved glass bodied components do not have staking material for a minimum of 25% of component height. Change the criteria in section as follows: Staking material in excess of 50% diameter of horizontally mounted component and the top of the component is not visible for the entire length of the component body. There is not a continuous adhesion fillet to the mounting surface and component body. Uninsulated metallic case components bonded over conductive patterns.

3 Staking material on areas to be soldered preventing compliance to Tables 7-4, 7-5 or 7-7. Rigid adhesives, e.g., staking, bonding, contact an unsleeved area of a sleeved glass body component, Figure Staking material is not cured. Unsleeved hhorizontally mounted component the staking material adheres to: Component and mounting surface less than 50% of the component length (L). Less than 25% of the component s diameter (D), on 1 side. Unsleeved vertically mounted component: There are less than 3 beads of staking material adhering to the component less than 25R% of it height. Less than 25% of component height. Multiple vertically mounted components: The staking material adheres to each component for less than 50% of its length (L). The staking material adheres for less than 25% of the each component circumference. The adhesion is not continuous between components. Add Not Established - Class 1,2 Defect - Class 3 criteria in Section as follows: Not Established - Class 1, 2 Defect - Class 3 On a horizontally mounted component (sleeved or unsleeved) the staking material is not applied to both sides of the component. Delete the Acceptable - Class 1 Process Indicator - Class 2,3 criteria in Section Acceptable - Class 1 Process Indicator - Class 2,3 The component or weld bead clearance Figure 7-70-C is greater than the maximum given in Table 7-2. The component or weld bead clearance (C) is less than the minimum given in Table 7-2. Add criteria to Section as follows: The component or weld bead clearance Figure 7-70-C is greater than the maximum given in Table 7-2. The component or weld bead clearance (C) is less than the minimum given in Table 7-2. Replace Table 7-4 row A with the following: Criteria Class 1 Class 2 Class 3 Vertical solder fill for components with less than 14 leads not connected to an internal thermal 75% plane. Notes 2 and 3 and Figure 6-4. A Not specified Vertical solder fill for components with less than 14 leads and which are connected to an internal 50% thermal plane 2,3,4 (see ) 75%

4 Vertical solder fill for components with 14 leads or more. Notes 2 and 3 and Figure % or 1.2 mm [0.05 in], whichever is less Change Table 7-4 Note 2 as follows: Note 2. The unfilled height includes both source and destination side depressions. Delete Acceptable - Class criteria in Section as follows: Acceptable - Class 2 Minimum vertical fill of 50% or 1.2 mm [0.05in] for components with 14 or more leads (not shown). Component lead is discernible in the solder source side of the solder connection. Add criteria in Section as follows: Acceptable - Class 2 Minimum vertical fill of 50% or 1.2 mm [0.05 in], whichever is less, for components with 14 or more leads. Component lead is discernible in the solder source side of the solder connection. Acceptable Class 2 Defect Class 3 Vertical fill of hole is 50% or 1.2 mm [0.05 in], whichever is more, for components with less than 14 leads and having an internal thermal plane providing the solder fillet on Side B of Figure 7-86 has wetted of the PTH barrel wall and of the lead. Surrounding PTHs meet requirements of Table 7-4. Revise Defect - Class 2 criteria in Section as follows: Defect - Class 2 Vertical fill of hole is less than 75% for component with less than 14 leads and not having an internal thermal plane. Vertical fill of hole is less than 50% or 1.2 mm [0.05 in], whichever is more, for components with less than 14 leads and having an internal thermal plane and the solder fillet on Side B of Figure 7-86 has wetted of the PTH barrel wall and of the lead. Vertical fill of hole is less than 50% or 1.19 mm [0.047 in], whichever is less, for component with 14 leads or more. Revise in Section as follows: Adhesive, when used, is not cured. Jumper wires are not staked to or allowed to touch any moving parts.

5 Change Minimum end Joint Width in Table 8-10 as follows: Minimum end Joint Width C 50% (W) 75% (W) Add the following to Section : Voiding criteria for components with noncollapsing balls is not established. (See 1.5.1) Change the criteria in Table 8-14 as follows: Voids Voiding criteria are not established. Change the Acceptable - Class 1,2,3 criteria in as follows: Acceptable - Class 1,2,3 The distance between the haloing penetration and the nearest conductive feature is not less than the minimum lateral conductor spacing, or 0.1 mm [0.004 in] whichever is less. Change the criteria in as follows: The distance of the haloing penetration and the nearest conductive feature is less than the minimum lateral conductor spacing, or less than 0.1 mm [0.004 in].

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