Subject: Change of Encapsulation Epoxy from Hysol FP4402 epoxy to Hysol FP4323

Transcription

1 MACOM Technology Solutions Inc. 100 Chelmsford Street Lowell, Massachusetts May 2018 Mouser Electronics 1000 N. Main St. Mansfield,Texas ATTN: Quality/Purchasing Manager Subject: Change of Encapsulation Epoxy from Hysol FP4402 epoxy to Hysol FP4323 PCN #: PCN Dear Valued Customer: The goal of MACOM Technology Solutions is to continually deliver high quality products and services that meet our customers needs. We strive to offer products that are industry leading in terms of performance, delivery, safety and value. In accordance with these goals, this communication is to inform you that MACOM is making a change a to the encapsulation epoxy on the products listed on the following page. The manufacturer (Hysol) has discontinued FP4402 epoxy and replaced it with a similar epoxy, FP4323. The details of the change and the qualification report are attached. You are receiving this notice because you have purchased the above products in the past two years. Details of the change are on the following pages. Please contact your local sales representative if you have any questions or require additional information. Sincerely, Tim Daly Product Manager MACOM Technology Solutions, Inc. Tel: +1 (978) timothy.daly@macom.com

2 PCN Number: PCN PCN Date: May 23, 2018 Title: Change of Encapsulation Epoxy from Hysol FP4402 epoxy to Hysol FP4323 Estimated Sample May 2018 Date of change: June 2018 Availability/ Proposed last Ship Date: Qualification Completion: Change Classification: Major D Minor D Change Type: Assembly Site D Design D Electrical Specification D Site D Assembly Process D Mechanical Specification D Process D Assembly Materials D Packing/Shipping/Labeling D PCN Details Description of Change: Converting epoxy encapsulation epoxy from Hysol FP4402 to Hysol FP4323. Reason for Change: The Hysol FP4402 is no longer manufactured. Converting to a similar epoxy already in use on other MACOM products. Products Affected: A2X2228 MA46470A 1088 MA46H MA4P EA MA MA47416 COB MA4PH SF EA MA MA4E1137 MA4ST MA40036 MA MA4E MA4ST MA MA MA4E1311 MA4ST MA44781 MA46H MA4E MA4ST MA MA46H MA4E MA4ST MA MA46H MA4E MA4ST MA MA46H MA4E646 MA8334 X043T MA MA46H MA4E687 MA8334 X044T MA MA46H MA4L MADPSD0080 MA MA46H MA4L MASW MA MA46H MA4L MASW MA45471 MA46H MA4P MAVR F0 Anticipated impact on Fit, Form, Function: There will be no impact on fit, form, function, or reliability by this change. Changes to product identification resulting from this PCN: None. Material Declaration updated due to this change: Yes D No D

3 Quality and Reliability Report PNMN (FP4323) Epoxy Encapsulant QTR-0462 M/A-COM Technology Solutions Inc. 100 Chelmsford Street Lowell, MA Tel: (978) Fax: (978)

4 Table of Contents 1 Introduction 2 2 Scope 2 3 Reference Documents 3 4 Product Description and Information Assembly and Package Information 3 5 Product Manufacturing Qualification Requirements Encapsulant Qualification s 4 6 Analysis of Results X Pre-Conditioning UHAST Temperature Cycling Electrical External Visual 7 1 Introduction This document describes the test and environmental testing results that the PNMN (FP4323) one part single cure epoxy encapsulant was subjected to determine its reliability for mechanical attachment, low stress encapsulating capability, and process manufacturability. The PNMN encapsulant is used as the protective coating needed to ensure wirebonds and die are protected from contamination and contact damage due to handling during manufacturing and board attachment. Qualification tests used in the process include temperature cycling and unbiased HAST (3X reflow pre-conditioning was performed on all devices that are normally surface mounted). Twelve (12) package variants were identified for use as qualification vehicles for this process. Lot sizes varied depending on device types but a minimum of 50 devices per lot were used to create two Sub Groups of twelve (12) device types each. All devices variants were electrically tested prior to being segregated into Sub Group sample lots. Electrical yields for pre-qualification testing averaged 99%. 2 Scope The qualification vehicles were chosen specifically to encompass all product/die variants that will be using the PNMN (FP4323) epoxy encapsulant for die/wire encapsulation. This qualification applies to devices manufactured both at the MACOM Lowell facility and Hana Ayutthaya (subcontractor) manufacturing facility with similar packaging and assembly processes. M/A-COM Technology Solutions, Inc. 2

5 3 Reference Documents 1. Assembly Documentation (Per P/N Attachment A) 2. PNMN Epoxy Encapsulant Qualification Plan, Rev JESD22 M113D Pre-Conditioning, Leadfree 4. JESD22-A104 Cond. C Temperature Cycle, -65C to +150C, 500 Cycles 5. JESD22-A118 Cond. A Unbiased HAST +130C/85%RH/96Hrs 6. Specification-(Per P/N Attachment A) 7. MIL-STD-883 M2009 External Visual 4 Package\Product Description and Information The packages used for this qualification are all gold plated metalized ceramic. The packages used are a combination of leaded, leadless, surface mount and non-surface mount. All package styles require the same application process for encapsulation (top surface application with pneumatic syringe) and cured as defined and required by MACOM process documentation. 4.1 Assembly and Package Information Details of the package construction are reported in the table and figures below. All devices were cured using a pre-assembly process of applying the encapsulant on a pre-heated (90C) heat stage and then a single curing in a 170C oven for 1 hour. Attachment A Part Number Description Leads Outline Die Wire M2X3851 Round Quad 4 E40 ODS228 Quad Beamlead MSL Level Surface Mount N/A 1 No MPN7620 ET47 Round 4 ET47 PIN.7 1 Yes M2X6628 Double sided 8 E83 Quad Beamlead N/A 1 No MPN7410 E25 Square 2 E25 2 ODS 213 PIN.7 1 No M2X6407 Square 3 E35 Beam Lead N/A 1 Yes MA4L Stripline 2 MA44781 Stripline 2 ODS 1088 E28 X E2NMS ODS 1132 PIN 1/4x3 1 Yes Varactor.7 1 No MSWSH Stripline 2 CM22 PIN.5x10 1 No M12X2022 Leadless N/A XB Quad Beamlead N/A 1 Yes MLP Leadless N/A E19 1 PIN 1/4x3 1 Yes M2X8305 Leadless N/A 0402 S Beamlead N/A 1 Yes M7X1065 Stripline 5 E50 1 Beamlead N/A 1 Yes 3 M/A-COM Technology Solutions, Inc.

6 5.0 Encapsulant Qualification Requirements Qualification testing has been performed to validate the stability and effectiveness of the epoxy encapsulant and the process application and curing. The tests were chosen to create stresses consistent with what the packages would see during PCB assembly process conditions or to induce rapid stress vectors to determine stability of the epoxy adhesion to the ceramic and metallization of the package. Failure criterion is based on visual criteria such as delamination of epoxy from the package, cracking of the epoxy, or electrical failures induced by internal stress on wires and die. 5.1 Qualification s Sub Group 1A (Surface Mount Devices) General TEST Description Method UNITS Status s Pre-Conditioning Mimic thermal stress of double sided board assembly and one rework process JESD22 Method 113D 3X Leadfree profile Temp Shock Subject the device to rapid temperature changes JESD22-A104 Cond. C Post Verification Electrical Visual Inspection Determine the effect of endurance testing on the wire and die attachment Inspect for delamination of the plating Per Applicable Specification MIL-STD883 M /1 Sub Group 1B (Leaded Non Surface Mount Devices) General TEST Description Method UNITS Status s Temp Shock Subject the device to rapid temperature changes JESD22-A104 Cond. C Post Verification Electrical Visual Inspection Determine the effect of endurance testing on the wire and die attachment Inspect for delamination of the plating Per Applicable Specification MIL-STD883 M2009 M/A-COM Technology Solutions, Inc. 4

7 Sub Group 2A (Surface Mount Devices) General TEST Description Method UNITS Status s Pre-Conditioning UHAST Mimic thermal stress of double sided board assembly and one rework process Subject the device to high temperature and humidity JESD22 Method 113D 3X Leadfree profile JESD22-A118 Cond. A /0 /0 Post Verification Electrical Visual Inspection Determine the effect of endurance testing on the wire and die attachment Inspect for delamination of the plating Per Applicable Specification MIL-STD883 M /1 /0 Sub Group 2B (Leaded Non Surface Mount Devices) General TEST Description Method UNITS Status s UHAST Subject the device to high temperature and humidity JESD22-A118 Cond. A Post Verification Electrical Visual Inspection Determine the effect of endurance testing on the wire and die attachment Inspect for delamination of the plating Per Applicable Specification MIL-STD883 M M/A-COM Technology Solutions, Inc.

8 6.0 Analysis of Results 6.1 Pre-Conditioning (Surface mount devices only) Description This stress is used to emulate the worst case assembly process used by the end user during the board stuffing operation. A 3X leadfree reflow profile is used to mimic the initial attachment of the device to the board, a second reflow to emulate a double sided board assembly, and a third reflow to subject the device to a potential rework requirement. Upon completion of this test a visual examination is performed to determine if any visual defects can be seen that would indicate poor adhesion of the plating such as delamination or some form of de-wetting or cracking of the solder. Results: Post pre-conditioning visual inspection of the devices showed no visual indications of plating or solder failure. Eutectic solder coating remained smooth and no signs of delamination or cracking at any of the component interfaces. 6.2 UHAST Description The Unbiased HAST process is performed for the purpose of evaluating the reliability of nonhermetic packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under non-condensing conditions to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. Bias is not applied in this test to ensure the failure mechanisms potentially overshadowed by bias can be uncovered (e.g. galvanic corrosion). This test is used to identify failure mechanisms internal to the package and is destructive. Results (Surface Mount Devices): Post UHAST visual inspection of the devices showed no visual indications of cracking or delamination of the encapsulant from the ceramic base. One (1) device failed and was found to be a catastrophic short. The short circuit failure mode is a die related failure and not attributed to the packaging/encapsulation process. Results (Leaded Non Surface Mount Devices): Post UHAST visual inspection of the devices showed no visual indications of cracking or delamination of the encapsulant from the ceramic base. Electrical testing showed no induced failure from the moisture or stress of the environmental conditions they were subjected to. 6.3 Temperature Cycle Description Unbiased devices are exposed to repeated extreme temperature changes. This accelerated stress test produces extreme stresses at the interfaces of material that have either different CTE s (coefficient of thermal expansion) or have been connected together using interface materials such as epoxies, solders, weld formations, or mechanical structures. The extreme temperature range M/A-COM Technology Solutions, Inc. 6

9 and repeated transitions ensures that maximum stresses are created. The test conditions applied for this testing was -65C to +150C and the parts were subjected to 500 cycles. Results (Surface Mount Devices): Post Temperature Cycling visual inspection of the devices showed no visual indications of cracking or delamination of the encapsulant from the ceramic base. One (1) device failed and was found to be a catastrophic short. The short circuit failure mode is a die related failure and not attributed to the packaging/encapsulation process. Results (Non Surface Mount Device): No visual failures were observed at the end of this test (cracking or delamination of the encapsulant from the ceramic base). Electrical testing showed no induced failure from the stress of the environmental conditions they were subjected to. 6.4 Electrical Description Subject the screened devices to parametric diode testing to determine if the devices continue to function as required for package type and diode type after being subjected to the environmental stresses of UHAST and Temperature Cycling. Results Refer to results listed under specific endurance tests and package types listed above. 6.5 External Visual Description Perform an external visual examination of the condition of the epoxy encapsulant to determine if the environmental stresses have damaged the encapsulant in any way. Results No visual indications of cracking or delamination of the encapsulant was found. 7 M/A-COM Technology Solutions, Inc.

10 Revision History Rev - March 15, 2018 Andrew Smehurst Rev A May 21, 2018 Bradley Mikesell Completed qualification of additional devices with same epoxy Copyright 2018, M/A-COM Technology Solutions, Inc. All rights reserved. No part of this document may be reproduced in any form or means, without express permission from M/A-COM Technology Solutions. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes in its products, product flows, or information contained herein without notice. M/A-COM Technology Solutions assumes no responsibility for use of any products or circuitry described within. No license for use of intellectual property (patents, copyrights, or other rights) owned by M/A-COM Technology Solutions or other parties is granted or implied. Visit for additional data sheets and product information. M/A-COM Technology Solutions, Inc. 8