IPC-TM-650 TEST METHODS MANUAL

Transcription

1 3000 Lakeside Drive, Suite 309S Bannockburn, IL TEST METHODS MNUL Number Conductive nodic Filament (CF) Resistance Test: X-Y xis Originating Task Group Electrochemical Migration Task Group (5-32e) 1 Scope This test method provides a means to assess the propensity for conductive anodic filament (CF) growth, a form of electrochemical migration, and similar conductive filament formation (CFF) laminate material failure modes within a printed wiring board (PWB). Conductive anodic filaments may be composed of conductive salts, rather than cationic metal ions, however inadequate dielectric for the applied voltage, component failures, and part use exceeding the maximum operating temperature (MOT) of the laminate can contribute to product failures as well. This test method can be used to assess PWB laminate materials, PWB design and application parameters, PWB manufacturing process changes and press-fit connector applications. 2 pplicable Documents 2.1 IPC IPC-9253 CF Test Board Design (vailable in the Drafts section of the 5-32e Task Group Home Page) IPC-9254 CF Test Board Design (vailable in the Drafts section of the 5-32e Task Group Home Page) IPC-9255 CF Test Board Design (vailable in Free Downloads in IPC Home Page) IPC-9256 CF Test Board Design (vailable in Free Downloads in IPC Home Page) IPC-9691 CF Test Method User Guide for the, Method IPC J-STD-001 Requirements for Soldered Electrical and Electronic ssemblies IPC J-STD-004 Requirements for Soldering Fluxes IPC J-STD-006 Requirements for Electronic Grade Solder lloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering pplications Test Methods Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract Thermal Stress, Convection Reflow ssembly Simulation 2.2 merican Society for Testing and Materials (STM) STM D-257 Standard Test Methods for DC Resistance or Conductance of Insulating Materials 3 Test Specimens The IPC-9254 CF test board design is the older coupon and has been superseded by the IPC The new smaller CF test coupons are IPC-9255 and IPC-9256 and are used for evaluating PTH-PTH spacings only. These smaller CF test coupons allow users to put a CF test coupon at the perimeter of their panels for testing. ll IPC CF test coupon design Gerber files are down-loadable and are available on the IPC committee and free download web sites. 3.1 CF Test Board Designs The IPC-9253 and IPC have 10 layers and dimensions are approximately 125x175 mm [nominally 5x7 in]. Test board designs for evaluating CF resistance shall have varying drilled hole wall to drilled hole wall distances for plated holes. These distances can range from as low as 0.15 mm [ in] separation for alternate laminate materials expected to have very high CF resistance and minimal copper wicking out from the platedthrough hole (PTH), to as high as 0.89 mm [ in] separation for evaluating press-fit connector applications. The drilled hole size, rather than the finished hole size, is specified in the chart on the bare board fabrication drawing to ensure consistent spacing. Internal layer thieving may be added to plane layers around the perimeter. Test boards should be manufactured so that the machine/grain direction of the woven fiber reinforcement is perpendicular to the rows of same-net daisy chain vias for 1-4 (machine/grain direction tends to fail first). Test board designs shall have sufficient minimum spacings on outer layers to ensure that surface insulation resistance failures do not occur. Layouts of the IPC and IPC-9254 test board structures (CF Test Boards) are shown in Figure 1. IPC-9253 and IPC-9254 Test Structures 1 through 4 The four structures 1-4 each have five rows of connected vias. Within each structure each row has 42 vias with alternating rows being tied to positive or negative electrodes. The via edge to via edge spacing is varied from one structure to the next by using a different drilled hole size on the same 1 mm Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement by IPC. Page 1 of 11

2 Conductive nodic Filament (CF) Resistance Test: X-Y xis C1 C2 B1 B2 B3 B C1 C2 B1 B2 B3 B4 C3 C4 C3 C4 D1 D2 D1 D2 rea of PTHs for Test Wire ttachment rea of PTHs for Test Wire ttachment a) IPC-9253 b) IPC-9254 IPC Figure 1 Layouts of Two Versions of the CF Test Boards [0.040 in] pitch between rows of daisy chain vias. The resulting via edge to via edge spacings are: 0.27 mm, 0.38 mm, 0.51 mm, 0.65 mm [ in, in, in, in]. Other than the use of different drilled hole sizes and a small change in pad sizes, the four structures are identical. The vias in these four test structures 1-4 are aligned with the glass fibers. Since 1-4 evaluate susceptibility to CF in just one direction, test coupons should be manufactured so that the machine direction of the woven fiber laminate reinforcement is perpendicular to the rows of same-net daisy chain vias (machine direction tends to fail first). For both and B test structures the inner and outer layer pads are the same, i.e., the same pad size is consistently used within a given test structure, although it does change from structure to structure. ll via to electrode connections are made on layer 2 and are repeated on layer 9 so that a single etch-out will not affect results. Traces from via to electrode are routed on internal layers rather than external layers to minimize potential for surface insulation resistance failure. Design details for each test structure 1-4 follows in Table 1. Note: Manhattan Distance is the shortest orthogonal distance along the X- and/or Y- axes lines between adjacent drilled hole features (corresponds to the orthogonal nature of the laminate material s woven glass fiber reinforcement (Figure 2). IPC-9253 and IPC-9254 Test Structures B1 through B4 The four B test structures have seven alternating rows of vias. Within each structure, alternating rows have either 27 or 26 vias with the alternating rows being tied to either positive or negative electrodes. The via edge to via edge spacing is varied from one structure to the next by using a different drilled hole size on the same 1.52 mm x 1.52 mm [ in x in] via grid. The 1.52 mm x 1.52 mm [ in x in] grid has an interstitial via therefore, tipping at a 45 angle results in a square 1.08 mm x 1.08 mm [ in x in] grid. Note: the sketches do not look square Page 2 of 11

3 Conductive nodic Filament (CF) Resistance Test: X-Y xis Table 1 Test Structures 1 through 4 Design Rules Outer layer pad size 0.86 mm [ in] 0.81 mm [ in] 0.75 mm [ in] 0.69 mm [ in] Inner layer pad size 0.86 mm [ in] 0.81 mm [ in] 0.75 mm [ in] 0.69 mm [ in] Drilled hole size 0.74 mm [ in] 0.63 mm [ in] 0.51 mm [ in] 0.37 mm [ in] Via edge to via edge (shortest distance) 0.27 mm [ in] 0.38 mm [ in] 0.51 mm [ in] 0.65 mm [ in] Via edge to via edge (Manhattan Distance) 0.27 mm [ in] 0.38 mm [ in] 0.51 mm [ in] 0.65 mm [ in] On IPC-9254 only, bias applied between: J1, J5 J2, J5 J3, J5 J4, J5 y x from structure to structure. ll via to electrode connections are made on layer 1 and are repeated on layer 10 so that a single etch-out will not affect results. conceptual representation of the B test structure of the coupons in Figure 1 is shown to the upper right. Design details on each of the four B test structures follows in Table 2. Figure 2 Manhattan Distance (Shortest Orthogonal) IPC when tipped 45 but, the CF Test Boards do. The resulting via edge to via edge spacings are: 0.26 mm, 0.37 mm, 0.51 mm, 0.62 mm [ in, in, in, in]. Other than the use of different drilled hole sizes and a small change in pad sizes, the four structures are identical. The vias in the B test structure are not aligned with the glass fibers. If the failure mode is along glass bundles it is reasonable to expect the B test structure to perform better than the structure for equivalent via edge to via edge spacings. Within a given test structure, the inner and outer layer pads for all 10 layers are the same, i.e., the same pad size is consistently used within a given test structure although, it does change a b "Manhattan Distance" = a+b 3.2 Other Structures Section C is designed to evaluate plated-through hole (PTH)-to-plane layer spacings. It is recommended to use the registration coupon per test board (IPC Test Pattern F) when CF testing includes this region. Section D in the IPC-9254 design is for layer-to-layer Z-axis CF testing. Section D in the IPC-9253 is for evaluating CF resistance in a press-fit compliant pin connector application. The feature in the D region is an optional feature that is present automatically with the design. However, the, B and C regions shall remain as designed in order to provide a standard basis of comparison. The CF test board with 10 layers is designated to evaluate thin single-ply constructions typically used on high performance boards. This board construction stackup can be reduced down to: (a) four layers by eliminating layers 3 through 8 and (b) only test structures and B, when just evaluating differences between laminate materials. 3.3 CF Test Board Design This 10-layer CF test board for evaluating the insulation resistance between internal conductors within a printed wiring board has the following key features for evaluating hole-hole CF resistance (Figure 3). Holes In-Line (in-line with glass fiber direction): There are two rows of 42 signal-1 vias intermeshed with three rows of 42 signal-2 vias; for a total of 168 potential in-line PTH-PTH failures for each spacing distance. Page 3 of 11

4 Conductive nodic Filament (CF) Resistance Test: X-Y xis Table 2 Test Structures B1 through B4 Design Rules B1 B2 B3 B4 Outer layer pad size 0.94 mm [ in] 0.89 mm [ in] 0.84 mm [ in] 0.75 mm [ in] Inner layer pad size 0.94 mm [ in] 0.89 mm [ in] 0.84 mm [ in] 0.75 mm [ in] Drilled hole size 0.81 mm [ in] 0.71 mm [ in] 0.57 mm [ in] 0.46 mm [ in] Via edge to via edge (shortest distance) 0.26 mm [ in] 0.37 mm [ in] 0.51 mm [ in] 0.62 mm [ in] Via edge to via edge (Manhattan Distance) 0.37 mm [ in] 0.52 mm [ in] 0.72 mm [ in] 0.88 mm [ in] On IPC-9254 only, bias applied between: J7, J11 J8, J11 J9, J11 J10, J11 equivalent of three of these BG devices and about 1200 passives or other components with close power/ground pin spacings, the total number of opportunities for in-line CF failure would then be about 4,200 (about the same as the entire CF test board sample lot of 25 pieces). In-Line Hole to Hole (Section ) Staggered Hole to Hole (Section B) IPC Figure 3 CF Test Board PTH-PTH Spacing Design Holes Staggered (closest PTH-PTH spacing in diagonal direction): There are three rows of 26 signal-1 vias intermeshed with four rows of 27 signal-2 vias; for a total of 312 potential diagonal PTH-PTH failures for each spacing distance. 3.4 CF Test Coupon/Board Quantity The CF testing data analysis technique recommended for either of these CF test coupon/board designs requires a minimum 25 CF test boards to be run per sample lot per bias level for statistical significance. This provides a total of 4,200 potential in-line hole-hole CF failure sites and 7,800 potential diagonal holehole CF failure sites for each unique sample/condition set. For comparison, on a 1,428 I/O BG device (Figure 4) there are about 500 power/ground pins. So with an average of slightly less than two adjacent power/ground pin spacings per pin there are about 1,000 potential in-line hole-hole CF failure sites per BG device. For a production board with the Figure Signal Pins 500 Power/ GND Pins BG Device I/O Pin ssignment IPC CF Test Small Coupon Designs The IPC-9255 and IPC-9256 CF test coupon designs (Figure 5) have 10 layers, each approximately 0.7 in x 5 in. Layers 5 and 6 have no trace routing, so removing them provides an 8 layer coupon. Conversely, by duplicating layers 5 and 6, a 14-layer or higher Page 4 of 11

5 Conductive nodic Filament (CF) Resistance Test: X-Y xis IPC Figure 5 Photo of CF Test Coupon IPC-9526 layer count coupon can be obtained. Note: Inner layer copper filling (similar to external layer copper thieving) can be applied to inner layers. These two CF test coupons have additional features for identifying root cause failure site(s). Design data should show the drill sizes to be used (example: 0.37 mm or in), but not the finished hole sizes after plating. Soldermask application is not required for these CF test coupons. IPC-9255 CF coupon evaluates the 2, 3 and 4 hole wall to hole wall structures, with controlled spacings between the adjacent plated through holes in both X and Y in-line dimensions so good CF test data is obtained even if the laminate material machine direction lay-up is done incorrectly. IPC-9256 CF coupon evaluates the 2, 3 hole wall to hole wall structures, with controlled spacings between the adjacent plated through holes in both X and Y in-line dimensions (so good CF test data is obtained even if the laminate material machine direction lay-up is done incorrectly). This coupon also evaluates the B2 structure where hole wall to hole wall spacings are diagonal and useful for determining the quality of the CF testing performed (reference CF test method user guide). [NOTE: These coupons can be run on production board lots on unused portions of the working panel, allowing more costeffective on-going process and/or product monitoring of CF resistance.] s a general rule, there should be enough CF test boards run within each sample test lot to have at least the equivalent number of potential CF failure sites as on a single targeted specific application PWB. 4 Equipment/pparatus or Material 4.1 Environmental Test Chamber clean test chamber capable of producing and recording an environment of 65 ± 2 C[149±3.6 F]or85±2 C[185 ± 3.6 F] and 87 +3/-2% relative humidity, and that is equipped with cable access to facilitate measurement cables to be attached to the specimens under test. 4.2 Measuring Equipment high resistance meter equivalent to that described in STM D-257, with a range up to ohms and capable of yielding an accuracy of ± 5% at ohms with an applied voltage of 100 ±2VDC,oran ammeter capable of reading amps and capable of yielding an accuracy of ± 5% in combination with 100 ±2VDC power supply. The values of resistors used shall be verified by reference resistors traceable to known industry or national standards such as NIST. 4.3 Power Supply power supply capable of producing a standing bias potential of 10 VDC up to 100 VDC with a tolerance of ± 2 VDC,and current supply capacity of at least 1 mpere (mp). 4.4 Current Limiting Resistors Tight control of the total current limiting resistance value is critical for this test method. One 10 6 ohm resistor in series shall be used for each current path. Insert the current limiting resistors in series with the terminating leads going to each test pattern. Note that some test equipment has current limiting resistors built into the testing systems. For the purposes of this standard test, excluding the current limiting resistor and for each CF test circuit, the total series resistance of the measuring equipment and wires shall not be more than 200 ohms. lower total resistance value will increase potential for damage to the test board when a CF failure occurs. higher total current limiting resistance value for each test net removes test conditions further from actual field conditions and is not recommended. 4.5 Connecting Wire Use PTFE- or PFE-insulated copper wires and solder the copper wire directly to the board to connect test points for each test board to the measurement apparatus. 4.6 Other Dedicated Fixtures Hard-wiring is the default connection method. Other dedicated fixtures may be used, Page 5 of 11

6 Conductive nodic Filament (CF) Resistance Test: X-Y xis provided that the fixture does not change the resistance by more than 0.1 decade compared to a comparable hard-wired system when measured at the test conditions. These fixtures should be checked for their resistance values frequently. 5 Procedure 5.1 Test Specimen Preparation Sample Identification Use a method for identifying each test board that does not cause contamination, such as a scribe, making marks away from the biased area(s) of the specimen. Test boards shall be handled by the edges of the board only, and the use of noncontaminating gloves is recommended. Each board shall be clearly marked to identify the simulated assembly reflow and reword processing, and other differentiating parameters, completed prior to CF resistance testing Prescreen for Opens and Shorts Perform as-received insulation resistance measurements using a multimeter to make connection to each net, and check for gross defects. Check for shorts at a 1.0 megohm setting. No opens are allowed in connected nets Simulated ssembly & Rework CF test samples shall go through representative assembly and rework thermal cycling for the application. Default lead-free simulated assembly and rework is 6X at 260 C. Default simulated eutectic tinlead assembly and rework is 6X at 230 C. For reference see, (method for assembly simulation) Cleaning Entirely clean each sample (CF test board) per, Method , Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract by immersion washing until the level of ionic contamination is reduced to less than 1.0 microgram NaCl equivalent per square centimeter and for a maximum of 20 minutes. Boards not achieving this level of cleanliness within 20 minutes shall be scrapped for the purposes of this test. See, Method , Thermal Stress, Convection Reflow ssembly Simulation Connecting Wire Plated through holes near one edge of the board may be used for connecting wire to each test circuit. The test board shall be covered with noncontaminating film to prevent flux spattering during the wire attach process. fter stripping back the wire insulation, use water white rosin (per J-STD-004, Type B) and best soldering technique (per J-STD-001, Class 1 or 2) to solder (per J-STD-006, Type Sn63) PTFE- or PFE-insulated wires to the connection points on each test board. Ensure against damaging PWB laminate material adjacent to the plated holes during soldering by using appropriate time/temperature parameters for the soldering iron Cleaning fter ttachment Perform appropriate local cleaning and rinsing after the attachment of the connecting wires. Isolation resistance between connecting wire attachment sites should remain excellent through 96 hours conditioning. Note: Each CF test failure that does occur during subsequent testing should be checked to determine whether the connecting wire attach area is the low resistance site. If the connecting wire attach area rather than the daisy chain area is the low insulation resistance site, then that test sample is no longer valid for data analysis Dry Bake sample boards for a minimum of 30 minutes in a clean oven at 105 ±2 C[221.0 ± 3.6 F] Precondition Precondition test board samples in a bias-free state (no electrical potential applied to any test pattern) for 30 minutes minimum at 23 ±2 C[73.4 ± 3.6 F] and 50 ± 5% relative humidity prior to any initial insulation resistance measurements [measuring insulation resistance of each daisy-chain net on each test board before starting the first 96 hours (± 30 minutes) of bias-free temperature and humidity conditioning] Temperature/Humidity/Bias (T/H/B) Chamber Place the specimens in the environmental test chamber in a vertical position such that the air flow is parallel to the direction of all test boards in the chamber. llow at least approximately 2.5 cm [nominally 1.0 in] between each test board. Place the test boards, as much as possible, toward the center of the chamber to help ensure against nonoptimum air flow and/or drops of condensation falling onto the test boards. Dress all wiring away from the test patterns, keeping the wires away from the test patterns as they are routed to the outside of the chamber. lso, wire should not impede airflow around the samples. Set the chamber temperature and humidity with a ramp rate of one hour. 5.2 Test Procedures Environmental Test Chamber Controls Tight control of the test chamber temperature and humidity is critical for this test method. difference of 5% relative humidity can Page 6 of 11

7 Conductive nodic Filament (CF) Resistance Test: X-Y xis result in a 0.5 to 1.0 decade difference in measured resistance. If condensation occurs on the test specimens within the environmental chamber while the samples are under voltage, other dendritic growth can occur. Water spotting may also be observed in some ovens where the air flow in the chamber is from back to front, when water condensation on a cooler oven window can be blown around the oven as very small droplets that deposit on test specimens. This contributes to dendritic growth Test Interrupt In the event that the environmental test chamber deviates from the controlled environment, a drop in relative humidity may be permitted for short periods not to exceed 15 minutes, provided that the chamber air temperature does not exceed board temperature by more than 5 C. Boards or coupons being added to a chamber shall be pre-heated to the temperature of the chamber Resistance Measurements Measure the insulation resistance of each test board daisy-chain net using 50 VDC per second rate of rise and minimum hold time of 60 seconds at 100 VDC test voltage. The polarity of the bias (conditioning) voltage and the polarity of the test (measurement) voltage shall always be the same. 100 VDC applied voltage is used as the test voltage for insulation resistance measurements fter initial insulation resistance measurements are taken, close the environmental test chamber and allow the test boards to stabilize for 96 hours (± 30 minutes) at the specified 65 ± 2 C[149 ± 3.6 F]or 85 ± 2 C[185 ± 3.6 F] with 87 +3/-2% relative humidity and no bias applied. fter the 96 hour (± 30 minutes) stabilization period, insulation resistance measurements shall be made between each daisychain net and ground Ensure that all test board samples are connected and that the appropriate current limiting resistor is in series with each corresponding test circuit. Then, connect the test boards to the power supply to begin the T/H/B portion of the CF testing Verify that the appropriate voltage bias is being applied for the duration of the test. For comparing the CF resistance of different laminate materials and processes, the 10 VDC and 100 VDC bias are standards. For correlating test results to expected life in the field, the bias voltage selected should be two times the maximum operating voltage differential for a given application. Higher voltage almost linearly affects time to failure, however higher voltage may offset the impact of humidity due to localized heating and should be avoided since humidity is a key part of the failure mechanism The bias polarity should always be the same as the polarity used when measuring the insulation resistance after the 96-hour stabilization period It is recommended that resistance monitoring measurements be taken every 24 to 100 hours of bias (conditioning) voltage during the duration of the test, ensuring that the polarity of the insulation measurement voltage and the bias voltage are always the same. Decade drops in resistance, observed when these intermediate measurements are taken, also count as failures and improve the accuracy of the test since CF filaments are very thin and are easily destroyed. lso when over 50% of the parts have failed, the test can be stopped. s CF forms, the voltage delivered across the CF failure site will drop as the resistance decreases. This becomes significant as the resistance of the net approaches the resistance of the current-limiting resistor, so adjustments to the voltage during the test are not required fter 500 hours of applied bias (596 hours total), perform the insulation resistance measurements, as before dditional temperature/humidity/bias conditioning may be performed after 500 hours of bias, sometimes up to 1000 hours or more. However, the 500 hours bias testing results shall provide a minimum standard for reporting CF testing results when using this procedure Suspect CF test failures may be checked to determine whether the connecting wire attach area is the low resistance site rather than the daisy-chain area. This requires cutting the trace near the daisy chain (destructive). fter all testing is completed, if the connecting wire attach area rather than the daisy chain area is then found to be the low insulation resistance site, then that test sample is no longer valid for data analysis. 5.3 Data Handling and nalysis Lognormal plots are recommended for plotting percent of samples above an insulation resistance value, versus insulation resistance. Use the log value of the insulation resistance. Page 7 of 11

8 Conductive nodic Filament (CF) Resistance Test: X-Y xis If lognormal plots are not used, a test circuit failure shall be determined by more than a decade drop in insulation resistance as a result of the applied bias. The baseline for the decade drop shall be the average insulation resistance at 96 hours for each coupon (-1, -2, etc.) Test board nets with less than 10 megohms insulation resistance (high resistance short) after the 96-hour stabilization shall be excluded, since these failures are due to poor PTH hole quality or laminate capability The insulation resistance baseline (before bias conditioning) value for a given daisy-chain net (same design spacing) shall be the average resistance of those un-shorted daisy-chain nets on all test boards in the valid sample group as measured after the 96-hours stabilization period The percent failure rate for a given sample group and subsequent test condition is the percent of test boards that show more than a decade drop in resistance compared with the baseline value for daisy-chain nets with the same design spacing For a given sample lot, there may be binomial failure distributions where assignable causes exist along with different levels of capability. 5.4 Visual Examination fter completion of the test, the test boards shall be removed from the environmental chamber and examined at 10X magnification for evidence of surface insulation resistance failure (i.e., discoloration, corrosion), handling or processing defects other than CF ssignable Cause Where an assignable cause of low insulation resistance can be properly attributed to a handling or processing defect other than CF (i.e., contamination on the insulating surface of the board, scratches, cracks, or other obvious damage affecting the insulation resistance between the conductors), then such a value should be excluded CF Microsections Since CF filaments form along the interface between resin and the woven reinforcement, these filaments can be very small and easily disrupted by a relatively low current flow or other causes. Microsectioning to observe CF filaments can be a tedious process with a low success rate. 5.5 Reporting Results The percent failure rate at 500 hours for each spacing in sections and B are the results of interest. Generally PWB processing has the greatest impact on reduced CF resistance at smaller plated-through hole-to-plated-through hole (PTH-PTH) spacings, while the laminate material has the greatest impact at larger PTH-PTH spacings. However, the laminate material used can also affect the extent of fracturing and copper wicking near a PTH There are several additional factors that can affect CF resistance. See PPENDIX for the list of PCB manufacturing parameters that may affect CF resistance and that should be documented. 6 Notes 6.1 Definitions [Only those terms not already included in IPC- T-50.] a) Conductive nodic Filament (CF) Formation: The growth of metallic conductive salt filaments by means of an electrochemical migration process involving the transport of conductive chemistries across a nonmetallic substrate under the influence of an applied electric field, thus producing Conductive nodic Filaments. b) Electrochemical Migration (ECM): The growth of conductive metal filaments across or through a dielectric material in the presence of moisture and under the influence of voltage bias. c) Electroless Nickel / Immersion Gold (ENIG): This is a multi-functional surface finish wherein the electroless nickel layer is capped with a thin layer of immersion gold. It is applicable to soldering, aluminum wire bonding, press fit connections and as a contact surface. The immersion gold protects the underlying nickel from oxidation/passivation over its intended life. d) Maximum Operating Temperature (MOT): n underwriters Laboratories Inc. (UL) requirement value of laminate materials as determined by the results of tests performed by UL. e) Organic Solderability Preservative (OSP): surface finish for fine pitch featured PCBs that are often assembled using surface mount components (SMCs). The OSP surface finish provides very flat/co-planar land areas for the placement and attachment of SMC devices. f) Printed Circuit Board Fabrication (PCB Fab): This phrase alludes to the manufacturing of a bare printed circuit board that is not populated (assembled) with any discrete components. Page 8 of 11

9 Conductive nodic Filament (CF) Resistance Test: X-Y xis 6.2 Reference Documents IPC-TR-476 Electrochemical Migration: Electrically Induced Failures in Printed Wiring ssemblies, Method Electrochemical Migration Resistance Test (note: covers only surface electrochemical migration) IPC-9201 Surface Insulation Resistance Handbook Page 9 of 11

10 Conductive nodic Filament (CF) Resistance Test: X-Y xis PPENDIX dditional CF Resistance Factors Checklist Document for every CF resistance test the several additional factors that can affect CF resistance. These critical factors include: Parameters Test board part number and revision level. Drilled Hole Size for each Hole-Hole and Hole-Plane spacing tested (also recommend drilling feed rate, speed of rotation, chip loading data, backup material type, etc.). Desmear & Cleaning Process (ex: permanganate, plasma). Whether glass microetch was used (and if so, the controlling process parameters). Board finish type (HSL or specific OSP, immersion silver, immersion tin, ENIG, etc.). Laminate material type that was used (manufacturer and material name or number). Woven Glass Manufacturer (silane treatment application). Type of soldermask (if used). PCB Fab manufacturer and facility. Method of separating test board from working panel. Number of circuit layers in test board. Copper thickness in plated through holes in test board. Dielectric Thickness and Construction (same construction throughout is recommended for CF testing). Examples: Core 2/2 3.0 mils thick 1 ply 1080, Prepreg 1 ply 1080 Core 1/1 4.3 mils thick 1-106/1-1080, Prepreg 1-106/ Core H/H 5.0 mils thick , Prepreg Failure Location (with examples) Glass-Resin Boundary Migration Between Glass Fibers Migration Between Fiber Bundles Void within Fiber Bundle Incomplete Wetting gainst Fiber Hollow Fiber (report glass cloth supplier name, name of fiber source) Test Interruptions: Cause (example: power interruption) Length of Interruption Test Re-Start Parameters Frequency of Measurement. Examples: 24 Hours 20 Minutes 6 Minutes Time of Failure: Examples 200 Hours (hollow fiber) 300 Hours (void within fiber bundle) 21 Hours (migration between fiber bundles) Comments Page 10 of 11

11 Conductive nodic Filament (CF) Resistance Test: X-Y xis Parameters Failure Type & Distance (between drilled hole walls, or hole wall to plane edge). Examples: PTH-PTH, 11.0 mils, Nelco PTH-Plane (GND), 15.0 mils, FR406 (dicy-cured) Current Limiting Resistor Value (default is 1.0 meg-ohm or 10 6 ohms) ssembly Process Simulation: Examples No Bake, No Preconditioning Bake (specify), No Preconditioning Bake (specify), 260 C Preconditioning (specify profile) Bake (specify), 260 C Preconditioning (specify profile) Bake (specify), 230 C Preconditioning (specify profile) Bake (specify), 245 C Preconditioning (specify profile) CF Test Parameters: Examples 15 Vdc, 50 C, 80% RH, drilled hole wall to hole wall spacings 100 Vdc, 65 C, 87% RH, drilled hole wall to hole wall spacings 10 Vdc, 65 C, 85% RH, drilled hole wall to hole wall spacings Material(s) Tested: Examples FR406 (dicy-cured) Nelco Reporting s: Examples Tested: ugust 2006 CF Test Coupon Manufactured: February 2006 Comments Page 11 of 11