Outline. Structure. Features. Applications. Sizes. Heat activated adhesive tape M restricted substances by RoHS are not contained.

Transcription

1 Heat activated adhesive tape Outline Nitto Denko is a thermal bonding adhesive tape that with a uniform coating of synthetic rubber heat-activated adhesive on both sides of a thin nonwoven fabric base. The tape was developed for fixing metal nameplates, it has superior adhesion by thermal bonding with low temperature and short Time. Structure Tape thickness: 0.08 Synthetic rubber adhesive Nonwoven fabric Synthetic rubber adhesive Release liner Features Applying heat enables bonding at low temperatures in a short period of time (10 to 60 seconds at 130 to 150 C). Features minimal tackiness and easy positioning. The six hazardous materials restricted by the RoHS directive are not compounded. 6 restricted substances by RoHS are not contained. Applications Fixing of nameplates and decorative plates Bonding of metal and plastic sheets Sizes Tape thickness (mm) Width (mm) Length (m) For details, please contact us. 10-P-0047_E (1/5)

2 Properties 90 peeling adhesive strength for each substrate Substrate ABS plate 84.0 Polystyrene plate 83.0 Bakelite plate 90.0 Acrylic plate 86.0 (Unit: N/25 mm) Lining material: (0.4 mm thick) 1 m/min x140 C 130 C x 29.4 x 10 4 Pa x 10 sec Peeling speed: 50 mm/min Measurement temperature: 23 Measurement method: 90 peeling Polycarbonate plate 78.0 Stainless steel plate 84.0 Lining material Peeling direction 80.0 Substrat 90 peeling adhesive strength for each temperature Adhesive strength (N/25 mm) Measurement temperature () (Unit: N/25 mm) Lining material: (0.4 mm thick) Substrate:Polystyrene plate 1 m/min x 140 C 130 C x 3kg/cm 2 x 10 sec Peeling speed: 50 mm/min Measurement method: 90 peeling 10-P-0047_E (2/5)

3 Shearing adhesive for each temperature Shear strength (N / 10 x 10 mm) Substrate: (0.3 mm thick) 130 C x 3kg/cm 2 x 10 sec Peeling speed: 10 mm/min Pulling direction Measurement temperature ( C) Pulling direction T shape peeling strength(durability) Heat resistance Test items T shape peeling strength Initial 20.0 (30 days at 70 C) 22.0 (30 days at 50 C) 21.0 Water resistance (30 days at 40 C) 20.0 Moisture/heat resistance (30 days at 35 C, 80% RH) Thermal cycle (70/20 C, 12 cycles) (Unit: N/20 mm) Substrate: Aluminum foil (0.07 mm thick) 130 C x 3kg/cm 2 x 10 sec Peeling speed: 300 mm/min Pulling direction Aluminum foil Pulling direction 10-P-0047_E (3/5)

4 Repelling resistance Setting temperature ( C) Setting time (Hr) Lifting (Unit: Lifting [mm]) Substrate: (0.4 mm thick) ABS plate 1 m/min x 140 C 130 C x 3kg/cm 2 x 10 sec Height ABS plate Bonding conditions and adhesive strength Bonding temperature/time and adhesive strength Adhesive strength (N/25mm) Bonding temperature Lining material: (0.4 mm thick) Substrate: Polystyrene plate 1 m/min x 140 C Peeling speed: 50 mm/min Measurement temperature: 23 C Bonding pressure: 29.4 x 10 4 Pa Bonding time (sec) load / adhesive strength Adhesive strength (N/25mm) Lining material: (0.4 mm thick) Substrate: Polystyrene plate 1 m/min x 140 C Peeling speed: 50 mm/min Measurement temperature: 23 C Bonding temperature: 130 C Bonding time: 10 sec 4.9x10 4 Pa 29.4x10 4 Pa 58.8x10 4 Pa 93.1x10 4 Pa 14.7x10 4 Pa Pressure load (Pa) 10-P-0047_E (4/5)

5 Precautions when using Remove all oil, moisture and dirt from the surface of the substrate before applying. The tape may not adhere well to significantly uneven or distorted surfaces. Level off the surface as much as possible before applying. Nitto Denko is a thermal bonding adhesive tape. Be sure to evaluate the bonding conditions (heat, pressure, time) and apply with sufficient pressure using a roller or press. Failure to do so could affect properties or appearance. Be careful not to get burned when applying tape. No It takes some time before the tape exhibits its full adhesive strength. Allow the tape to set for several hours before placing in a position or using in a manner that places stress on the tape. Precautions when storing Be sure to keep the tape in its box when not using. Keep in a cool dark place not exposed to direct sunlight. Safety precautions WARNING Because this tape is a thermal bonding adhesive tape, it may be impossible to maintain quality is store or processed outside the specified conditions. Make sure the product is suitable for the application (objective and conditions) before attempting to use. The tape may come off depending on the substrate to which it is applied or conditions under which it is applied. Use in combination with another method of joining if there is possibility of an accident. Do not incinerate. Doing so may produce toxic gas or odor that can cause nausea if inhaled. The tape should be disposed of by a licensed contractor. Published in October P-0047_E (5/5)