ASPICS IPD Companion for ISM Transceiver IC: RF front end part

Transcription

1 IPD Companion for ISM Transceiver IC: RF front end part Rev 1.2 TD Introduction The ASPICS is an integrated passives device specifically designed for use with the SEMTECH SX /915MHz ISM/UHF transceiver. This front-end part replaces 8 equivalent SMDs used for RF matching and decoupling network. ASPICS (compatible with 868 MHz/915 MHz band) is designed for use with ASPICS / 868 MHz or ASPICS / 915 MHz. This two parts chip-set (606 & 604 or 606 & 605) brings an optimized RF design solution. The number of components is reduced by about 50 % in typical applications. RF design is also further simplified by careful component placement on PCB. (Standard reflow soldering technology can be used.) The ASPICS shows improved performance in terms of output power and sensitivity, by combining small size, efficient decoupling and optimized matching RFIO network. Features IPD Companion for Transceiver IC ISM band: MHz MHz Passive integration of matching network, RF rejection and decoupling on single Silicon die (replacing 8 key components) Cost reduction Compatible with current packaging Miniaturization of application: Small size 2.05 x 2.65 mm Enhance performance: Full matching network return loss > 15dB Decoupling capacitor with low ESR Better system stability Shorter distance with the active die Low aging High reliability Very low leakage Operating temp. range: -40 C to +150 C Applications Wireless alarm and security systems Wireless sensor networks Automated Meter Reading (AMR) Home and building automation Industrial monitoring and control Remote Wireless Control

2 Ordering Information Type number Package Product Name Die Name Description Version ASPICS ASP126.1 WLCSP Companion RF IPD 8 bumps 2.05 mm x 2.65 mm x 0.55mm 1 Table 1: die information Package Type number Packaging Termination Description Version T2S Tape & Reel 100 SAC305 7 diameter 1 (96.5Sn/3.0Ag/0.5Cu) T3S T4S Tape & Reel Tape & Reel SAC305 (96.5Sn/3.0Ag/0.5Cu) SAC305 (96.5Sn/3.0Ag/0.5Cu) Table 2: ordering information Specific application for ISM 869MHz/915 MHz transceiver SX diameter 1 7 diameter 1 Integration of RF front end and decoupling in single IPD die around the transceiver SX1211 ASPICS Fig 1: SX1211 Schematic for RF layouts TRx RF module schematic Details of PICS integration ASPICS RF front end part: 2 coils (L4=8.2 nh, L3=100 nh), 4 capacitors (C8=1.8 pf, C9=22 pf, C10 & C11) Decoupling part: 1 capacitor (C4=47 nf) and 1 resistor (R1=1 ohm) Number of components integrated from BOM = 8 Rev1.2 2 of 9

3 Block Diagram ASPICS Electrical Schematic Cm9 Cm8 Rm1 Lm4 Lm3 Cm4 Fig2: ASPICS Block Diagram Electrical specification Symbol Description Min Typ Max Unit VDDmr Supply voltage V Tmr Storage temperature C Pmr input level dbm Table 2: Absolute maximum ratings Symbol Description Min Typ Max Unit VDDop Supply voltage V Trop Operation temperature C ML input level dbm Table 3: Operating range Ref Value Tol(+/-) Description Function Cm4 47nF 15% - PA regulator decoupling Cm8 1.8 pf 5% - RF matching Cm9 22 pf 5% - DC block Lm3 100 nh 5% - PA choke Lm4 8.2 nh 5% - RF matching Rm1 1 W 10% - PA regulator Cm10 few pf 5% - RF matching Cm11 few pf 5% - RF matching Table 4: Component description Rev1.2 3 of 9

4 Symbol Description Min Typ Max Unit F LO LO frequency (F OL =F RF x 8 / 9) MHz F RF RF frequency (915 MHz band) MHz F LO LO frequency (F OL =F RF x 8 / 9) MHz F RF RF frequency (868 MHz band) MHz Matching and filter specification UnBal imp Unbalance impedance 50 W RL Unbalanced port Return Loss including matching and filtering db Fc Center frequency MHz Bw Bandwidth MHz IL Insertion Loss including matching and filtering db LOrej LO rejection db H2rej H2 rejection db Table 5: specification Insulation between PA and RFin Insulation between PA and RFout Table 6: S-parameter results Rev1.2 4 of 9

5 Pinning definition Coordinate of ASPICS bump (0,0) = center of ASPICS Symbol Pin X (µm) Y (µm) side GND top GND top GND top N-C 7 N-A N-A top RFIO_SAW top RFIO_TRX bottom RFIO_TRX bottom N-C 3 N-A N-A bottom VR_PA bottom VR_PA bottom Table 7: ASPICS Pinning Item Unit Size IPD height µm ±50 Bump diameter µm ±20 Minimum bump pitch µm ±10 Table 8: ASPICS IPD definition IPD Size Unit X Y Die size including scribe lane µm ± ±50 Table 9: ASPICS IPD size Rev1.2 5 of 9

6 Package outline and PCB footprint recommendation Bump diameter 200um All Dimensions in mm Typical dimensions PCB footprint PCB copper pad diameter 210um recommended 250um max Solder mask opening 160um Pin1 location IPD name location Solder mask Track Fig3: RCN Package outline (Bottom view = bump side) Termination Lead-free nickel/solder coating compatible with automatic soldering technologies: reflow and manual Assembly Assembly of WL CSP has to be done with standard lead-free profile(for SAC alloys) or according to recommendations of J-STD 020. Regarding the reliability, 550 μm IPD height is preferred. Underfilling is strongly recommended for lower values. To optimize the natural self-centering effect of WL-CSPs on PCB, PCB pad positioning and size must be property designed. Note: Underfilling under IPD and micro via on PCB pad are the customer's responsibility. PCB pad finishing: Cu-Ni (2-6 µm) Au (0.2 µm max). Routing recommendations This PCB area should be kept free of any routing or ground plane in order to avoid performance degradation with coupling of RF front end coils. Fig4: ASPICS routing recommendations (Top view) Rev1.2 6 of 9

7 Platform PCB layout As illustrated in figures below, the layout has the following characteristics: Small BOM (8 components) few pick & place Very compact ref design (7.5 x 15.8 mm) Can be easily inserted even on very small PCBs Standard PCB technology (2 layers, 1.6 mm, standard vias and clearance) low cost Performance quasi insensitive to dielectric thickness and optimum RF interconnections quasi zero effort portability to other PCB technologies (thickness, number of layers, etc.) The layers description is illustrated in figure below: Signal (35 um) Insulation (FR4, 1.6 mm) Ground plane Fig5: Platform PCM layout with ASPIC & SX1211 (top view) The layout itself is illustrated in figure below. Please contact contact@ipdia.com for assistance U3 U4 Fig6: Platform PCM layout with ASPIC & ASPIC /5 & SX1211 (top view) Rev1.2 7 of 9

8 BOM Ref Value Tol(+/-) Description Size / Techno U1 SX Semtech Transceiver IC TQFN-32 U2 SAW - SAW filter 3.8 x 3.8 mm U3 ASPICS IPDiA IPD RF matching 2.65 x 2.05 mm / PICS U4 ASPICS /5 - IPDiA IPD synthesis part 2.5 x 1.75 mm / PICS Q MHz 15 ppm at 25 C 20 ppm over - Fundamental, Cload=15 pf 40/+85 C 2 ppm/year max (*) not part of the ref. design (not required for direct antenna connection) Table 10: BOM 5.0 x 3.2 mm / AT-cut C1 1 uf 15% VDD decoupling 0402 / X5R C2 1 uf 15% Top regulator decoupling 0402 / X5R C3 220 nf 5% Digital regulator decoupling 0402 / X7R C5 100 nf 5% VCO decoupling 0402 / X7R C12 (*) 47 pf 5% DC block 0402 / NPO Rev1.2 8 of 9

9 References [1] Semtech SX1211 Datasheet [2] SM1211 RF Module User s Guide [3] IPDiA_ASPICS_For_SX1211 Applications Notes [4] IPDiA_WLCSP assembly application notes Definitions Data sheet status Objective specification Preliminary specification Product specification This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Revision history Revision Date Description Author Release 1.0 August 31, 2011 Creation OGA Release 1.1 October 7, 2011 Release Marcom Release 1.2 December 15, 2011 Ordering code update per quantity OGA Life Support Applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. IPDiA customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify IPDiA for any damages resulting from such improper use or sale. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. For more information, please visit: To contact us, to: sales@ipdia.com Date of release: December 15, 2011 Document identifier: TD