IPC Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6015

Transcription

1 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures February 1998 A standard developed by IPC 2215 Sanders Road, Northbrook, IL Tel Fax

2 HIERARCHY OF IPC QUALIFICATION AND PERFORMANCE SPECIFICATIONS (6010 SERIES) IPC-6010 IPC-6011 GENERIC IPC-6012 RIGID IPC-6013 FLEX IPC-6014 PCMCIA MCM-L IPC-6018 HIGH FREQUENCY FOREWORD This specification is intended to provide information on the detailed performance criteria of organic multichip modules. The information contained herein is also intended to supplement the generic requirements identified in IPC When used together, these documents should lead both manufacturer and customer to consistent terms of acceptability. IPC s documentation strategy is to provide distinct documents that focus on specific aspects of electronic packaging issues. In this regard, document sets are used to provide the total information related to a particular electronic packaging topic. A document set is identified by a four digit number that ends in zero (0) (i.e., IPC-6010). Included in the set is the generic information which is contained in the first document of the set. The generic specification is supplemented by one or multiple performance documents, each of which provide specific focus on one aspect of the topic or the technology selected. Failure to have all information available prior to building a board may result in a conflict in terms of acceptability. As technology changes, a performance specification will be updated, or new focus specifications will be added to the document set. The IPC invites input on the effectiveness of the documentation and encourages user response through completion of Suggestions for Improvement forms located at the end of each document.

3 February 1998 Table of Contents 1.0 SCOPE Scope Purpose Performance Classification Documentation Hierarchy APPLICABLE DOCUMENTS Mandatory Documents Supplemental Documents IPC Joint Industry Standards Military EIA/JEDEC Federal Specifications Other Publications REQUIREMENTS General Terms and Definitions Materials Used in this Specification Rigid Laminates Flexible Films Bonding Materials Other Dielectric Materials Metal Foils Metal Core Substrates Metallic Plating and Coatings Polymer Coating (Solder Resist) Marking Inks Hole Fill Insulation Material Heatsink Planes, External Visual Examination Edges Laminate Imperfections Plating and Finish Coating Voids in the Hole Lifted Lands and Conductors Marking Solderability Plating Adhesion Workmanship Dimensional Requirements Hole Pattern Accuracy Registration (Internal) Annular Ring (External) Bow and Twist Conductor Definition Conductor Width Conductor Spacing Conductive Surfaces Structural Integrity Prior to Stress Plated-Through Hole Integrity Prior to Stress Structural Integrity After Thermal Stress Plated-Through Hole Integrity after Thermal Stress Bond Strength, Unsupported Hole or Surface Mount Land Solder Resist (Solder Mask) Requirements Solder Resist Coverage Solder Resist Cure and Adhesion Solder Resist Thickness Electrical Properties Dielectric Withstanding Voltage Circuitry Circuit/Plated-Through Shorts to Metal Substrate Insulation Resistance (As Received) Environmental Moisture and Insulation Resistance Thermal Shock Cleanliness Special Requirements Outgassing Organic Contamination Fungus Resistance Vibration Mechanical Shock Impedance Testing Coefficient of Thermal Expansion (CTE) Pressure Cooker Test Die Bond Adhesion Repair QUALITY ASSURANCE General Qualification Test Specimen Quality Conformance Inspection iv

4 February C=0 Sampling Plan Referee Tests Figures Figure 3-1A Breakout of 90 and Figure 3-1B Conductor width reduction... 6 Figure 3-2 Negative etchback... 9 Figure 3-3 External foil separation Figure 3-4 Crack definition Figure 3-5 Typical microsection evaluation specimen (three plated through-holes) Tables Table 3-1 Metal Core Substrates... 3 Table 3-2 Final Finish, Plating/Coating Thickness Requirements... 4 Table 3-3 Plating and Finish Coating Voids Visual Examination... 6 Table 3-4 Minimum Internal and External Annular Rings... 6 Table 3-5 Conductor Spacing Reduction... 7 Table 3-6 Wire Bond Adhesion Requirements... 7 Table 3-7 Plating Integrity in Plated-through Holes Prior to Stress... 9 Table 3-8 Internal Layer Foil Thickness After Processing... 9 Table 3-9 External Conductor Thickness After Plating... 9 Table 3-10 Plated Through-Hole Integrity After Stress Table 3-11 Solder Resist Adhesion Table 3-12 Dielectric Withstanding Test Voltages Table 3-13 Insulation Resistance Table 4-1 Initial Qualification Tests Table 4-2 C=0 Sampling Plan (Sample Size for Specific Index Value) Table 4-3 Quality Conformance Testing and Frequency v

5 February 1998 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures 1.0 SCOPE 1.1 Scope This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic Single-chip Module (SCM-L) or Organic Multichip Module (MCM-L) assembly, and the quality and reliability assurance requirements that must be met for their acquisition IPC 1 IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits IPC-PC-90 General Requirements for Implementation of Statistical Process Control IPC-DD-135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 1.2 Purpose The requirements contained herein are intended to reflect the electrical, mechanical, and environmental properties of the MCM-L mounting structure. IPC-CF-148 IPC-MF-150 Resin Coated Metal for Printed Boards Metal Foil for Printed Wiring Applications 1.3 Performance Classification This specification recognizes that MCM-L mounting structures will be subject to variations in performance requirements based on end use. The MCM-L mounting structures are classified by a Performance Class of 1, 2, or 3. Performance Classes are defined in IPC-6011, Generic Performance Specification for Printed Boards. 1.4 Documentation Hierarchy This document, combined with IPC-6011, Generic Performance Specification for Printed Boards, constitutes a qualification and performance specification for MCM-L mounting structures. 2.0 APPLICABLE DOCUMENTS 2.1 Mandatory Documents The following documents form a mandatory part of this standard and all requirements stated therein apply, unless modified in the section where they are invoked: IPC-2221 Generic Standard on Printed Board Design IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies IPC-6011 Boards Generic Performance Specification for Printed 2.2 Supplemental Documents The following documents of the issue in effect on the date of issuance of this specification, form a part of this specification to the extent specified herein. Subsequent issues of, or amendments to, these documents may become a part of this specification. IPC-CF-152 Composite Material Specifications for Printed Wiring Boards IPC-FC-231 Flexible Base Dielectrics for Use in Flexible Printed Wiring IPC-FC-232 Adhesive Coated Dielectric Films for Use in Flexible Printed Wiring and Flexible Bonding Films IPC-FC-241 Flexible Metal Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring IPC-D-325 Boards IPC-A-600 Documentation Requirements for Printed Acceptability of Printed Boards IPC-AI-642 User s Guidelines for Automated Inspection of Artwork, Innerlayers, and Unpopulated PWBs IPC-TM-650 Test Methods Manual Microsectioning Resistivity of Solvent Extract Surface Organic Contaminant Detection Test (Inhouse Method) Surface Organic Contaminant Identification Test (Infrared Analytical Method) Adhesion, Plating Bond Strength, Surface Mount Land (Perpendicular Pull Method) Bow and Twist Adhesion, Solder Mask (Over Melting Metals) 1. The Institute for Interconnecting and Packaging Electronic Circuits, 2215 Sanders Road, Northbrook, IL

6 February Coefficient of Thermal Expansion, Strain Gage Method Die Shear Strength Wire Bond Pull Strength Dielectric Withstanding Voltage, Printed Wiring Material Fungus Resistance, Printed Wiring Materials Moisture and Insulation Resistance, Rigid, Rigid/Flex and Flex Printed Wiring Boards Outgassing, Multilayer Printed Wiring Boards Physical µmechanical) Shock, Multilayer Printed Wiring Thermal Shock-Rigid Printed Boards Vibration, Rigid Printed Wiring Assessment of Plastic Surface Mount Components for Susceptibility to Moisture Induced Damage IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards IPC-SM-786 Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies IPC-SM-840 Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards IPC-2141 Controlled Impedance Circuit Boards and High Speed Logic Design IPC-4101 Specification for Base materials for Rigid and Multilayer Printed Boards J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices Military 2 Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. MIL-G EIA/JEDEC 3 Gold Plating, Electrodeposited JESD22-A102 Accelerated Moisture Resistance - Unbiased Autoclave JEDEC Publication 95 Registered and Standard Outlines for Solid State and Related Products Federal Specifications 2 QQ-A-250 QQ-N-290 QQ-S-635 Aluminum Alloy, Plate and Sheet Nickel Plating Steel Other Publications ASTM 4 ASTM-B-152 Copper Sheet, Strip and Rolled Bar ASTM-B-579 Standard Specification for Electrodeposited Coating of Tin-Lead Alloy (Solder Paste) NEMA 5 IPC-7711 Rework of Electronic Assemblies NEMA LI1 Industrial Laminate Thermosetting Product IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies Joint Industry Standards 1 J-STD-003 J-STD-005 Solderability Tests for Printed Boards Requirements for Soldering Pastes J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications American Society for Quality Control 6 Zero Acceptance Number C=0 Sampling Plan 3.0 REQUIREMENTS 3.1 General MCM-L mounting structures furnished under this specification shall meet or exceed all of the requirements of the specific performance class as required by the procurement documentation. These mounting structures must meet specific requirements because of the chip component assembly processes used for MCM-Ls. 2. Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA EIA, 2500 Wilson Boulevard, Arlington, VA ASTM, 100 Barr Harbor Drive, West Conshohocken, PA NEMA, 1300 North 17th Street, Suite 1847, Rosslyn, VA ASQC, 230 West Wells Street, Milwaukee, WI