Specification Progression

Transcription

1 Suspension Design for Customer Manufacturability Bob Evans DISKCON Asia Pacific March 2006

2 Intro New technologies and processes such as solder head attach, FEMTO/PEMTO sliders, flyheight control and dual stage actuation are creating new and challenging requirements for suspension assemblies. HTI continues to provide solutions for emerging technology requirements, while providing features that allow for improved manufacturability at our customers. Hutchinson Technology Inc., March

3 Specification Progression Gram Load Tolerance Reduction Change Through Swage Standardized Measurement Static Attitude Tolerance Reduction Bond Pad to Dimple Registration Hutchinson Technology Inc., March

4 Gram Hutchinson Technology Inc., March

5 Gram Load Change Through Swage Optimization of the base plate can reduce both the amount of gram change and bias between up and down suspensions. Hutchinson Technology Inc., March

6 GenVe Fixture: Setting the Industry Standard for Gram Measurement GenVe allows for standardized measurement of gram load. Over 100 fixtures are used in the industry today. Hutchinson Technology Inc., March

7 Static Attitude Hutchinson Technology Inc., March

8 Bond Pad to Dimple Registration Factors driving the need for improved bond pad to dimple registration include: Reduced flyheight variation Reduced slider sizes Increased termination count Solder termination Registration improvements to date are a result of industry-leading automation, precision tooling and progression of flexure technology. Machine vision and flexure manufacturing technology enhancements will offer future improvements to bond pad to dimple registration. Bond Pad to Dimple Hutchinson Technology Inc., March

9 Bond Pad to Dimple Registration Total Tolerance (sym and loc, mm, +/-) Leading Edge Assembled Bond Pad to Dimple Backside Alignment Controlled Pad at Flexure Taper Locate in Welding Auto-expose Year (Calendar, Start of) Dimple Backside Control Historical Volume Capability Projected Technology Capability Vision Dimple Form Hutchinson Technology Inc., March

10 Feature Progression Attachments Merging & Handling Electrical Flexure Technology Dual Stage Hutchinson Technology Inc., March

11 Boss Size Reduction Enables thinner and smaller flanged base plates with reduced mass: Significantly improves gram change Less base distortion Stronger flange Hutchinson Technology Inc., March

12 Merge Features Allow the suspension to move on and off merge and shipping combs to reduce the possibility of damage and particle generation. Comb Rail Comb Dome Dielectric & Covercoat Overhang Hutchinson Technology Inc., March

13 Limiters Limiters restrict motion of the slider and gimbal. Benefits: Reduced handling damage during processing Keep head planar to disk during loading or shock events Several configurations are available depending on design requirements. Hutchinson Technology Inc., March

14 Plated Ground Features (PGF) Low resistance ground (< 1 Ohm) minimizes ESD risk. Simplifies head attach by eliminating conductive epoxy grounding. Hutchinson Technology Inc., March

15 AS-21 ESD Coating Anti-Static Coating (thickness exaggerated for clarity) Copper Covercoat Polyimide Stainless Steel Description: Semi-conductive polymer coating Benefits: Prevents tribocharging of the suspension HGA and HSA ESD yield improvement Reduced HSA DPPM Reduced drive level ESD/EOS, increased drive yield, reduced drive rework Hutchinson Technology Inc., March

16 SBB/SJB Robustness The heat generated during solder ball bonding or solder jet bonding can deform the gimbal. Both FEA modeling and part testing are used to minimize this change. Hutchinson Technology Inc., March

17 Ultrasonic Robustness Carefully designed low stiffness FEMTO/PEMTO gimbals can eliminate damage from ultrasonics, while still meeting product requirements. Both FEA modeling and actual part testing can be used to improve and validate designs. Hutchinson Technology Inc., March

18 Flexure Technology TSA+ Additive Flexures Registration for head attach Polyimide covercoat for thermal robustness to high temperature solder Increased design flexibility Hutchinson Technology Inc., March

19 Motor/Jumper Attach for Dual Stage Continued areal density progression will drive ever increasing TPI performance. Progression will challenge the servo bandwidth of today s single stage actuation. HTI can provide dual stage suspensions to enable continued TPI increases without requiring major changes to HGA processes. Hutchinson Technology Inc., March

20 Summary New technologies and processes such as solder head attach, FEMTO/PEMTO sliders, flyheight control and dual stage actuation are creating new and challenging requirements for suspension assemblies. HTI continues to provide solutions for emerging technology requirements, while providing features that allow for improved manufacturability at our customers. Hutchinson Technology Inc., March