Implementation of IECQ Capability Approval using the IPC-6010 series of Standards

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1 Page 1 of 13 INTERNATIONAL ELECTROTECHNICAL COMMISSION QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) DOCUMENT NUMBER: OD 301 DOCUMENT TYPE: Operational Document VERSION: Version 1 TITLE: Implementation of IECQ Capability Approval using the IPC-6010 series of Standards Document History Date Summary Original Issue (Version 1) Reproduced in Switzerland Central Office of the IEC 3, rue de Varembé GENEVA

2 Page 2 of Introduction This IECQ Operational Document has been developed to enable manufacturers of (unpopulated) printed circuit boards (PCBs) to be granted IECQ capability approval against the requirements of the IPC-6010 series of PCB performance Standards. This Operational Document was considered and approved during the 2008 IECQ annual Meetings. 2. Purpose The rules for IECQ Capability Approval are detailed in IEC QC clause 4 which anticipates the existence of a Customer Detail Specification (CDS). This document fulfils the role of a default CDS. 3. Related Documents IEC QC IEC Quality Assessment System for Electronic Components (IECQ) Rules of Procedure Part 3: Approval Procedures IPC-6011 Generic Performance Specification for Printed s Qualification and Performance Specification for Rigid Printed s Qualification and Performance Specification for Flexible Printed s Note: and also are each considered to fulfil the rôles of both a Sectional Specification and a Capability Detail Specification for the purposes of IECQ Capability Approval. 4. Requirements The PCB performance classes detailed in clause 1.2 of IPC-6011 are acknowledged, and it is anticipated that the demonstration of class 3 performance will be expected in many application where IECQ certification is sought. However, it has been found that the costs of the specified lot-by-lot testing (particularly in respect to internal annular ring registration) acts as a significant deterrent to the use of the Standards as written. Table 1 details substitute customer requirements to those given in. Table 2 details substitute customer requirements to those given in. These are the minimum requirements permitted for IECQ certification. Applications for IECQ Capability Approval for IPC-6011 Class 1 will not be accepted. Customers for PCBs are encouraged to study the requirements of the Standards and determine an appropriate class of performance for their application. This may result in requirements different to those given in the Standards as modified by this IECQ OD, with consequent differences in the cost of the delivered product.

3 Page 3 of 13 Table 1; Substitute requirements applicable to Material Material Verifiable CofC or SPC program Visual Edges of X Per board Laminate Imperfections X Per board Workmanship X Per board Lifted lands X Per board Marking and traceability X Coupons Per board and board Use of suppliers declarations are set as AOI default Voids in plated hole X as specified for declared class Solderability Surface X M Per board Hole X A or S Per board Dimensional dimensional 3.4 X Per board Hole size X Per board Hole pattern accuracy X Supplier as specified for declared class

4 Page 4 of 13 Pattern feature accuracy X certification allowed Annular ring (external) X Solder resist coverage X Per board are set as AOI default Bow and Twist X Per board as specified Plating / coating X C or N as specified for declared class. thickness (electronic) Conductor width Internal X Per internal panel layer External X Per board Conductor spacing Internal layer (minimum 5 evaluations per layer set) External X Per board Conductive surfaces (surface only) Edge board contact, junction of gold plate to solder finish X are set as AOI default are set as AOI default

5 Page 5 of 13 Nicks, dents, pinholes X Per board Dewetting / nonwetting / X Per board final finish coverage Edge board connector X Per board Surface mount X Minimum 10 evaluations per panel as specified for declared class. Physical Plating adhesion X C or N (1 ) Solder resist cure and adhesion Cleanliness Cleanliness prior to solder resist application X G (1 ) as specified for declared class X Per lot as specified for declared class. Structural integrity after stress types 3-6 (microsection) Plating integrity Laminate voids Etchback / negative etchback 3.6a, The sampling requirements of class 2 shall be used. Customers may opt for the class 3 sampling requirements but should be aware of the expense of this option.

6 Page 6 of 13 Annular ring (internal) 3.6a Lifted lands Hole plating thickness 3.6a Surface plating and conductor thickness Conductor thickness (internal) a a Metal core spacing Twice per panel opposite corners For assessment of Annular ring internal the following options may be considered: a) The sampling requirements of class 2 may be used, or b) The use of X-ray techniques may be used, or c) The use of special electrical s may be used. Note: the techniques described in (b) and (c) are permitted by clause of IPC The sampling requirements of class 2 shall be used. Customers may opt for the class 3 sampling requirements but should be aware of the expense of this option.

7 Page 7 of 13 Dielectric thickness 3.6a Resin fill of buried vias Structural integrity after stress type 2 (microsection) Plating integrity Laminate voids 3.6a Lifted lands Hole plating thickness 3.6a Surface plating and conductor thickness a The sampling requirements of class 2 shall be used. Customers may opt for the class 3 sampling requirements but should be aware of the expense of this option. Surface plating and conductor thickness 3.6a

8 Page 8 of Circuit continuity X Per board Insulation resistance X as specified for declared class. Requirement & Method Coupon Frequency Type 1 Types 2 6 Class2 Class 3 Substitute Customer Requirement Quality conformance maintenance testing Rework simulation (when A Not Monthly specified) Applicable Bond strength B Quarterly Monthly Dielectric withstanding E E Quarterly Monthly voltage Moisture and Insulation resistance E E Quarterly Monthly as specified for declared class.

9 Page 9 of 13 Table 2; Substitute requirements applicable to Material Material Verifiable CofC or SPC program Visual Edges; rigid section X Per board Edges; flex section X Per board Transition zone; rigid X Per board area to flex area Construction X Per board imperfections Marking and traceability X (Retained Per board Edge board contact; junction of gold plate to solder finish Coupons) X Lifted lands X Per board Workmanship X Per board Plating and coating voids X. in holes Types 2,3,4 Use of suppliers declarations are set as AOI default as specified for declared class.

10 Page 10 of 13 Physical Plating adhesion X C (1 ) Covercoat cure and adhesion X G (1 ) Solderability Surface X M Hole X A Dimensional Dimensional; flexible 3.4 X Per board printed wiring Hole size and hole X Per board pattern accuracy Etched annular ring X Per board (external) Solderable annular ring; external X Per board Bow and Twist (individual board or stiffener potion) Conductor definition (internal and external layers) Conductor imperfections X Per board Conductor width X Per board reduction Conductor thickness X Per board or S as specified for declared class. as specified for declared class. are set as AOI default X Per board as specified for declared class.

11 Page 11 of 13 reduction Conductor spacing X Per board Nicks or pinholes in X Per board ground or voltage planes Surface mount lands X Minimum 10 evaluations per panel Edge connector lands X Per board Conductor edge outgrowth X Per board Dewetting / nonwetting / Per board final finish coverage X Structural integrity after stress types 3-4 (microsection) Flexible and rigid laminate integrity Etchback, smear removal and negative etchback (Types 3 and 4 only) Plating integrity and wicking Plating voids Annular ring breakout (internal) or 2 A/B Twice per panel, are set as AOI default as specified for declared class. The sampling requirements of class 2 shall be used. Customers may opt for the class 3 sampling requirements but should be aware of the expense of this option. For assessment of Annular ring internal the following options may be considered: a) The sampling requirements of class 2 may be used, or

12 Page 12 of 13 diagonally opposite corners Plating / coating thickness Minimum layer / copper foil thickness Minimum surface conductor thickness Metal cores Dielectric Thickness Structural integrity after stress type 2 (microsection) Laminate integrity (flexible) Plating integrity Plating voids Plating / coating thickness Minimum surface conductor thickness Dielectric Thickness b) The use of X-ray techniques may be used, or c) The use of special electrical s may be used. Note: the techniques described in (b) and (c) are permitted by clause of IPC The sampling requirements of class 2 shall be used. Customers may opt for the class 3 sampling requirements but should be aware of the expense of this option. The sampling requirements of class 2 shall be used. Customers may opt for the class 3 sampling requirements but should be aware of the expense of this option.

13 Page 13 of 13 Circuit continuity X Per board Isolation (circuit shorts) X as specified for declared class. Coupon Frequency Types Types 1 & Class2 Class 3 Substitute Customer Requirement Quality conformance testing Rework simulation 3.8 B Two Bond strength (unsupported lands) B As required s per quarter Bond strength As required Dielectric withstanding E E Two voltage s Moisture and Insulation E E per quarter resistance Two s per month As required Two s per month as specified for declared class.

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