Statement of Work (SOW) inemi Substrates/Packaging TIG Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Phase 2

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1 Statement of Work (SOW) inemi Substrates/Packaging TIG Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Phase 2 Version #1.0 Date: October 6, 2017 Project Leader: Feng Xue - IBM Co-Project Leader: Charles Woychik i3 Electronics inemi Staff: Masahiro Tsuriya Basic Project Information Background/Context Integrated SiP packages are becoming more popular as an electronic packaging solution. This package type requires finer circuit patterns designs. However, optical inspection has limitations in detecting the defect features, such as: a) Line width violations; b) Spacing violations; c) Excess copper or missing copper; d) Short or open circuits; e) Cuts; f) Holes; g) Via bottom integrity; h) line neck down; and i) micro bump shape and bump shear strength performance. Inspection limitations impact yield assessment and quality validation on the substrate/ boards which will be used for integrated SiP packages. Inspection capability on fine line (<10um) and space (<10um) on the panel size substrates/ board impacts both yield and performance capability. Fine line and space requirements provide high density interconnects which supports the high I/O high bandwidth memory and other component integration of fine pitch memory, and other fine pitch devices. inemi started this project in Phase 1, Fine Pitch Circuit Pattern Inspection Metrology, which included an industry-wide survey to assess the measurement and inspection capability and readiness for fine circuit pattern substrates, was completed in February Detailed analysis on industry capability and key recommendations are available as the results of Phase 1. Page 1 of 5

2 The team decided to move to the next phase to conduct the inspection capability study on the fine pitch patterns which are less than 10um line space with various defects patterns based on the key recommendations from Phase 1. Purpose of Project This project is a continuation from Phase 1. The purpose of this project is to further characterize and quantify industry capability by conducting inspection capability study and analysis using test vehicles (TV) with line space features and defect patterns. Design and fabrication of glass test vehicle has been executed as the pre-work for Phase 2. Silicon test vehicle is fabricated as option for the further inspection capability limitation study. A defect pattern design with 7 different line widths is fabricated on wafer form to materialize the Test Vehicle. Defect patterns include: a) Line width violations; b) Spacing violations; c) Excess copper or missing copper; d) Short or open circuits; e) Cuts and other features. Line widths are designed with 10um, 8um, 6um, 4um, 3um, 2um, 1um. These line widths might be changed due to fabrication techniques. Scope of Work The goal of Phase 2 is to conduct the inspection capability limitation study by correlating the inspection results to the Test Vehicle design. Glass and silicon test vehicle (TV) are used for Phase 2, and plan to use the organic TV in Phase 3 (the laminate TV design will be determined based on results from the glass and silicon TV study). Design the defects patterns which are used for inspection capability study. Glass TV is fabricated with round shape (4-inch wafer size). This will be conducted as pre-work. Distribute glass TVs to metrology companies and users for evaluation. Create a Silicon TV in parallel to Glass TV inspection and evaluation (optional). Collect data and analyze the inspection data. Propose organic TV design (based on Glass TV and Silicon TV results) for Phase 3. NOTE: All changes to SOW must be approved by the Technical Committee for version control Page 2 of 5

3 IS / IS NOT Analysis This Project IS: Establish fine line / fine space (10 um 1 um) defect wiring / elements to examine industry inspection capability and future optimization for defect capture Evaluate defects at intermediate level (in build at glass or silicon based material) Provide the technology readiness and publish the guideline for the metrology for fine pattern circuit boards Create recommendation for the metrology This Project IS NOT: Develop new inspection and measuring equipment machine/systems Conduct the qualification efforts on specific metrologies at a specific company Develop a specific standard(s) Repeat prior or existing work Biased towards specific suppliers, geographies, or market segments Involve any devices/assembly process and not involve any reliability test Business Impact Provide benchmark result on current metrology and capability lamination. Learn the inspection capability on the various design (down to 1-2 um line space) and compare the inspection result to the design. Share technical data among the members and provide/understand the inspection/ metrology performances for the high bandwidth application substrates. Participating Organizations inemi member companies Industry as a whole Outcome of Project Inspection results are shared among the project members, which include the metrology options, technical gaps and technical plans on the metrology and inspection systems. Comparison and assessment of the inspection results, and recommendations are provided for the metrology option in selection. The analysis results will be used as key inputs for Phase 3 Test Vehicle Design. A summary report is available to all inemi members in reports from this project. Previous Related Work Existing literature publications and data will be reviewed and summarized as part of this project. There is no inemi project held related to this project objective. NOTE: All changes to SOW must be approved by the Technical Committee for version control Page 3 of 5

4 Prospective Participants OEMs, ODMs, EMS Measuring Equipment suppliers Substrate suppliers IC vendors Assembly houses Resources Required from Participants: The resources required are listed below. Potential participants and in-kind contributions are identified during the project formation. The detailed resource allocations will be managed in a separate table based on the project sign-up. Materials/Services Resources Remarks Design Defects Pattern Test Vehicle Fabrication Material Glass, Silicon Fabrication Measurement Line/Space Validation Measurement Study Need more than 3 sites Site Data Analysis Reporting Project Plan Schedule with Milestones Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Phase 2 Task 1 x x Task 2 x x x x x Task 3 x Task 4 x x Task 5 x x Task 6 x x x x x Task 7 x x x Task 8 x x Phase 2 Performing Inspection on Test Vehicles for Inspection Capability Study Task 1 Verify the dimensions of glass TV by SEM or other methods (2 months) Task 2 Inspection & Measurement of Glass Test Vehicles. (5 months) o Measure inspection accuracy and efficiency in terms of defect rate and inspection capability with fine lines and space designs NOTE: All changes to SOW must be approved by the Technical Committee for version control Page 4 of 5

5 o Investigate ground rules for fine wiring lines, vias and spaces that support microbump components (i.e., HBM, HMC, etc.) on laminate substrates and boards o Inspection study will be conducted by round robin Task 3 Review design rules for defects patterns for Silicon TV fabrication (1 month) Task 4 Silicon TV fabrication optional (2 months) Task 5 Verify the dimensions of Silicon TV by SEM or other methods (2 months) Task 6 - Inspection & Measurement of Silicon Test Vehicles (5 months) o Measure inspection accuracy and efficiency in terms of defect rate and inspection capability with fine lines and space designs o Investigate ground rules for fine wiring lines, vias and spaces that support microbump components on laminate substrates and boards o Inspection study will be conducted by round robin Task 7 Summarize and analyze the inspection data for both Glass TV and Silicon (3 months) Task 8 Propose recommendations and define plan for Phase 3 (2 months) Note: Tasks associated with Silicon TV to be confirmed, pending for fabrication resource confirmation. Project Monitoring Plans Ensure open lines of communication among participants: o Weekly or Bi-weekly conference calls o Meeting minutes provided through o Follow-up with individuals on an as-needed basis o Workshops and face-to-face meetings as appropriate Technical reviews (2) will be provided to update the Technical Committee. Progress reports will be provided upon request for presentation at regularly scheduled inemi meetings (e.g., at member council meetings). Track and document approximate man-months per quarter per team member (this will require the active members of the team to provide estimates). Track and document approximate number of people on the project per quarter (this can be tracked through inemi's Quick database). Project phase/summary report will be provided to inemi members, and the report will be published on the inemi website. General and Administrative Guidelines for this project and all other inemi Projects are documented at NOTE: All changes to SOW must be approved by the Technical Committee for version control Page 5 of 5