Lead Free A European Perspective for Hybrid and Component Materials

Transcription

1 Lead Free A European Perspective for Hybrid and Component Materials Marketing Forum IMAPS Long Beach, November 2004

2 Outline Lead and Cadmium in glasses A review of the European directives Equipment covered by the directives Allowed levels of considered substances A review of the key exemptions and their meaning The drivers for lead free materials Summary and future

3 Role of Glass Quote from Handbook of Thick Film Technology Holmes and Loasby Electrochemical Publications 1976 Page 100 Many different glass systems are employed as frits in thick film inks, but the most commonly used are based on bismuth or cadmium oxides or on lead borosilicates

4 Role of Glass CONDUCTORS Adhesion Protection of metal for leach or plating resistance DIELECTRICS Glass ceramic matrix Specialist electrical/mechanical properties Flux for ceramic fillers RESISTORS Non conductive phase Chemical interaction with conductive phase LEAD & CADMIUM Traditional and useful glass modifiers

5 Plated Capacitor Plated Ni layer Glass Ag metal Capacitor ceramic Electrode

6 The Directives WEEE (Waste Electrical and Electronic Equipment) Aims to increase the collection rates to 4-6kg of waste electrical and electronic equipment per EU citizen per year. Obligations begin on 13 August 2005 The producer pays RoHS (Restriction of Hazardous Substances) Requires substitution of lead and various other heavy metals and brominated flame retardants from 1 July ELV (End of Life Vehicles) Restriction of waste from vehicles. Recycling and re-use of components Requires no use of lead and other heavy metals after 1 July 2003

7 Equipment Covered WEEE and RoHS Large & small household appliances IT & telecommunications equipment Consumer equipment Lighting equipment Electrical & electronic tools Large stationary industrial tools exempted Toys leisure and sports equipment Medical devices Implanted and infected products exempted Monitoring & control instruments Automatic dispensers ELV Cars & vans Busses & trucks

8 Equipment not Covered WEEE & RoHS National security or military use Electricity is not the main power source Electronic products not needed to fulfil the primary function Batteries ELV Motorcycles and tricycles < I tonne unladen

9 Excluded Materials and Concentration Limits by Weight WEEE & RoHS 0.1% Pb, Hg, Hex Cr O.01% Cd 0.1 % PBB & PBDE flame retardants Concentration is per homogeneous material Homogenous Material Homogenous material means a material that cannot be mechanically disjointed into different materials

10 Homogenous Material THE PRINCIPAL OF THEORETICAL GRINDING Could grind a film off a substrate Could NOT separately grind within a ceramic WHOLE COMPONENT Can NOT take the Pb/Cd content as a % of the weight of the whole component

11 Key Exemptions as related to Thick film and Component Materials WEEE & RoHS Lead in electronic ceramic parts (e.g. piezoelectronic devices) Lead in glass of cathode ray tubes, electronic components and fluorescent tubes ELV Electrical components which contain lead in a glass or ceramics matrix compound Lead in solder in circuit boards and other applications REVISION The exemptions WILL be open to periodic revision

12 ELV - Car Production World, Western Europe & Germany Cars Millions World W.Europe Germany Year Source Freedonia 2002

13 ELV - Electronic Value per Car World, Western Europe & Germany USD World W.Europe Germany Year Source Freedonia 2002

14 Implications of ELV Interpretation (Courtesy of Tin Technology Ltd) The exemption for lead in 'solders for electronic circuit boards and other electric applications' for vehicles has been confirmed, permitting lead use for an unspecified time. This also implies that lead use in solders for non-electrical applications (e.g. radiators) is banned for products put on the market from July Lead in electrical components is also exempt for specific glasses and ceramics. Solders and components that continue to contain lead must be identified through specific labelling. They must also be dismantled and treated according to relevant regulations if the total per vehicle amounts to 60g Pb per vehicle or more. The Decision also specifies a limit for lead; maximum concentration up to 0.1wt% per homogeneous material, if not intentionally introduced.

15 Extract from ELV

16 ELV - Other Considerations in Vehicles Change Drivers and Limiters PRODUCT CYCLE Development 3 years Production 7 to 8 years Spares Continuity 10 to 15 years Requalification costs mean Pb free is only being introduced on new components and applications Last Pb containing car 2015, first~2009 RELIABILITY Operating temperatures up to 150C Introduction of Pb free solder joints for cycling behaviour >130C Ceramics technology proves itself at T>120C Pb CONTENT Weight above 60g Pb must be removed before the recycling process Labelling

17 RoHS - Labelling STANDARDS There is no direct marking requirement from the RoHS Directive JEDEC Standard JESD97 (May 2004) IPC-1066 June 2004 (Now an IEC proposal for world wide standardisation) JEITA ETR 7021 (June 2004) (Japan) BASIC PROPOSAL Level 1 Contains Pb but Pb free processable Level 2 Lead free solder systems and terminations Level 3 No Pb in any system apart from RoHS exemptions Level 4 Completely Pb free

18 Labelling Examples Lead-free phases JEITA So ld e rte c IPC / NEMI / JEDEC Phase 1 Phase 2 Phase 3A Phase 3 Phase 1 Phase 2 Phase 3 --> Phase 3A Phase 4 --> Phase 3 2nd level interconnect Solder symbol (e0,) e1, e2... Classification of the labelling for objects Material SnAgCu --> A30C5 SnZnBi --> Z80B30 It displays at the main unit and the wrapping material. Board none none halofen-free/solder reflow-wavehand/coating Component Phase 1 --> Solder symbol (e0,) e1, Phase 2 e2... Phase 2 --> 2nd level interconnect label or barcode Phase 3A --> Assembled board Phase 3 --> Phase 3A Phase 3 Solder Symbol: A3C.5, Z8B3 Solder symbol e0, e1, e2... (totally) Pb-free identification label Pb-free symbol

19 Pressures AUTOMOTIVE ELV exemptions can be revised Labelling 60g Pb Content per Vehicle Reliability ELECTRICAL & ELECTRONIC EQUIPMENT RoHS exemptions can be revised Labelling The market Reliability

20 Progressive Lead free gives Higher Reliability Adhesion in Lbs Pt/Ag Conductors Aged C with Sn62 and Sn96.5 Solders Initial 48 Hrs 144Hrs 250 Hrs 500 Hrs 1000 Hrs Aged at 150 C Pt/Ag Lead free Storage at C Conductors C4727 C4727 C4729 C4729 Pt/Ag Pt/Ag Pt/Ag Pt/Ag Sn62 Sn96.5 Sn62 Sn96.5

21 Summary & Future Pb/Cd free thick film and component materials allow full labelling (market) or non-labelling (ELV) Pb/Cd free thick film and component materials future proof process against revision of the exemptions Pb free thick film and component materials take away one of the adders to the 60g limit/vehicle Pb free thick film combined with Pb free solders can increase product reliability, especially at operating temperatures > 130C Pb Free thick film and component materials are a key future direction of the European requirement

22 With Thanks KAY NIMMO Manager Environmental Affairs, Tin Technology Ltd, UK PETER BOKALO R&D Manager, Heraeus Inc, Circuit Materials Division, USA DR PETRIK LANGE Hella KG, Advanced Development Technologies, Germany

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