KEMET Portfolio. Hi CV. Low CV. Capacitance. Ta MnO MLCC 0.1. Application Frequency. pf nf μf DC Hz KHz MHz GHz 1.E

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1 Ceramic SMD

2 Market Overview

3 KEMET Portfolio Capacitance pf nf μf 1.E E E E E E E E E+01 Ta MnO 2 KO MLCC AO Hi CV Low CV 1 1.E E-01 DC Hz KHz MHz GHz Application Frequency

4 Ceramic Market Projection TAM MARKET GROWTH ASP Pcs. KEMET %MS Specialty $900 Million 7% $ Million 2.6% HI CV MLCC $2.21 Billion 8% $ Billion 3.3% LO CV MLCC $2.75 Billion 4% $ ,131 Billion 4.9% Total $5.86 Billion $ ,345 Billion 3.9%

5 Ceramic Consumption by End-Market Defense/ Aerospace 6% Medical 1% Network Infrastructure 5% Consumer Electronics 20% Industrial 9% Automotive 15% Handsets 20% Computers 24% Ceramic Capacitors (MLCC) $5.8 Bn

6 Ceramic SMD FY08 YTD Shipments Region Market Segment Military 1% Industrial 7% Europe 21% Americas 36% Disty 46% Subcon 19% Asia 43% Auto 15% Telecom 5% Consumer 1% PC 6%

7 Ceramic SMD Distribution Shipments Distribution POS Military 1% Industrial 7% Subcon 14% Telecom 25% Disty 6% Auto 2% Disty 46% Subcon 19% Military 15% Industrial 15% PC 21% PC Auto 15% Telecom 5% Consum 1% Medical 2%

8 Process

9 Inside a Ceramic SMD Electrode Plates Dielectric

10 Ceramic SMD Cross-Section Human Hair

11 Petit Fours or =

12 MLCC Process Flow How to make a (400) Layer Cake into Petit-Fours Cake Mix Ceramic Oxide Powders Icing Electrode Inks More Icing Termination Paste Mix Mill Form Ceramic Sheet Print Electrodes Stack Up Pad Laminate Petit- Fours Dice Pad Oven Thermal Processing Terminate Electroplate Ni & Tin Termination Fire Package (Reel) Test Encapsulate Assemble Leads

13 Printing & Lamination Process Lamination Ceramic Only! Transfer Ceramic Application Carrier Film Electrode Patterns

14 Ceramic Chip Capacitors Additional Processing Steps Bakeout & Firing Removes the organic materials Corner Rounding Chips are processed with abrasive to round off sharp corners and edges Terminating Chips are dipped into fritted metal solution to form end metallizations, and then fired again Plating Chips are plated with nickel as a barrier layer and a solderable surface. Tin is then plated over the nickel to protect it from oxidation. Testing Chips go through a battery of tests, including 100% inspection for voltage exposure/insulation resistance, capacitance, and dissipation factor

15 Products

16 EIA Designation (Class I) Significant Figure of Temperature Coefficient Multiplier added to Temperature Coefficient Tolerance of Temperature Coefficient PPM/ C Symbol Multiplier Symbol PPM/ C Symbol 0.0 C -1 0 ± 30 G 0.3 B ± 60 H 0.9 A ± 120 J 1.0 M -1,000 3 ± 250 K 1.5 P -10,000 4 ± 500 L 2.2 R +1 5 ± 1000 M 3.3 S ± 2500 N 4.7 T U +1, ,000 9 Note: Old name for C0G is NP0

17 EIA Designation (Class II and III) Low Temperature High Temperature Maximum Capacitance Change C Symbol C Symbol C Symbol 10 Z 45 2 ±1.0% A -30 Y 65 4 ±1.5% B -55 X 85 5 ±2.2% C ±3.3% D ±4.7% E ±7.5% F ±10.0% P ±15.0% R ± 22.0% S +22%,-33% T +22%,-56% U +22%,-82% V

18 K Magnitude Temperature Effects Y5V Z5U Y5V can t take the heat! X5R X7R starts to sweat! X7R NP0/C0G Temperature ( C) C0G stays cool in the heat!

19 MLCC Case Size Trend Graph (EIA) 50% MLCC Case Size Trend 40% 0402 Constituent 30% 20% % %

20 Technology / Demand Drivers Advances in Electronics Long-term trend toward smaller, faster & less expensive Growth of high frequency applications with faster microprocessors Higher voltage and harsher environments, i.e. automotive Trend toward low voltage applications, i.e. portable devices Creates New Demands on Capacitors Increased functionality Higher frequency response Lower resistance and impedance Tolerance of high voltage and harsh environments

21 Ceramic Technology Focus Go from a Fast Follower to a Market Leader! Expand within existing product portfolio Offer 1 st to market values (capacitance/voltage) Broaden our overall product portfolio Offer our customers more products Organic Development (Innovation Center) Strategic Alliance Partnerships (Taiyo Yuden)

22 Ceramic SMD Portfolio

23 The ABCs of Ceramic SMDs C0805C103K5RAC C0805C103K5RACAUTO C0805F103K5RAC C0805Y103K5RAC C0805C103KARAC C0805L103K5RAC C0805S103K5RAC C0805X103K5RAC What the heck do all those letters mean anyway?

24 The ABCs of Ceramic SMDs C0805C103K5RAC Plain old vanilla, but as good as ever! Commercial grade C0805L103K5RAC Still vanilla, but thinner! Low profile; meets EIA requirement of <0.95mm C0805C103K5RACAUTO Vanilla with some sprinkles! Automotive grade AEC-Q200 Qualifications PPAPs / Change Control More Stringent Test Plans C0805C103KARAC Still vanilla, but with kick (higher voltage)! High voltage means 250V Up to 3000V available

25 The ABCs of Ceramic SMDs ** Flex Crack Mitigation ** Technology Target Values Example C0805S103K5RAC Floating Electrode C0805Y103K5RAC Floating + Flexible Low to Mid Capacitance Low to Mid Capacitance C0805F103K5RAC Open Mode Mid Capacitance C0805X103K5RAC Flexible Termination High Capacitance