Dow Corning Protective Solutions Sample Kit. Distributor Training

Transcription

1 Dow Corning Protective Solutions Sample Kit Distributor Training

2 Agenda Market Overview Dow Corning Protective Solutions Sample Kit Dow Corning EE-3200 Low Stress Silicone Encapsulant Product Description and Positioning Advantages vs. Competing Materials Technical Content Product Attributes Proven Performance 2

3 Market Overview Energy Conversion Market Trends: Focus on overall cost reduction, as well as reliability and miniaturization More durable and heat resistant materials needed to enable change 3

4 Dow Corning Protective Solutions Sample Kit 4

5 Dow Corning Protective Solutions Products (Adhesives) Dow Corning 3165 Fast Track RTV Adhesive Sealant Dow Corning 7091 Adhesive Sealant Dow Corning 748 Non-Corrosive Sealant Dow Corning Thixotropic Adhesive Products (Conformal Coatings) Dow Corning Conformal Coating Dow Corning Conformal Coating Viscosity (cps) Hardness Cure System Cure Temp. Tack Free Time (min) UL 94 Thixotropic Type A 35 Moisture 25ºC 5 V-0 Thixotropic Type A 32 Moisture 25ºC 28 HB Thixotropic Type A 35 Moisture 25ºC 45 HB Thixotropic Type A 60 Viscosity (cps) Hardness Addition Cure Cure Temp. 125ºC 60 (full cure) Tack Free Time (min) Not Listed UL Type A 34 25ºC 8 V Type A 80 25ºC 7 V-0 5

6 Dow Corning Protective Solutions Products (Encapsulants) Viscosity (cps) Hardness Thermal Conduct. RT Cure (hrs) UL 94 Specific Gravity Dow Corning EE-1010 Low Viscosity Encapsulant 840 Type A W/mK 24 Not Listed 1.25 Dow Corning EE-3200 Low Stress Silicone Encapsulant 1700 Type W/mK 3 V Sylgard 170 Silicone Elastomer 2140 Type A W/mK 24 V Dow Corning CN-8760 G Encapsulant 3200 Type A W/mK 24 V Products (Thermal Management) Viscosity (cps) Thermal Conductivity Hardness Cure Temp. Cure Time (min) UL 94 Dow Corning TC-4025 Dispensable Thermal Pad 70, W/mK Type ºC 10 V-0 Dow Corning TC-2035 Adhesive 130, W/mK Type A ºC 30 Not Listed 6

7 Dow Corning Protective Solutions Sample Kit Potting Compounds Conformal Coatings Adhesive/ Sealants Thermal Management Hardness EE-3200 CN-8760G EE-1010 Fill Time EE-1010 EE-3200 CN-8760G Low Handling Time EE-3200 CN-8760G EE-1010 Thermal Cond. EE-1010 EE-3200 CN-8760G Hardness Soft Repairable Elongation/ Cure Type Heat Curable Dow Corning TC-5622 Thermally Conductive Compound Dow Corning TC-5351 Gap Filler Compound Dow Corning TC-4025 Dispensable Thermal Pad High Hard Resinous Room Temp Cure Dow Corning TC-2035 Adhesive All products listed are Dow Corning products, as listed on the previous slides. 7

8 Dow Corning EE-1010 Low Viscosity Encapsulant Description Dow Corning EE-1010 Encapsulant is a two-part electronics encapsulant with 1:1 mix ratio, extended working time, low viscosity, moderate thermal conductivity and high hardness compared to other electronics encapsulants. This encapsulant is suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface and break without requiring a vacuum de-airing step. Applications: General potting applications, power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs and relays Features Low viscosity and long working time Benefits In complex geometries, low viscosity enhances flow and fill in narrow spaces, and long working time enables air displacement Room temperature cure or accelerated heat cure Versatile cure processing controlled by temperature High hardness/durometer compared to other electronics encapsulants Moderate thermal conductivity More rigid protection cover may not be needed Adequate heat dissipation for a variety of applications 8

9 DOW CORNING EE-3200 LOW STRESS ENCAPSULANT 9

10 Dow Corning EE-3200 Low Stress Silicone Encapsulant Description Dow Corning EE-3200 Low Stress Encapsulant is a bridge material between the gel and encapsulant product families; it is soft and stress relieving like a gel, yet thermally conductive like an encapsulant. Features Low modulus Low viscosity Thermal conductivity Fast cure, sufficient working time Soft tacky adhesion UL94 V-0, RTI 150 Di-electric strength, volume resistivity Long shelf life Minimal filler settling Benefits Reduces pressure on components Reduction of voids, high throughput Sufficient heat dissipation High throughput Durability, no delamination in LTR Meets certification requirements Reduce cost, no additional dielectric barrier 18 months, 12 months upon receipt Easy MFG, minimal re-homogenization 10

11 Dow Corning EE-3200 Encapsulant Positioning Statement Proven reliability: Softer material results in less pressure within electronics modules, which prevents breakdown of electronic components due to thermal expansion, thereby improving overall reliability Lower viscosity allows for faster filling of modules, while reducing issues caused by bubbles and air pockets during application Good mechanical adhesion avoids delamination issues Manufacturability: Fast cure and optimized working time helps customers design more complex and lower cost modules Ease of use low viscosity allows fast fill and fit with high throughput manufacturing processes Minimal filler settling allows for ease of process control Room temperature cure and no pre-heating allows for lower capital costs, as a need for ovens is eliminated The combination of proven reliability and improved manufacturability provided by Dow Corning EE-3200 Encapsulant ultimately reduces the total cost of ownership for our customers. 11

12 Dow Corning EE-3200 Encapsulant Product: Dow Corning EE-3200 Low Stress Silicone Encapsulant Manufacturing site: Lead time: Shelf life: Sales territory: Package: Songjiang, China 15 working days 18 months (12 months upon receipt) Global 0.5 kg cans, 25 kg pails, 225 kg drums Product strategy: Promote along with a broad family of materials to be positioned as electronic protection materials for energy conversion (inverters) and lamp and luminaire assembly applications 12

13 Pricing: Dow Corning EE-3200 Encapsulant Special pricing only: Contact your Dow Corning channel developer for special pricing information 13

14 Promotional Tools: Dow Corning EE-3200 Encapsulant Tactic Where? Dow Corning EE-3200 Encapsulant press release Media Technical datasheet dowcorning.com, IST, Premier Solutions for Solar Electronics brochure dowcorning.com, IST, Premier Technical presentation IST, Premier Website landing page dowcorning.com Sample kits To be distributed globally 14

15 Dow Corning EE-3200 Encapsulant vs. Polyurethanes Less stress on PCB components Low viscosity allows for faster fill without need for preheating Fast cure (room temperature and heat accelerated) Optimal working time Sufficient adhesion (mechanical) UL-rated at high temperature Optimal thermal properties No glass transition within the operating temperature range of the inverter 15

16 Dow Corning EE-3200 Encapsulant vs. Other Silicone Encapsulants Softer material translates to lower stress Faster cure at room temperature Minimal filler settling Mechanical adhesion due to softness Long shelf life Optimal working time Low viscosity allows for fast fill and less voids Optimized thermal properties 16

17 TECHNICAL CONTENT 17

18 Product Attributes Encapsulant Comparison Dow Corning EE-3200 Low Stress Silicone Encapsulant is a new product in the Encapsulants product family. Here is how it stacks up against historical products: Products (Encapsulants) Dow Corning EE-1010 Low Viscosity Encapsulant Dow Corning EE-3200 Low Stress Silicone Encapsulant Sylgard 170 Silicone Elastomer Dow Corning CN-8760 G Encapsulant Sylgard 160 Silicone Elastomer Viscosity (cps) Hardness Thermal Conductivity (W/mK) RT Cure (hrs) 840 Type A Type UL 94 Not Listed Specific Gravity V Type A V Type A V Type A V

19 Product Attributes Thermally Induced Stress In a closed system, the pressure generated from the encapsulant due to its coefficient of thermal expansion (CTE) can cause damage to the device it is trying to protect. Dow Corning EE-3200 Encapsulant is designed to reduce this pressure and improve overall reliability. Dow Corning EE-3200 Encapsulant modulus = 12 PSI P, PSI =ƒ (Modulus, CTE, Poisson s ratio) Wevo 552 FL modulus = 1880 PSI 19

20 Product Attributes Thermally Induced Stress Using a controlled test environment, pictured to the right, Dow Corning EE-3200 Encapsulant was shown to reduce the stress generated during thermal cycling from 25 C to 80 C by 60-70% compared to a typical polyurethane electronics encapsulant As urethane suppliers reduce the hardness to effectively reduce the thermal stress generated, they typically cannot maintain adequate UL Recognitions Thermal Stress Test Fixture : Pressure transducer 302: Flat membrane 303: Cylindrical container 304: Oil bath 305: Connecting cable 306: Display

21 Product Attributes Cure Profile Dow Corning EE-3200 Encapsulant is a two-part addition cure silicone offering a variety of cure profiles The cure profile was specifically designed for high throughput balancing this with adequate working time for robust potting Working time (25 C) = 30 min Gel time (22 C) = 50 min Gel time (50 C) = 6 min Full cure is achieved in just 20 minutes at 50 C and less than three hours at 25 C 21

22 Product Attributes Water Absorption Typically in electronic applications, 1% water absorption can cause component failures. Dow Corning EE-3200 Encapsulant absorbs very little water compared to its organic competition. 22

23 Product Attributes Wet Out and Surface Energy Aluminum, Q-panel, mil finish ANSI FR4 Polyphenylene Ether (PPE) Angles: (24.00 ) Angles: (23.10 ) Angles: (25.10 ) Contact angle less than 90 indicates lower surface energy than the substrate and acceptable wet out Dow Corning EE-3200 Encapsulant wets out common substrates due to its low surface energy 23

24 Product Attributes Shelf Life Gel time test implemented after production batches were made Rheology, cured hardness and cure speed are stable under room temperature storage conditions Shelf life set at 18 months Storage: Recommended storage in a dry location at room temperature In humid environments the containers should be purged with dry air or nitrogen after the container is opened 24

25 Proven Performance Adhesion Reliability Surface Treatment Details Primer applied via spray coat Plasma applied via Enercon Dynamite IT 480W Atmospheric Air Plasma Unit 25

26 Proven Performance Adhesion Reliability Adhesion strength is maintained or improved on aluminum over time in both thermal cycle (TC) and damp heat (DH) aging conditions Adhesion strength is stable on FR-4 over time in both thermal cycle (TC) and damp heat (DH) aging conditions If deemed necessary, plasma or primer (Dow Corning Primer) can be used to improve adhesion strength Use of primers and plasma shift the failure mode from adhesive to cohesive failure 26

27 Proven Performance Mechanical Reliability Mechanical properties are stable over 1500 hrs of dry heat and damp heat accelerated aging. Stability leads to reliable mechanical performance in the end application. Tensile strength reported at ultimate elongation 27

28 Proven Performance Mechanical Reliability Young s modulus reported as the slope of stress strain curve in the linear elastic region near the origin. 28

29 Proven Performance Simulated Device Test Test Method: IPC-TM (40 V bias) Conditions: 85% RH/85 C Comb pattern PCB s dip coated into silicone and cured at room temperature Dow Corning EE-3200 Low Stress Silicone Encapsulant delivers reliable PCB protection; the tacky mechanical adhesion provides equivalent protection from moisture as Dow Corning Conformal Coating, which develops a strong chemical bond with the PCB Standard high modulus silicone elastomers do not offer the same PCB protection 29

30 Proven Performance Simulated Device Test Dow Corning Multi- Purpose Test Board 30

31 Proven Performance Device Evaluation Samples: 150 W power inverter (pictures shown) 30 inverters primed with Dow Corning Primer and potted with Dow Corning EE-3200 Encapsulant 30 inverters potted with Dow Corning EE-3200 Encapsulant 31

32 Proven Performance Device Evaluation Sample Preparation: Fan removed and jumped Inverters cleaned to IPC standard for ionic contamination (< 5 ug/in 2 ) Primer applied via spray coat (if necessary) Pottant de-aired, mixed, and poured into plastic enclosure holding the PCBA Samples cured at room temperature Test Conditions: Materials applied by Specialized Coating Services per IPC handbooks IPC-HDBK-830 and IPC-HDBK-850 Inverters continuously powered at 14V and 0.18A, chamber set to 65 C* and 85% RH *Maximum operating temperature of the test device 32

33 Proven Performance Device Evaluation Results after 3,000 hrs of exposure to 65 C and 85% RH show very low failure rates in both primed and unprimed devices Device level evaluation confirms the simulated device testing and validates the soft tacky encapsulant protects the device from moisture in a relevant live-component assembly Dow Corning EE-3200 Encapsulant reliably protects the electronic device from moisture Test Results No FA completed on failed devices to determine root cause of failure PTMCL test not run due to lack of bandwidth and performance in pressure test 33

34 Proven Performance Device Evaluation Failure Details Dow Corning EE-3200 Encapsulant Number of Failures Cumulative Failure Failure Type Time (hrs) 2 of 30* 0% Infant mortality 0 1 of 28 4% Overcurrent (closed) of 28 7% Overcurrent (closed) of 28 11% Overcurrent (closed) of 28 11% No FA completed on failed devices to determine root cause of failure PTMCL test not run due to lack of bandwidth and performance in pressure test 34

35 Proven Performance Device Evaluation Failure Details Dow Corning EE-3200 Encapsulant with Dow Corning Primer Number of Failures Cumulative Failure Failure Type Time (hrs) 5 of 30* 0% Infant mortality 0 1 of 25 4% Overcurrent (closed) of 25 4% No FA completed on failed devices to determine root cause of failure PTMCL test not run due to lack of bandwidth and performance in pressure test 35

36 Material Application Homogenization All thermally conductive encapsulants settle, it s just a matter of how quickly according to Stoke s Law Dow Corning EE-3200 Encapsulant is a premium encapsulant engineered specifically to reduce filler settling and is quickly homogenized; to regain pail or drum homogeneity a simple drum tumbling or pail agitating process can be used Drum Tumbler Fresh 3 months 6 months 12 months Homogeneous Polymer separation Soft filler cake, consistency of peanut butter 36

37 Material Application Homogenization Time Material Recommended Remixing Solution* 3 months 20L Part A/B Pail agitating, 250 rpm, 10 min 3-6 months 20L Part A Pail agitating, 250 rpm, 10 min 20L Part B Pail agitating, 250 rpm, 20 min 6-12 months 20L Part A Pail agitating, 250 rpm, 20 min 20L Part B Pail agitating, 250 rpm, 30 min 0-12 months 200L Part A/B Drum tumbling, 30 rpm, 25 min *If your application can tolerate changes in thermal conductivity, hardness and viscosity, this step can be avoided and replaced by a purge of the silicone fluid layer. 37

38 Material Application Homogenization 38

39 Material Application Potting Configuration To properly dispense Dow Corning EE-3200 Encapsulant, meter mix dispense equipment is required for continuous high throughput processing The basics of the system are shown on the next slide; several dispense vendors offer this type of equipment using robust positive displacement pump technology MMD Equipment Suppliers: Bdtronic (formerly BarTec) GRACO Nordson Sealant Equipment EXACT Dispensing Rampf Scheugenpflug 39

40 Material Application Potting Configuration Dispensed Pottant Transfer Pump Vacuum Pump Liquid Level Sensor Dispensing System Static Mixer Part A Part B Agitator Valve Transfer Pipe Other potting configurations are appropriate. Dow Corning AETS representatives can help you design the right process for your application. 40

41 Material Application Potting Considerations To achieve good reliability the electronic device must be filled void free; this is achieved through Dow Corning EE-3200 Encapsulant s low viscosity, sufficient working time and a properly designed potting process and configuration In the micro-inverter and power optimizer application, the PCB is placed inside a sealed enclosure prior to potting; when the clearance between the components and the enclosure is less than 3 mm, vertical dispensing is recommend to achieve void-free fill 41

42 Material Application Potting Considerations Gap Dimension Flat Dispensing Vertical Dispensing 1 mm 40% filling 100% filling 2 mm 65% filling 100% filling 3 mm 99% filling 100% filling Flat Dispensing Vertical Dispensing Each application is different and presents its own challenges. Dow Corning AETS representatives can help you design the right process for your application. 42

43 Troubleshooting Potential Issue Impact Mitigation Poor fill quality Cure inhibition Improper static mixer selection Poor performance in reliability tests Customer perception is that uncured material will cause performance issues. The truth is that this is only the case if the uncured pottant migrates. All customer tests to date have shown no migration or decreased performance. Hardness variation across the potted device Potting configuration and device design need to be optimized. Consider vertical dispensing if voids are present between the PCB and the enclosure. If voids are being trapped by components, consider changes in potting orientation, vacuum potting and/or vibration prior to cure. Fully pot the device and tear down the unit after full cure of the encapsulant. Examine each component for wetness to determine cure compatibility with each component. Change the static mixer; 48 element standard gel static mixer has been verified in the lab. 43

44 Troubleshooting Potential Issue Impact Mitigation No remixing No degassing No agitation Loss of filler-rich material in the drum (lower yield per drum) Non-homogenous filler in the drum leading to changes in thermal conductivity of the potted silicone in each device Change in the properties of the cured encapsulant Entrapped air in the silicone could be dispensed into the device and create a void if the bubble does not escape. Voids lead to decreased reliability, especially in damp heat environments. If the equipment is idled for more than one week, filler fallout is expected. This leads to dispensed material with uneven filler content and different thermal conductivity. Remix the drum before loading the dispense equipment with a drum tumbler or similar equipment. Add vacuum degassing capabilities to the dispense equipment. Agitate the dispense tanks whenever material is in the tank. 44

45 Summary Thank you! 45

46 The information contained in this communication does not constitute an offer, does not give rise to binding obligations, and is subject to change without notice to you. The creation of binding obligations will occur only if an agreement is signed by authorized representatives of Dow Corning and your company. Any reference to competitor materials contained in this communication is not an endorsement of those materials by Dow Corning or an endorsement by the competitor of Dow Corning materials. To the fullest extent permitted by applicable law, Dow Corning disclaims any and all liability with respect to your use or reliance upon the information. DOW CORNING DOES NOT MAKE ANY WARRANTY OR REPRESENTATION, EXPRESS OR IMPLIED, WITH RESPECT TO THE UTILITY OR COMPLETENESS OF THE INFORMATION AND DISCLAIMS THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. DOW CORNING DISCLAIMS LIABILITY FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES. 46