Manufacturing Strategy & Technology Roundtable
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1 Manufacturing Strategy & Technology Roundtable Kevin Ritchie Senior Vice President, Technology and Manufacturing Group
2
3 Strategy Delivers Results Benefits continue to be demonstrated Lower, more stable capital expenditures versus history Flexible internal/external advanced logic capacity Upturn: no supply shortage Downturn: steady internal loadings Consistently high advanced-logic asset utilization across full cycle Maintaining technology leadership 90nm capacity aligned with demand Five 300mm fabs, two 200mm fabs qualified 65nm qualification completed and production started Assembly & test bottlenecks in 4Q Increased surge capacity Additional in-house versus subcontractor assembly Laid foundation for future Phased build-out of DMOS6 continued RFAB facility extends options and flexibility
4 Foundries Enhance Manufacturing Responsiveness 130nm/90nm Wafers Foundries TI Advanced Logic Fabs 1Q03 2Q03 3Q03 4Q03 1Q04 2Q04 3Q04 4Q04 1Q05 2Q05 3Q05 4Q05 1Q06 TI advanced logic factories remain highly utilized throughout cycle Goal is to maintain high utilization of most expensive assets Advanced logic fabs account for >40% of TI depreciation in 2005
5 130nm: Successful Ramp Complete Volume Moving to 90nm nm Shipments (Cumulative) 1000 >1 billion shipped 800 Mu mm 2 0 3Q03 4Q03 1Q04 2Q04 3Q04 4Q04 1Q05 2Q05 3Q05 4Q05 1Q06 Internal production ramps completed (KFAB, DMOS5 & DMOS6) Ramps completed with 3 foundries Assured supply from 7 wafer fabs (four 300mm & three 200mm)
6 90nm: Growth Engine in nm Shipments (Cumulative) MCU ASIC DSP Megacell Mu 100 8Mb SRAM mm 2 Stable, mature yields 0 3Q03 4Q03 1Q04 2Q04 3Q04 4Q04 1Q05 2Q05 3Q05 4Q05 1Q06 Broad deployment: five 300mm, two 200mm fabs qualified; additional 300mm fab to qualify Accelerated unit growth continues through 2006
7 65nm: Ramping to Production 50 65nm Shipments (Cumulative) 40 1 million units 2H06 Ku mm Q03 4Q03 1Q04 2Q04 3Q04 4Q04 1Q05 2Q05 3Q05 4Q05 1Q06 KFAB and one foundry qualified Plans for 7 fabs (six 300mm fabs and one 200mm fab) Early technology access for wireless customers
8 90nm & 65nm Yield Ramps Defect Density Trends (Driver Products) 130nm 90nm Rapid Learning Cycle Defect Density 65nm Rapid Learning Cycle 18 Months Ahead Month from Intro (At Probe)
9 45nm: Technology Development Status: Process equipment in place Test chips being processed Fully integrated with DMOS6 for rapid manufacturing transition Schedule for production is 2 years after 65nm SRAM Cell Technology implementation approach: Immersion lithography for 2x density improvement over 65nm Gate length as short as 28nm, minimum metal pitch of 130nm Extensive use of strain engineering for performance More structured design rules for design and manufacturability optimization Power reduction through intrinsic materials and process development, as well as integration closely aligned with lead DSP architectures 0.24 um 2 39nm 86nm Gate Profile
10 Mixed-Signal Products Extend Productive Life of Manufacturing Assets Process: Die size: Year: Wafer size: Die per wafer: 800 nm 29.0 mm mm nm 14.4 mm mm nm 10.7 mm mm nm 7.0 mm mm nm 5.7 mm mm nm 4.0 mm mm 5750 Mixed-signal lithography follows in digital process footsteps Smaller chip, lower cost, increased functionality 200 mm wafer production in DMOS5, MIHO, FFAB
11 Analog Manufacturing Strategy Extending Asset Life/Smart Buys Ku mm Analog Capacity (Wafer starts/quarter) 1Q03 1Q04 1Q05 1Q06 TI fab life cycle Advanced logic (CMOS) Mature logic Advanced analog Mature, long-life analog DMOS5 conversion to advanced analog adds analog capacity, increases flexibility Strategic purchase of used tools steps up 200mm capacity Agere equipment purchase 2H05 Increase capacity for high-demand processes
12 2006 Capital Expenditures $1.3B plan (unchanged) 65nm production ramp (300mm in DMOS6) 45nm development Assembly & test capacity to support revenue growth 200mm analog growth
13 Summary Manufacturing strategy works Responsive Lower, more stable capital expenditures Consistently high advanced-logic asset utilization across full cycle Extended asset life Higher, more stable profitability Maintain responsive manufacturing structure to support customer demand and improve ROIC 65nm ahead of competition, advantages TI customers
14 RFAB Richardson Fab Paul Westbrook Sustainable Development Manager TI Worldwide Construction
15 New 300mm Richardson Fab (RFAB) Facility 1.1 million square feet on 92 acres 220,000 square feet of cleanroom space (Class 100) Process 30,000-35,000 wafers/month, when fully equipped Population of ~1000 employees when fully staffed LEED recognition (Leadership in Energy and Environmental Design) Construction Timeline Jan 2004 capital authorized Nov 2004 construction began Apr 2006 cleanroom sealed Financial Construction budget of ~$300M (30% less per square foot than DMOS6)
16 Sustainable Development The Balance of People, Profit, and the Planet Site Mass transit access Bicycle parking/showers Urban heat island reduction Water Efficiency Native plants and rain water collection pond Extensive process water reuse Waterless urinals Energy Efficiency Dual temp split chiller plant Heat recovery eliminating boilers Solar water heating Materials and Resources Use recycled materials Recycled >90% construction waste
17 Integrated Design Payback Example: Light Fixture Selection Standard cost = $125 op cost = $40/yr Simple payback = 16.7 years Ergolight cost = $375 op cost = $25/yr However, we need 30% fewer Ergolight fixtures. Simple payback down to 6.7 years. Efficient lighting also saves cooling energy. Simple payback down to 6.0 years. Office Equipment 18% Water Heating 5% Heating 6% Add the contribution from dozens of similar projects (lighting, reflective roof, light shelves, sun shades, quality windows, extra insulation, vacuum pumps, ) Enough cooling load disappears to avoid buying a $1M chiller... and the cooling tower, pumps, pipes, and even the space needed to install it. Simple payback is now 0.0 years. The total net capital cost is the same, or even less, and the operating costs are lowered forever. Misc 5% Cooling Ventilation 24% Typical Texas Office Building Cooling Load Walls 11% Windows 12% Lighting 42% Roof 7% Ventilation 14% Typical Texas Office Building Electricity Usage Vent-Latent 6% People 3% People-Latent 4% PC Equipment 14% Lighting 29%
18 Summary 30% facility cost/ft 2 reduction versus DMOS6 Sustainable design and cost reduction are complementary <1% of the project cost in sustainable-related items (~$1.5M) >$4.0M per year operating savings at full build-out 20% energy reduction 35% water use reduction 50% emissions reduction
19 RFAB Tour CUP Support Fab Admin >$4.0M per year operating savings at full build-out 20% energy reduction 35% water use reduction 50% emissions reduction
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