ALT of Lead Free CCAs

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1 ALT of Lead Free CCAs

2 OPS Value Propositions Ops A La Carte is a Professional Reliability Engineering firm focused on providing confidence in reliability. Flexible method of engagement from end to end reliability solutions to specific targeted reliability services. Services include reliability assessment, consultation, testing, and training at our own HALT and HASS Labs Successfully helped customers improve the reliability on over 500 different products in over 100 industries worlwide

3 Problem Statement The advantageous of lead free solder from a health and safety perspective are well understood, but there needs to be a closer look at the reliability of lead free and how it compares to existing solder based manufacturing. In fact, still unknown is the impact of lead free solder on circuit assembly life.

4 Presentation Objectives Provide background on the impact of lead free versus conventional solder on the life of a circuit card assembly (CCAs) Illustrate through comparison of results of a Highly Accelerated Life Test (HALT) on two of the same CCAs, but four (4) lead free and four using conventional solder Demonstrate how a MTBF comparison can be achieved by Accelerated Life Test (ALT) planning for two similarly populated CCAs: lead free versus conventional solder

5 Lead Free Performance- Mechanical Vibration Pb-Free (SAC) alloys are stiffer. Resistance to shock and vibration has to be better and fully understood. A reasonable amount of data on shock exists due to requirement for handheld portable products, but this data does not necessarily cover all shock requirements for higher reliability products. Vibration data remains somewhat limited as vibration is generally not a major concern for telecom/server products. Recent consortium work has begun to generate more data on these topics specific to military/aerospace requirements.

6 Relative Cycle Life Performance of SnAgCu vs SnPb For lower surface strain rates, SnAgCu > SnPb As surface strain is increased SnPb > SnAgCu for cycle life Data courtesy of DfR Solutions PWB surface strain 3.0E E E E E E-04 SnPb SnAgCu 0.0E+00 1, ,000 10,000,000 Cycles to Failure

7 Lead Free Performance- Thermal Cycling Most testing has been above 0 C up to a max of 120 C Thermal cycles applied to both SAC 305 and SAC 105 (low silver alloys) 1 When lead was introduced for SAC 305 and 105 (SACPb), failures occurred at lower number of cycles Research in thermal shock (eg. -55 C to 120 C, 70 min dwell) is limited for Pb free Major gap in strain at the solder joint where there is a comparison of Pb vs Pb-free Other gaps exist for Pb vs Pb-free Improved cycle life for SAC that is Pb-free

8 (-55 C to 120 C, 70 min cycle times)

9 Pb-Free HALT Comparison 10 Products went through A-B Comparison of Lead vs. Pb- Free at HALT & HASS Labs In all cases, both solder and components were changed to Pb Free. Boards went through design review and changes to deal with RoHS issues. Comparison was between products using Pb Solder and Pb Components vs. products using Pb Free Solder and Pb Free Components.

10 Prototypes Builds for Comparison All real test and measurement products (not test vehicles) Prototypes to evaluate RoHS impact on design and process All assemblies HALT tested to failure, inspected, and cross-sectioned Split builds with RoHS and non-rohs Assemblies Lead-Free Solder used: SAC305 alloy, no clean Immersion Silver, RoHS-designed PCBs Max Temperatures Reached: ~ 255C Incoming XRF validation on all parts No new RoHS failure modes; earlier onset of failures seen

11 Failure Modes For Pb-Free BGA Cracked traces to BGA pads BGA pads separated from PCB

12 Pb-Free Failure Modes (cont d) Cracks in BGA laminate where stress related failures in the component laminate are multiple. Propagation likely related to shear stresses and strain in the laminate.

13 Lessons Learned from Pb-Free HALT Changes made as a result of failure modes: Enhanced ICT (In Circuit Test) Strain Test Process Reduced allowable strain from 1000 to 500 ue Restricted choice of PCB laminates to prevent cracking Widened BGA traces, tear-dropped pads where feasible Restricted # and types of repair allowed Modified receiving processes: Added checks, XRF Modified manufacturing processes

14 Proposition for Pb-Free Accelerated Life Testing If there are potential means of accelerating Pb-free assemblies, what are they? Can we use conventional methods such as temperature and vibration to accelerate life test Pb-free assemblies? How do we determine the actual acceleration factors using temperature and vibration, and how are they different from conventional solders containing Pb?

15 ALT Test Planning Acceleration factors should be 15-25, based on predictions High confidence requirement means 90% level Combined stressors (temperature and vibration) Adequate sample population of Conventional and Pb-free Decide upon the desired temperature, suggested between 60 C-80 C Vibration levels as accelerators use available research (Huang et al., UCLA 2005)

16 Sample ALT MTBF for Pb-Free

17 Test Proposition for Conventional vs Pb-Free Comparative ALT on both Conventional and Pb-free together in the same chamber. Nominally populated CCAs with adequate mix of all components: Large chip resistors, Ceramic BGAs, Leadless ceramic chip carriers, Non-underfilled CSPs These are potentially susceptible to solder joint failures

18 Concluding Remarks Pb vs Pb-free very basic background in testing with mechanical vibration, thermal shock and thermal cycling. The understanding of the fatigue behavior of Pb-free is better and progress has been extraordinary over the last 10 years. HALT for Pb-free comparatively demonstrated cracked failure modes at different levels including the laminate. ALT can be done at a comparative level with a test plan for nominally, similarly populated Pb and Pb-free solder.

19 REFERENCES Coyle et al. A Reliability Comparison of SAC305 and SAC105 Plastic Ball Grid Arrays Assembled with Backward Compatible Soldering Processes SMTA International, 2010 Snugovsky, Polina, Lead free electronics- The Tin Whisker Challenge, Celestica Webinar, December W.J. Choi, E.C.C. Yeh, K.N. Tu, Journal of Applied Physics, vol. 94, no. 9, , S.Brandenburg and S. Yeh, Surface Mount International Conference and Exposition, SMI 98 Proceedings, J. Huang, S. Gee, L. Nguyen, K.N. Tu, The Effect of Electromigration on Eutectic SnPb and Pb-free Solders in Wafer Level-Chip Scale Packaging McCormack, Heather, Lead free electronics-what is left to implement, Celestica Webinar, December, 2010

and Current Reliability Concerns Craig Hillman

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