Smartphone. Big Data Robot

Transcription

1 Wearable Smartphone Cloud 5G Autonomous Vehicle Big Data Robot Machine Learning

2 HISTORY AI, 5G, IoT, Cloud, Robot First Production of Color TV Production of Electronic Tube Black and White TV Passed 34Million Mobile Phone Users Production of Semi-Electronic Switching (M10CN) Foundation of Samsung (69) Release of 4G Mobile Phone (Smart Phone) Wearable VCR DAEDUCK PCBs Established New factory For Flexible PCB $200M (2006) Export Award (DAEDUCK GDS) Mass Production of FCCSP (L/S 15/15) Development of Single Side PCB 02 Flexible PCB Double Side PCB Multi Layer PCB HDI PCB Rigid Flex PCB Package Substrate 03

3 PORTFOLIO Semiconductor Smartphone Super-thin : 2L/ 70 μm, 3L/ 80 μm, 4L/ 120 μm High Density Circuit Thickness tolerance +/- 7um Halogen-free material ETS, MSAP Impedance Control Ultra Thin CSP Controlled-warpage properties High Density FPC High layer Rigid-Flex more than 10Layer 2-4L ETS, Line/Space 10/10um Technology for Mobile Camera Module SAP available Cavity structure and process FCCSP Presolder(SOP), ENEPIG, OSP High layer-count like Cavity & Flat Rigid-Flex Slim material and process Surface flatness control, Thick Rigid-Flex CSP 2L/90 μm, 3L/100 μm, 4L/140 μm Flattened Solder Resist Line/Space 25/25um, MSAP FPC for New Application Differentiated solutions for new application Ultra slim material Asymmetric and Partial plating High Reliability (for ) SiP/Module Coreless any-layer (4,5,6,7 12L) Super-thin : 8L / 200umT Layer to layer align < 20um ENEPIG, OSP HDI Various structures Halogen free Material Line/Space 30 μm /40 μm 0.65 mm thickness for 12 Layer, Impedance Control Line/Space 20 μm /20 μm Line/Space 20 μm /20 μm MSAP MSAP Various Material Various Material SLP MSAP 04 05

4 PORTFOLIO Network Over 20+ Layer High Density Circuit (Line/Space 50/50 μm ) Low Dk & Df Material Impedance Control High Layer MLB Si Technology (Back Drill) High Aspect Ratio (15:1) Infotainment - Telematics High Reliability - Anti-CAF(Conductive Anodic Filament) - Warpage Control Cored 10~12L Full stack-via Low Dk CCL/PPG (Dk 3.5) Technology for Camera Module - Surface flatness control, Build-Up Structure Impedance Control msap / SR1 High Reliability 5G Module OSP + SOP Camera Module - Anti-CAF(Conductive Anodic Filament) - Thermally Stable material and Structure MLB Halogen free & High-Tg, Low Loss Material Hybrid Construction Impedance Control Various Finish Radar Module High frequency - Low Dk/Df material (Teflon etc.) - Low profile material and process - Impedance control Hybrid Structure - Low Dk/Df material + FR-4 Material High Power Management Systems Semiconductor Test Over 80+ Layer BVH (Multiple Lamination) Flatness control (Max 0.300mm ) High Aspect Ratio (37:1) Power Management Module - Cu Inlay Structure (Radiant Heat) - High Voltage (Min 500V) - Heavy Cu, High Tg (170 ) Material High Reliability - Anti-CAF(Conductive Anodic Filament) - Thermally Stable material and Structure Load Board, Socket, BIB 0.35mm Pitch, 48~60Layer, 5.40 mm ±0.2 mm 0.125Ø(DHS), FR-4 High Tg BVH (Sequential Lamination) Aspect Ratio : 36:1 Smart Junction Box - Heavy Copper Heavy Copper - Inner Cu 140µm ~ 400µm - Outer Cu 210µm ~ 400µm Surface Finished - HASL / Immersion Tin / OSP High Reliability - Low CTE, CAF Free Materials 06 07

5 CSR(CORPORATE SOCIAL RESPONSIBILITY) EHS(ENVIRONMENT, HEALTH & SAFETY ) [ Ethical Management ] Declaration of ethics, Code of ethics, Hotline management Ethical Responsibility Vision Create values by fulfilling EHS [ Mutual Growth ] Agreement of fair trade and mutual growth, Supplier s day, Support for supplier s safety & health and recruitment Mission Secure safety-culture which everyone participates in and practices Charitable Responsibility CSR Economic Responsibility 3 Rules of EHS [ Social Contribution ] HAEDONG science & cultural foundation, DAEDUCK welfare foundation, Company volunteer service Legal Responsibility [ Environmental Management ] Certification of environmental management Greenhouse gas and waste management Strategies Zero Disaster Build field-oriented PSM Prevent from potential risk Achieve global standard of EHS Compliance With Regulation Self audit / Process change management Proactive action for fulfilling regulation Limit emission of pollutants Establish foundation for growth Develop human resources Low-carbon green growth Risk management of chemical substances ENVIRONMENT HEALTH SAFETY 08 09

6 GLOBAL NETWORK Semiconductor Network Smartphone Utra Thin CSP FCCSP SiP/Module SLP High-Layer MLB Semiconductor Test DDE (KOREA) GDS (KOREA) TAIWAN FPC Rigid-Flex HDI MSAP MLB USA CANADA DDPI (PHILIPPINES) Factory Sales Office DAEDUCK ELECTRONICS CO., LTD. (DDE) Headquarter 335, Somanggongwon-ro, Siheung-si, Gyeonggi-do, KOREA Tel : Fax : Web site : DAEDUCK GDS CO., LTD. (GDS) 230, Gangchon-ro, Danwon-gu, Ansan-si, Gyeonggi-do, KOREA Tel : Fax : Web site : DAEDUCK PHILIPPINES, INC. (DDPI) Philippines Economic Zone Authority(PEZA) Lot 1-13 Block 20, Phase 4, Main Ave., Rosario, Cavite, Philippines Tel : Fax : Web site : Overseas Sales Office Nakor Inc. / CANADA 215 Sanders Street, Suite 202 Kemptville, Ontario, Canada K0G 1J0 Tel : Fax : bill.ballantyne@nakor.ca Paratronics Corp. / U.S.A Sky Park Circle, Suite 275, Irvine, CA 92614, U.S.A Tel : Fax : tima@paratronics.com TAIWAN Office 4F-A, No.32, Chenggong 13 Street, Jhubei City, HsinChu Hsien, TAIWAN Mobile(TW) swimpool@daeduck.com 10

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