Electronics Cooling Products

Transcription

1 Advanced Cooling Technologies, Inc. Electronics Cooling Products Military Electronics Power Electronics Industrial Electronics Products Services Technologies Electronics Cooling Products

2 Heat Pipe Assemblies Evaporator Area HEAT IN HEAT OUT Working Fluid Vapor flows through center Heat Pipes are passive two-phase devices that transfer heat very efficiently over relatively long distances. Heat pipes can be bent and flattened into a variety of geometries making them ideal for removing heat from high power, densely packed electronics. They can isothermalize multiple devices or transfer heat from high flux components, minimizing junction temperatures and improving device reliability. HEAT IN HEAT OUT Condenser Area Proven Reliability Versatile Form Factor Custom Features Ruggedized Designs Efficient, Reliable Thermal Management Operating Benefits Decrease Size and Weight Reduce Hot Spot Temperatures Increase Power Capabilities 50,000 to 200,000 W/m-K Effective Conductivity Large Heat Transport Capability With Minimal Size Weight & Power (SWAP) Design Flexibility Bending and Flattening Standard & Custom Sizes Available Surface Coating Options Multiple Bonding Options Round, Rectangular & Flat Cross Sections Optimizing Engineering Resources Heat pipes designed and built correctly will reliably operate in a broad range of harsh operating environments for over 20 years. Our online resources can be used to help generate a preliminary design of a heat pipe assembly for your system. Visit for detailed design documentation and interactive tools: ACT Design Guide, ACT Interactive Heat Pipe Calculator and Heat Pipe Reliability Guide. Board Chassis System 2

3 HiK Plates HiK or High Conductivity plates are heat spreader plates with embedded heat pipes. They are used to passively spread or transfer heat from discrete components to larger areas for heat dissipation. HiK plates can be used to improve heat spreading in standard conduction cooled cards, in wedge locks in standard chassis, and in natural or forced convection heat sinks. In some designs, thermal performance can be enhanced by 6X. Thermal Benefits Thermal Conductivity From 600 to 1200 W/m-K Higher Fin Efficiency Lower Junction Temperature Applications Card Chassis Radar Electronics Portable Electronics Power Electronics LEDs Armored Vehicles Aircraft Electronics Increased Power Capabilities Lightweight Structurally Sound Higher Allowable Ambient Temperatures Thickness From 1.8 mm (0.072 in.) Materials Aluminum AlSiC (low CTE) Magnesium (light weight) Copper Manufacturing to High Standards ACT manufactures all of our products to ISO9001 and AS9100 quality standards. HiK plates are designed to meet even the most demanding thermal and mechanical specs found in military applications. Tight Tolerances Various Plating/Finishes Low to High Volume Shock/Vibration Freeze/Thaw Tolerant Retrofit into Current Design Temp ºC 91.1 Challenge Design Manufacture Advanced Cooling Technologies, Inc. 3

4 ACT's Electronics Cooling Products Mission Ready Solutions Mission ACT's Electronics Products Group is dedicated to providing quality thermal management solutions that meet the demanding operating environments of today's electronics. We design, analyze and manufacture thermal solutions for diverse applications from ruggedized military electronics to sensitive medical electronics to high power industrial electronics. We strive to meet or exceed our customers' expectations in every aspect. Markets Military Electronics Industrial Electronics Medical Electronics Embedded Computers Power Electronics Engineering Advantage Our company has a broad range of engineering know-how, technical skills, applications experience and manufacturing infrastructure which deliver: Optimal Heat Transfer Easy System Integration Reliability in Harsh Environments Affordable Manufacturing Analysis, Design and Prototyping Services Our engineers work closely with our customers to create the best possible solutions for the specific applications. We can help at any point in the product development process. Feasibility Assessment Design and Analysis Prototypes Testing Production Builds Production Launch Volume Manufacturing (6) Static Temperature ISO9001- AS9100 Certified ITAR Registered Advanced Cooling Technologies Capabilities... Analysis... Testing 4

5 Products ACT s thermal management products are designed to meet our customers specific thermal and mechanical requirements in a broad range of applications. Our electronic cooling products include but are not limited to the following: Heat Pipe Assemblies HiK Plates Vapor Chambers HiK Wedge Locks Cold Plates Power Electronics Heat Sinks Conduction Cooled Frames Custom Thermal Assemblies SWAP out your current thermal design Our engineered thermal products create benefits in Size, Weight and Power (SWAP). Size Better heat transfer reduces surface area for heat dissipation. This leads to less overall volume required for heat transfer. Weight More efficient thermal paths lead to trimming of unnecessary materials and reduction of the overall weight of the system. Power Heat pipes are totally passive heat transfer devices, which not only increases the system reliability but also reduces the system power requirements. Advanced Cooling Technologies Capabilities... Prototypes... Production... Advanced Cooling Technologies, Inc. 5

6 High Performance Heat Spreaders Vapor Chamber - High Performance Heat Spreaders Vapor Chambers minimize the overall system thermal resistance by using highly efficient two-phase heat transfer to spread heat from small high power components to a larger area heat sink. This enhanced heat spreading allows for smaller heat sinks and reduced junction temperatures. Application Benefits 2 Can Accept Heat Flux up to 700 W/cm Thermal Resistance < 0.08 C/W Thickness From 3mm (0.120 in.) Scalable Low CTE (Coefficient of Thermal Expansion) Available Temperature Uniformity Can Accept Multiple Heat Inputs Power Electronics Cooling Power Electronics cooling has become more challenging as the push for higher power and smaller packaging continues. ACT's thermal solutions maximize cooling performance while minimizing the system volume and weight. Examples of our power electronics cooling products include both heat pipe based heat sinks and liquid cooled cold plates. Natural Convection Heat Sinks Forced Convection Heat Sinks Cold Plates Micro / Mini Channels Heat Sinks ACT Custom Product Advantages Higher Allowable Power Custom Dimensions Thermal Resistance as low as C/W Optimal Balance Between Flow and Pressure Drop Fan / Pump Selection Typical Power Thermal Applications IGBTs Thyristors IPMs PFC Modules SCRs 6

7 Component, Board, and System Level Cooling Analyzing all thermal resistances in the thermal path and determining which have the largest impact on the overall power dissipation are key to understanding and improving thermal solutions. Whether it is removing heat from a few key high power components, minimizing the interface between an Line Replaceable Unit and the chassis, or improving the efficiency of an air or liquid cooled heat sink, ACT can assist in addressing and solving thermal challenges at all levels in the system. Effective Heat Transfer at the Component and Board Level Conduction and Air-Cooled Frame Enhancements- ACT Works to VITA/VME Standards Component Level Cooling - Optimizing the Thermal Path From the Device to the Board to the Chassis Detailed Device Level Modeling THIN The Industry s Thinnest Embedded Heat Pipe Assemblies Low Profile Low Thermal Resistance Retrofit into Current Design Conduction/Convection Cooled Cards System Level Solutions ACT routinely designs, develops and manufactures system level cooling solutions, moving heat from the electronics chassis to the ultimate sink. We have extensive experience with a variety of potential solutions including: Optimized Fin Geometries, Thermo-Electric Coolers, Heat Pipe Assemblies, and Liquid Cooled Cold Plates. Design: ACT's design engineers perform engineering analysis to optimize the thermal path from heat source to sink, and design proper thermal solutions to address your primary challenges. Geometry: ACT provides custom thermal solutions working within existing geometries and accommodating a variety of features from cabling, connectors, I/O's to mechanical features and mounting holes. Plating/Finishes: ACT offers a variety of plating finishes addressing harsh installation environments and meeting system specifications. Reliability: Enhanced heat transfer with proven, reliable thermal technology increases reliability and extends service life. Advanced Cooling Technologies, Inc. 7

8 THERMAL MANAGEMENT EXPERTS Advanced Cooling Technologies, Inc. is an internationally respected designer and supplier of heat pipes, loop heat pipes, cold plates and other thermal management products. Our products provide reliable thermal management for military/industrial electronics, HVAC energy recovery, biomedical, aerospace and other sophisticated devices on the ground, in the water, in air and in space. In addition to our expertise in heat pipes, we are also experts in other thermal technologies including pumped liquid and two-phase cooling, thermal storage, catalytic reaction and nanotechnology. This combination of in-depth expertise in heat pipe design and manufacturing and active participation in emerging thermal technologies enables us to provide our customers with the best performing, most cost effective thermal solutions. ISO 9001 & AS9100 Certified ITAR Registered Advanced Cooling Technologies, Inc., 1046 New Holland Avenue, Lancaster, Pennsylvania Ph: , Fax: , DOC-ACT-EPG Electronic Product Group Overview 001 D-12