SF John Davignon PCB Development Manager Dr. Robert Pfahl - Vice President of Global Operations, inemi

Transcription

1 SF 2009 Industry Transition to Halogen-free Platforms John Davignon PCB Development Manager Dr. Robert Pfahl - Vice President of Global Operations, inemi DPTS005

2 Agenda The Transition to Halogen Free Drivers for HF in the Industry What is a Halogen Free PCB Laminate? Why do we care? Electrical and Materials Impacts What are we doing about it? inemi Overview / HFR-free Activities 2

3 Industry Transition to Halogen Free Introduction: The Industry is transitioning towards environmentally responsible designs. In response, electronics manufacturers are evaluating the elimination of Halogenated Flame Retardants (HFRs) from their Printed Circuit Board (PCB) materials. This session will focus on key characteristics of HF free PCB materials for client platforms (desktop and mobile notebooks) 3

4 Agenda The Transition to Halogen Free Drivers for HF in the Industry What is a Halogen Free PCB Laminate? Why do we care? Electrical and Materials Impacts What are we doing about it? inemi Overview / HFR-free Activities 4

5 Drivers for Halogen Free Driver Global Environmental Responsibility Bio-accumulation Toxicity of flame retardants & vinyl chloride Dioxins released during EOL burning Threat of legislations Non-Governmental Organization (NGO) pressure to address environmental issues Materials Involved All Brominated Flame Retardants (TBBA is main FR in substrate & PCB Materials) All Chlorinated Flame Retardants and PVC Standards (PCB Material Only) IEC JPCA-ES IPC B Based on current specs: Halogen free does not mean zero halogens Fluorine, Iodine, and Astatine (Group VIIA halogens) are not restricted in the industry definition of halogen-free 5

6 Intel s Halogen-Free Position Intel supports removal of Halogenated Flame Retardants (HFR) and Polyvinyl Chloride (PVC) and is driving to Platform level compliance Silicon, by nature, meets this definition BFR/PVC materials traditionally found in substrates, PCBs and wiring All new component development to be based on HF technology Printed Circuit Board transition dependent on material reliability and supply chain readiness 6

7 Halogenated Flame Retardants Data Source: S. O Connell, Dell Requires Industry Standards & Verification Criteria New Materials & Validation of Performance Business Implications Cost, Capacity 7

8 Agenda The Transition to Halogen Free Drivers for HF in the Industry What is a Halogen Free PCB Laminate? Why do we care? Electrical and Materials Impacts What are we doing about it? inemi Overview / HFR-free Activities 8

9 Composition of Laminate and Their Functions Copper Foil -Electric Circuit -Signals -P/G -Heat Glass Cloth -Dimensional Stability -Low CTE in X/Y Axis -Warpage -Stiffness Resin Matrix (changed) -Heat Resistance -Bonding Strength -Flammability -Dielectric Properties -Tg Filler (added) -Flammability -Lower CTE -Stiffness -Heat Dissipation -Dielectric Properties -Water Absorption 9

10 Halogen-free - What Changed? Halogen-free changes the flame retardant used for epoxy laminate (FR4) materials Tetrabromo bisphenol-a (TBBA) is the current halogenated flame retardant for all laminate epoxy systems Reactive flame retardant that is incorporated into the epoxy chain. Volatilizes at burning temperatures: Blankets the fire, excluding oxygen Act as free radical traps 10

11 Halogen-free PCB - What is different? Halogen-free flame retardants come in 2 primary forms Reactive Part of the epoxy backbone Additive Fillers or other added compounds Many Halogen-free flame retardant choices exist and all HF PCB laminates contain both reactive and additive components. Halogen- Free Flame Retardants Mechanism of Flame Retardant Type Phosphorous Compound Formation of carbonized layer to cover surface Additive type: Phosphorous compound Reactive type: Phosphate Nitrogen Compound Generating incombustible gas Reactive type Inorganic Fillers (metal hydroxide) Releasing crystal water at high temperature Additive Halogen-free changes the fundamental composition of FR4 material with no one choice dominant 11

12 Agenda The Transition to Halogen Free Drivers for HF in the Industry What is a Halogen Free PCB Laminate? Why do we care? Electrical and Materials Impacts What are we doing about it? inemi Overview / HFR-free Activities 12

13 Why do we care? The fundamental properties of the laminate are affected. Fillers: Fillers increase the Dielectric Constant (Dk) of the material impacting impedance targets, crosstalk and other design considerations Fillers lower the CTE and increase the rigidity of the material. Fillers lower the peel strength of the laminate. Fillers degrade the machineability of the laminate affecting process cost and via reliability. Epoxy Backbone Changes: Resin strength can be mechanically degraded lowering peel strengths and/or increasing brittleness of the material. Decomposition temperature (Td) of the resin is increased. Glass Transition Temp (Tg) of the resin can move either direction. Moisture absorption can move in either direction, impacting electrical properties (Dk and Df), and the assembly process. CTE properties of the resin can be impacted affecting via reliability and assembly compatibility. 13

14 Technical Concerns: Material Availability MARKET AND GROWTH OF RIGID LAMINATE Area (Mm²) Value CAAGR ( 07-12) FR 4 Total % Notebook % Desktop % Mobile Phone % Other (Server,etc) % Area (Mm²) Value CAAGR ( 07-12) HF FR 4 Total % Notebook % Desktop % Mobile Phone % Other (Server,etc) % CAAGR: Compound aggregate annual growth rate If HF supplants halogenated FR4, CAAGR grows to almost 70% (assuming HF FR4 reaches FR4 volumes in 12) 14

15 Technical Concern: PCB Fab Cost There are multiple sources for the cost adder associated with the conversion to Halogen Free FR4 Halogen Free Factors Laminate ~ 1.5 HF Resins Drilling 1 2 De-smearing ~1.2 Reduced drill hits Increased cycle time Total Cost Increase for a 4~6-layer PCB Ack: Nan Ya Plastics 1 1.1~

16 Technical Concerns: Material Response Mat l Dk Df H 2 O Absorb Tg CTE Flex Td T260/ Cu T288/ Cu Peel Strength IST CAF UL94 V0 Temp Shock Vibe Cycle Cold Ball Pull A B C D E F G H I J K Color Code Equal to or better than FR4 (No issue) Marginal vs. FR4 (Issue not clear) Worse than FR4 (Clear Issue) No Data Derived from inemi WG data Material selection can matter! 16

17 Agenda The Transition to Halogen Free Drivers for HF in the Industry What is a Halogen Free PCB Laminate? Why do we care? Electrical and Materials Impacts What are we doing about it? inemi Overview / HFR-free Activities 17

18 Technical Concern: HF Electrical Results Electrical Performance 5.10 Permittivity (Dk) 0.00 Total Loss Control A Control A GHz 5 GHz 1 GHz 5 GHz The Dk for the HF materials is generally equivalent to or higher than the control Material The total loss for the HF materials is generally equivalent to or lower than the control material Ack: Gary Long, Intel 18

19 Technical Concerns: High Speed Signaling Bus Margin vs. Dk at 2Gbit/sec (DDR3) data rates Permittivity (Dk) Upper range of HF materials on the market in 2008 Higher Dk increases crosstalk & reduces bus margin Cost More layers often needed to compensate for extra crosstalk (more room to separate signals) Margin reductions gets worse for faster buses FR4 (lower limit) Bus margin in Eye Area (ps*volts) Ack: Steve Hall, Intel 37.5% margin degradation Note: The dielectric thickness was adjusted for a constant impedance of 50 ohms HF materials can significantly reduce bus performance & lead to cost increases 19

20 10k Technical Concerns: Via reliability Cycles To Failure 1k Good News HF materials have 10X better via reliability (using IST testing) 100 FR4-A FR4-B HF-A HF-B Ack: Gary Long, Intel Material Preconditioned: 3X (260ºC peak reflow temp) 3 minute heat up cycle Temp: 25ºC 150ºC 1.5 minute cool down 20

21 Technical Concerns: Peak Pull Force Avg Peak Pull Force vs Pad Size Avg Peak Pull Force (grams) Old HF New HF Mid Tg FR4 Low Tg FR4 High Tg FR4 Cold Ball Pull measures the force required to pull a solderball off the laminate Ack: Gary Long, Intel Pad Size (mils) The new HF materials tested all perform equivalent to mid Tg FR4 and are an improvement over the previous generation HF materials 21

22 Agenda The Transition to Halogen Free Drivers for HF in the Industry What is a Halogen Free PCB Laminate? Why do we care? Electrical and Materials Impacts What are we doing about it? inemi Overview / HFR-free Activities 22

23 What Are We Doing About It? Internal Evaluation: HF Materials WG Examining differences in the new Halogen free material properties vs. standard FR4. Correlating the material properties to product performance test results. Establishing material property specifications or envelope for acceptable product performance by product segment. External Evaluation: Stephen Tisdale, Chair HFR-Free Leadership Program HFR-Free PCB Materials (Chair: John Davignon Intel) HFR-Free Signal Integrity (Chair: Stephen Hall - Intel Co-Chair: David Senk - Cisco) Identify key thermo-mechanical performance characteristics and determine if they are in the critical path for the HFRfree PCB material transition. Ensure there is no degradation of electrical signals in HFR-free PCB materials, base on investigation of permittivity, loss and moisture absorption in new HFR-free materials. 23

24 Agenda The Transition to Halogen Free Drivers for HF in the Industry What is a Halogen Free PCB Laminate? Why do we care? Electrical and Materials Impacts What are we doing about it? inemi Overview / HFR-free Activities 24

25 Conversion to Non-Halogenated Flame Retardants in Electronics Bob Pfahl

26 Outline Why Eliminate Halogenated Flame Retardants (HFR) inemi 2009 Environmentally Conscious Electronics Roadmap inemi Programs to Prepare for Conversion Concluding Thoughts 26

27 Why Eliminate Halogenated Flame Retardants

28 2009 inemi Roadmap Trend Analysis To produce environmentally-conscious electronics industry activities must continue to keep pace with: Continuing emergence of material restrictions Energy efficiency requirements and renewable energy End-of life requirements Holistic Eco-design requirements Sustainable business practices As many of these issues are shared by industry, it s best to work together! 28

29 Materials Short Term Needs - Identified in 2009 inemi Roadmap A strategy and action plan to facilitate low risk conversion of high-reliability applications to Pb-Free solders Prepare for possibility of additional substance restrictions under RoHS and/or REACH (HBCDD, phthalates) Proactive programs to facilitate low risk conversion to halogenated flame retardant (HFR) - free and PVC-free material alternatives The environmental concerns with PCB s containing halogenated flame retardants is that toxic dioxins may be produced during burning A number of OEMs are committed to eliminating remaining uses of BFR and PVC but many have no set timeline 29

30 Projects in inemi HFR-Free Portfolio Completed Project HFR-Free PCB Material Evaluation Active Projects HFR-Free High Reliability PCB HFR-Free Leadership Program HFR-Free PCB Materials HFR-Free Signal Integrity New Initiatives PVC Alternative Initiative 30

31 BFR-Free High Reliability Project Members 31

32 HFR-Free Technology Leadership Program Program Leader Steve Tisdale, Intel Corporation

33 Technology Challenges of HFR-Free Mechanical Properties HF materials are ~10% stiffer (8 layer.062 board) Lower mechanical stress limits (higher SJR risk) HF has ~20% worse cold ball pull performance Increased tendency for pad cratering higher rework risk Electrical Properties HF materials have broader range of Permitivity (Dk) values Reduced margins for high speed busses Especially critical for next generation (e.g. DDR3) 33

34 Firms Participating in the Program 34

35 Concluding Thoughts New global environmental requirements continue to multiply faster than industry can effectively respond Industry needs to be more proactive in developing solutions that: Are based on science and engineering, delivering value to customers Are available in advance of new regulations Can influence future regulations and stakeholder groups for more sustainable results inemi and its members are playing a significant role in preparing industry for these future needs. Sustainability will be a major undertaking for industry as well as society. Electronic solutions can help to empower people to live a more sustainable lifestyle SMART 2020: Reduction of 1 billion tons of Green House Gas emissions 35

36 contacts: Bill Bader Bob Pfahl Haley Fu - Asia haley.fu@inemi.org

37 Additional sources of information on this topic: Demos in the showcase Eco Booth # 719 More web based info: Book on topic: Lead-Free Electronics-iNEMI Projects Lead to Successful Manufacturing, IEEE Press 37

38 Session Presentations - PDFs The PDF for this Session presentation is available from our IDF Content Catalog at the end of the day at: intel.com/go/idfsessions 38

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40 40 Q&A

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