Lead (Pb)-free Thick Film, Rectangular, Low Value Chip Resistors

Transcription

1 Lead (Pb)-free Thick Film, Rectangular, FTURES Low resistance values (down to 0.1 Ω) Suitable for current sensors and shunts Metal glaze on high quality ceramic Protective overglaze Lead (Pb)-free solder contacts on Ni barrier layer Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes Compliant with Restriction of the use of Hazardous Substances (RoHS) directive 2002/95/ (issue 2004) STANDARD TRICAL SPIFICATIONS MOD INCH METRIC POWER RATING P 70 C W D10/CRCW0402-LR D11/CRCW0603-LR D12/CRCW0805-LR D25/CRCW1206-LR RATED VOLTAGE V TEMPERATURE COEFFICIENT ppm/k TOLERANCE % RESISTANCE RANGE Ω E-SERIES CRCW1210-LR R10 - R91 CRCW1218-LR R10 - R91 CRCW2010-LR R10 - R91 CRCW2512-LR R10 - R91 These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Marking and packaging: See appropriate catalog or web page Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material The resistance is measured from the top side ± 600 ± 400 ± 400 ± 300 ± 300 R22 - R43 THNICAL SPIFICATIONS PARAMETER UNIT D10/ CRCW0402-LR D11/ CRCW0603-LR D12/ CRCW0805-LR D25/ CRCW1206-LR CRCW1210-LR CRCW1218-LR CRCW2010-LR CRCW2512-LR Rated Dissipation at 70 C (2) W Rated Voltage V Insulation Voltage (1 min) V peak > 75 > 100 > 200 > 300 > 300 > 300 > 300 > 300 Thermal Resistance (1) K/W Insulation Resistance Ω > 10 9 Category Temperature Range C - 55 to Failure Rate h x 10-9 Weight/1000 pieces g (1) For sizes 0402 until 1206 the measuring conditions are in acc. to EN For all other sizes the result depends on the solder pad dimensions. (2) The power dissipation on the resistors generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 C is not exceeded. For technical questions, contact: filmresistors.thickfilmchip@vishay.com Document Number: Revision: 13-Oct-08

2 Lead (Pb)-free Thick Film, Rectangular, PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: CRCW0402R470JNEDLR (1) C R C W R J N E D L R MOD/ VALUE TOLERANCE TCR PACKAGING (2) SPIAL CRCW0402 CRCW0603 CRCW0805 CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512 R = Decimal J = % N = ppm/k M = ± 300 ppm/k Q = ± 400 ppm/k T = ± 600 ppm/k,,, ED, EE, EF, EG, EH,, EK,, EY Up to 2 digits LR = Low Value PRODUCT DESCRIPTION: D10/CRCW0402-LR 200 0R47 5 % ET7 e3 D10/CRCW0402-LR 200 0R47 5 % ET7 e3 MOD TCR RESISTANCE VALUE TOLERANCE PACKAGING (2) LD (Pb)-FREE D10/CRCW0402-LR D11/CRCW0603-LR D12/CRCW0805-LR D25/CRCW1206-LR CRCW1210-LR CRCW1218-LR CRCW2010-LR CRCW2512-LR ppm/k ± 300 ppm/k ± 400 ppm/k ± 600 ppm/k 0R10 = 0.1 Ω 0R91 = 0.91 Ω (1) Preferred way for ordering products is by use of the PART NUMBER (2) Please refer to table PACKAGING, see below %,,, ET7, EF4, E02, E67, E82,, ET9,, E27 e3 = Pure tin Termination finish PACKAGING MOD TAPE WIDTH D10/ CRCW0402-LR 8 mm D11/ CRCW0603-LR 8 mm D12/ CRCW0805-LR 8 mm D25/ CRCW1206-LR 8 mm CRCW1210-LR 1 DIAMETER PITCH PIES/ RE RE BULK PACKAGING CODE PACKAGING CODE PART NUMBER PRODUCT DESC. PIES PART PRODUCT PAPER BLISTER PAPER BLISTER NUMBER DESC. ED EE ET7 ET4 CRCW EK ET9 CRCW EF E02 CRCW mm EG EH E67 E EY E EY E27 EY E27 Document Number: For technical questions, contact: filmresistors.thickfilmchip@vishay.com Revision: 13-Oct

3 Lead (Pb)-free Thick Film, Rectangular, DIMENSIONS DIMENSIONS [in millimeters] INCH METRIC L W H T1 T ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± 0.2 SOLDER PAD DIMENSIONS [in millimeters] REFLOW SOLDERING WAVE SOLDERING INCH METRIC a b l a b l Temperature Rise in C Rated Power in % Power in W Temperature Rise Ambient Temperature in C Derating For technical questions, contact: filmresistors.thickfilmchip@vishay.com Document Number: Revision: 13-Oct-08

4 Lead (Pb)-free Thick Film, Rectangular, TEST PROCEDURES AND REQUIREMENTS EN TEST (clause) CONDITIONS OF TEST REQUIREMENTS PERMISSIBLE CHANGE (ΔR/R) (1) STABILITY CLASS 2 OR BETTER Stability for product types: 0.1 Ω to 0.91 Ω Resistance (4.5) - % Temperature coefficient ( ) Overload (4.13) Solderability (4.17.5) Resistance to soldering heat (4.18.2) Rapid change of temperature (4.19) Damp heat, steady state (4.) Climatic sequence (4.23) Endurance at 70 C (4.25.1) Note (1) Values valid for measurements from the top side 20/- 55/20 C and 20/125/20 C U = 2.5 (P 70 R) 1/2 2 U max. ; Duration: according the style Aging 4 h at 155 C, dryheat solder bath method; 235 C; 2 s visual examination Solder bath method; (260 ) C; (10 ± 1) s 30 min at LCT = - 55 C; 30 min at UCT = 125 C; 5 cycles (40 ± 2) C; 56 days; (93 ± 3) % RH 16 h at UCT = 125 C; 1 cycle at 55 C; 2 h at LCT = - 55 C; 1 h/1 kpa at 15 C to 35 C; 5 cycles at 55 C U = (P 70 R) 1/2 U = U max. ; whichever is less severe U = (P 70 R) 1/2 U = U max. ; whichever is less severe 1.5 h ON; 0.5 h OFF; 70 C; 1000 h ppm/k, ± 300 ppm/k, ± 400 ppm/k, ± 600 ppm/k Good tinning ( 95 % covered) no visible damage Extended endurance ( ) Duration extended to 8000 h ± (4 % R Ω) Endurance at upper category temperature (4.25.3) UCT = 125 C; 1000 h APPLICABLE SPIFICATIONS EN Generic Specification EN Sectional Specification EN Detail Specification I X Variety of environmental test procedures I Packaging of SMD components Document Number: For technical questions, contact: filmresistors.thickfilmchip@vishay.com Revision: 13-Oct

5 Legal Disclaimer Notice Disclaimer All product specifications and data are subject to change without notice. Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify for any damages arising or resulting from such use or sale. Please contact authorized personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: Revision: 18-Jul-08 1