Best-in-class Reflow Reflow-Soldering. VisionXP. Best-in-class Reflow-Lötsystem

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1 Best-in-class Reflow Reflow-Soldering System VisionXP Best-in-class Reflow-Lötsystem

2 As a co-founder of modern Reflow- Convection-Soldering Systems the company Rehm has been established successfully since 1990 in the national market as well as worldwide. The know-how and experience in reflow technology of many years is now integrated in the VisionXP-series. Optimized for customer requirements the VisionXP stands for productivity and flexibility. VisionXP Best-in-class Reflow Soldering

3 THERMAL SYSTEMS Systemadvantage Process reliability meeting lead free requirements Optimal heat transfer Residue-Management with pyrolysis Lowest cost of ownership Reduced maintenance expenses and reduced downtime Various software tools for process documentation Smallest ΔT Long Maintenance-Intervalls Ideal Heat Transfer Easy to maintain The temperature profile C Peak ΔT = 1,1 t Heat transfer has been significantly optimized for the VisionXP through the use of two, three or four peak zones. Minimal distance between the nozzle sheets and the conveyor, as well as separately adjustable flow rates for the upper and lower heat zones, assure that the PCBs are heated up in an extremely uniform fashion. Stressing within the PCBs is thus minimized, and related soldering defects are reduced. The great advantage of the pyrolysis is the maintenance free technology. The high granulate life time makes a period of a year for the change of the granulate possible. With the new condensate trap Rehm breaks new ground. The filters where the liquid residues condensate can be exchanged and cleaned easily. With the VisionXP you can reduce the down time and thus increase the productivity of your SMD production line.

4 The Transport-System Our flexible system saves you money. Maintenance and downtime are reduced by means of a continuous process based on an absolutely reliable conveyor, as well as an ingenious mechanical system. The conveyor system has been laid out in accordance with requirements specified for future placement machines, and optional for a maximum width of 508 mm. The optionally available center support makes it possible to process large panel formats an additional advantage for flexible manufacturing! Available options: Single-lane conveyor Dual-lane conveyor (synchronous/asynchronous) Quad-lane conveyor Multi-Track conveyor Dual-lane Quad-lane Parallel Processes The Dual-lane conveyor and the excellent thermal Performance of the VisionX-Series provides you an accurate steering of the temperatureand transport-parameters. So you have got the oportunity to solder two products lead and lead-free within one process. Your advantage: Tin-lead and lead-free processes can be run parallel to each other with a single reflow soldering system. No special system is required, for example with separate heat zones, thus reducing investment costs a single heating system with two conveyor lanes. A single, standard Dual Lane VX system can be used for both processes. Excellent operating convenience thanks to homogenous heat and cooling zones. Outstanding flexibility for reflow profiling.

5 Convince yourself of the quality and the efficiency of the VisionXP! High efficiency by effective cooling The Cooling Zone The cooling gradient Bottom Side Cooling C 250 mit nur 1 Kühlzone: 2,2 K/s 50 Peak mit 4 Kühlzonen: Zone 1 Zone 2 Zone 3 Zone 4 Stress-free below 50 Depending upon the length of the system, the cooling tract in the VisionXP is laid out in two to four stages. The fans in the individual zones, which can be controlled separately as an option, allow for accurate control, and cooling gradients can be correspondingly influenced. This assures stress-free cooling for your PCBs to below 50 C, for lead-free soldering as well. Low Outlet Temperature Thanks to bottom cooling, the VisionXP is now also capable of cooling PCBs with large thermal masses homogeneously, and very effectively. Low outlet temperatures eliminate the need for additional cooling with the help of an external cooler or an outlet conveyor with fans, even for PCBs with large thermal masses. Individually Controllable As is also the case with all of the other fans throughout the entire system, the bottom cooling fans can be individually controlled. As a result, you can ideally adapt cooling parameters at the VisionXP to your PCB. Homogenous Cooling Performance Twisting and warping of PCBs, in particular with highly inhomogeneously distributed copper layers, can thus be prevented. Cooling zone with integrated bottom cooling of the VisionXP Cooling of the boards with (left) and without (right) bottom cooling

6 Residue Management The VisionXP s residue management system combines the pyrolysis action mechanisms in the preheating and peak range with cold condensation in the filter unit of the cooling zone. This way both the amount of liquid residues (drip formation in particular) and that of the crystalline residues can be drastically reduced. The VisionXP thereby achieves a considerably higher level of efficiency than all other commercially available systems, which work with different operating principles. highly efficient clean process chamber reduced maintenance expenses minimized down-time The Cooling lane The elimination system used for the cooling section is directly integrated into the cooling circulation. It consists of filters where the remaining residues in the process gas condense. The filter units are easily replaced even without opening the process chamber. Pyrolysis The effect of pyrolysis is the thermal splitting (cracking) of long molecular chains into shorter ones, significantly reducing the amount of condensable residues and unwanted dripping. The remaining residues are captured within a special granulate. Rehm pyrolisis is nearly maintenance free, requiring only an exchange of the granulate at 12 month intervals.

7 Process Atmosphere Control THERMAL SYSTEMS Airdoping In the case of air doping, the process chamber is contaminated with atmospheric oxygen. A defined leak is created in the process chamber by means of a servo-valve to this end, which is opened just far enough to generate the desired residual oxygen value. The reflow system s nitrogen consumption is not influenced by this procedure, and always remains constant. Air doping is advisable for SMD production lines for which loading circumstances and conveyor widths vary only minimally in the reflow oven. Nitrogen Control With the nitrogen control the desired ppm level is held constant by continuously measuring the residual oxygen value. This is accomplished by injecting nitrogen into the process chamber in a variable fashion depending upon the measured residual oxygen value. This results in varying nitrogen consumption levels depending upon the extent to which the reflow system is loaded with PCBs and the selected conveyor width, allowing for reduced nitrogen consumption. Software CCS Capability Control System Continuous process monitoring in the spirit of SPC (statistical process control) is made possible by means of the capability control system (CSS). The CCS monitors process capability during the actual manufacturing process. Capability coefficients are calculated online for each heat zone, as well as for conveyor speed, in a PCBspecific fashion, and long-term trends and current events are displayed as graphics. Automated data acquisition and evaluation provide for significant time savings as compared with manual methods which make use of test boards. Reflow Simulation Online-Profiling In conjunction with CCS data, the online profiling function is capable of calculating the individual reflow profile for the respectively manufactured PCB during the production process and displaying it at the system s monitor screen. The software tool provided with the reflow simulation function also makes it possible to simulate reflow profiles and predict oven settings. External temperature profiles can be imported, or a new target profile can be created for use as a set of setpoint values. Product Management The clear-cut product management function assures that the right reflow program is explicitly assigned to the PCB (article number) to be produced during day-to-day manufacturing operations. In addition to oven settings, PCB-specific data can also be saved to the product management module. CCS Process traceability Process interlocking

8 Modular design The system types VisionXP nitro 4550 (Type 944) System length: 7,45m Throughput: 200/h* VisionXP nitro 4200 (Type 934) System length: 7,10m Throughput: 180/h* VisionXP nitro 3850 (Type 834) System length: 6,75m Throughput: 160/h* VisionXP nitro 2450 (Typ 523) System length: 5,00m Throughput: 100/h* VisionXP nitro 2100 (Typ 422) System length: 4,30m Throughput: 75/h* VisionXP nitro 3500 (Type 734) System length: 6,40m Throughput: 145/h* VisionXP nitro 3150 (Type 634) System length: 6,05m Throughput: 130/h* *Approximate values at a PCB-length of 300mm and a distance of 100 mm. May Technical changes without prior notice. Innovation for success! Rehm Thermal Systems is an international supplier of soldering systems and thermal system solutions for the electronics industry. We supply custom tailored solutions for a great variety of applications in modern electronics manufacturing with high precision, innovative, reliable systems and intelligent software. Rehm Thermal Systems GmbH Leinenstrasse Blaubeuren-Seissen Germany Telefon: Fax: info@rehm-group.com Internet: