Call for Prioritization & Participation In MEMS inemi Initiatives. Oct 26, 2011

Transcription

1 Call for Prioritization & Participation In MEMS inemi Initiatives Oct 26, 2011

2 Agenda Objectives from this Webinar inemi Overview (for non workshop attendees) Seven Potential MEMS Collaboration Initiatives Requested focus and deliverables in Research Process and timeline to be involved moving forward Request for action Q&A 1

3 Introduction to inemi Mission: Forecast and Accelerate improvements in the Electronics Manufacturing Industry for a Sustainable Future. International Electronics Manufacturing Initiative (inemi) is an industry-led consortium of over 92 global manufacturers, suppliers, industry associations, government agencies and research institutes/universities. Working on advancing manufacturing technology since Key Deliverables: Technology Roadmaps Collaborative Deployment Projects Research Priorities Proactive Forums Position Papers 4 Major Focuses: Environment Miniaturization Medical Electronics Alternative Energy 2

4 Leadership through Innovative Projects inemi uses a proven approach for technology road mapping that identifies gaps in the industry; and then delivers a technical plan and research priorities inemi is currently focused in four key areas: Miniaturization, Environment, Medical Electronics and Alternative Energy inemi has a strong track record of developing supply chains to introduce new materials, processes, and technologies into production. Examples: HDI (high density interconnect); Pb-Free; BFR-Free inemi has currently 22 active collaborative R&D projects plus 25 proposed initiatives in process They address some key gaps in areas such as Miniaturization, the Environment, Manufacturing and Test capabilities, Optoelectronics, and Medical Projects typically have member companies/institutions participating 3

5 Motivation for Participating in Collaborative Projects Large Cost savings by leveraging resources Typically in the 8X to 20x range on key projects and focus areas Reduce resource demands and $ investments for each company. Ensure technology or business issues are resolved when required. Projects can result in cost reduction (ex. Copper wire bonding). Reduce risk of technology; design, manufacturing, supply, process Reliability Hard to measure the negative impact of poor reliability, but can be disastrous. Source of supply Also hard to apply general cost impact numbers to being late to market Can also be huge. 4

6 Current Members with MEMS Interests 5

7 MEMS Increase value through collaboration

8 Background & Current Situation Analysis inemi has been road mapping semiconductors and packaging for nine roadmap iterations. In the 2011 RM MEMS was added as a focused technology chapter. Three of our product emulator groups highlighted MEMS as a rapidly growing technology in their product lines Automotive Medical Portable/Consumer Each of these segments have very different needs and challenges. We believe it is time to expand the collaborative agenda for MEMS inemi held a workshop on MEMS at the EMPC Conference in Brighton England on Sept 16 th and 17th 7

9 Brief Roadmap Highlights Michael Gaitan NIST

10 Automotive MEMS; Growing Rapidly Key Challenges are Long Life & Extreme Thermal 9

11 MEMS Roadmap Identified Current Needs Development of a detailed understanding of the basic material failure mechanisms. Generic reliability test standards for all MEMS. Stiction, thermally induced deformation, fatigue, creep, fracture 8" wafer manufacturing capability to meet the projected growth Procedures for testing the long term hermeticity and outgassing behavior of packages Low Cost Functional Testing 10

12 Difficult Challenges Potential Solutions Potential Solutions Integration of MEMS in the Package Standardization for MEMS packaging to support integration. Packages are needed that reduce or eliminate mechanical stress and enhancing hermeticity. Package data that can be used to accurately predict the effect of the package on device performance. Testing of MEMS More testing towards the wafer level. Validated tools to predict device performance from wafer tests. Methodologies for Design for Test or Design for NO Test. Validated accelerated life testing for MEMS More knowledge of the physics of failure is required to develop accelerated life tests. Need to share information. Individual solutions exist but are not being generalized across the industry. 11

13 MEMS Workshop in Brighton England Sept 2011

14 Workshop Participants Key Representatives from the Following: ASE CEA/LETI CSR Fraunhofer IZM IMEC NGK SparkPlugs Co Ltd SPTS Tronics Yole Development Bosch Coventor European Space Agency IQE Silicon Ltd inemi ON Semiconductor STMicroelectronics VTT Technical Research Finland 13

15 Workshop Identified Collaboration Needs Not in Priority Order

16 Key Problems and Opportunities 1.) Definition of the methodology for the development and implementation of a highly integrated package with multiple MEMS devices and a high performance ASIC. Includes: Identification of the key barriers to success and how to address them Clarify the material flows and handling requirements How IP will be managed Change Control and Management Systems level calibration must also be owned and managed by the product specified 15

17 Key Problems and Opportunities 2.) Understand and guide the industry movement towards high volume MEMS Modules (Design, Manufacturing, Materials, Interface Specifications) that can then be used widely by many different system integrators. - And..standard modules must be updated frequently and stay up to date with industry technology advancements 16

18 Key Problems and Opportunities 3.) Develop generic reliability testing standards/methods for integrated MEMS devices that enable spec conformance and effectively propagate key device failure mechanisms First step would be to do an analysis of existing MEMS reliability testing methods that are in place, standards in existence, and standards in the work Create a baseline of existing capability and gaps Second step or phase would be to attack gaps with appropriate study and research that ultimately deliver best known reliability test suites for market specific MEMS segments 17

19 Key Problems and Opportunities 4.) Definition of the market specific reliability requirements for testing of medical MEMS Note that the existing inemi Team working Medical product reliability test methodology could add MEMS as a category to be defined/developed. 18

20 Key Problem and Opportunity 5) Identify MEMS aspects of manufacturing that could benefit from common approach in test methods. This could include developing the following: Industry Standard Test vehicles for device qualification Common Material properties Characterization method Stress mitigation etc Simulation Tools Standard Test Methods E.g. Wafer level test Methods Need for both electrical and mechanical Need after dicing testing 19

21 Key Problem and Opportunity 6) Identify opportunities for development of more effective inline testing capabilities: In process monitoring Etch depth monitoring Testing leakage after capping What standard tests are used What is needed 20

22 Key Problem and Opportunity 7) Potential for development of Collaborative Design for Manufacturability Rules and Guidelines That accommodate best in class equipment capabilities including blind etch And detailed tool learning to incorporate in line process test capabilities to calibrate and refine equipment set up and assure product specs are in control 21

23 Key Area of MEMS Research Do the in-depth research on new materials and technologies to efficiently initiate the transduction of electro mechanical devices. Today's technologies require high (30 VDC) voltages with slow turn on times. Fast response low voltage stimulation is needed 22

24 Moving Forward

25 The MEMS Initiatives A Call to Action & NEXT Steps Please take the following inemi Survey and identify which initiatives your company or institution would like to participate in Be clear to indicate which initiatives you or your organization would be willing to co-chair. Leadership sets direction and drives aggressive prioritized goals that deliver BUSINESS IMPACT inemi will provide project management support Respond to the survey within 10 days! Complete no later than November 4th The survey results will be reviewed and meetings for initiatives with 5 or more participating organizations will be scheduled First meetings to be called by December 6th Reminder: To participate and/or be a chair at the initiative stage, your organization does not need to be an inemi Member. 24

26 contacts: Bill Bader Bob Pfahl Grace O Malley - Europe gomalley@inemi.org Haley Fu - Asia haley.fu@inemi.org