Enhanced Qualification Procedure For Integrated Circuits Used in Automotive Applications

Transcription

1 Enhanced Qualification Procedure For Integrated Circuits Used in Automotive Applications Bob Knoell Visteon Corporation AEC-CTC CTC Coordinator

2 Qualification Standard Desirables Understandable No complicated formulae or charts Not subjective Easy to Use Procedure is clear Clear Deliverables Customer knows what to expect Agreeable with the supplier Protection from Liability Demonstrate reasonable due diligence Exceptions Accommodated Special user requirements

3 Qualification Methods Stress Test AEC-Q100/101/200 Test to Failure Step-stress test Application-Specific JESD Physics-of-Failure CALCE University of Maryland Sequential Stress Test Bosch Risk Assessment Infineon

4 Stress Test reflects worst case environmental application to cover any subsequent application requirements are consistent and clear end users understand results due to wealth of past data which can be used for future qualifications looks at material and design interactions it s the way we ve always done it may be overkill or induce non- operating fail mechanisms cannot measure reliability, only can say the test passed (robustness) sample size limited by cost, test time, confidence estimate May not be performed in time on production material does not account for specific fail mechanisms or use conditions risk of designing component to pass the test

5 obtain a distribution of intrinsic failures Test to Failure different modes of failure can be observed relatively few samples are needed physics-of of-failure failure relationships can be determined and modeled today s components take a very long time to yield 50% fails needed to create distribution step stress method may overstress the part such that an unrealistic fail mode may dominate difficult to model reliability using step stressing components may physically degrade before they fail legitimately

6 Application-Specific tailored to each specific requires detailed discussion and application agreement for each qualification can focus on specific fail mechanisms minimize overstress and unnecessary testing can use test structures and circuits to more accurately target selected fail mechanisms assumes physics models and assumptions correct requires user understanding of physics or trust in supplier requires user to understand and communicate all the application environmental factors (mission profile) assumes that we know every fail mechanism affecting a given technology or component

7 Physics-of of-failure rapid, low cost method of assumes that physics models and qualification assumptions are correct for every instance can measure reliability if methodology accurate assumes that we know every fail mechanism affecting a given can perform what-if scenarios to technology and are able to determine best configuration and accurately model it focus for product improvement

8 Sequential Stress Test can yield a distribution of risk of yielding unrealistic fail failures in a relatively short time modes small sample sizes good at revealing the weakest link in the device very difficult to model the dominant relative failure mechanism

9 rapid, low cost method of qualification usually does not require additional testing most useful for low-cost standard catalog products Risk Assessment requires supplier to show as much data as assessor needs, which may be difficult to accumulate or is proprietary end user may feel this method is less demonstrative than traditional stress test qualification

10 Circuit Elements Relationships Electronic Component Module Sub-system Vehicle transistors Kerf testers HCI Test chips SECs metal EM oxide TDDB ICs AEC Q100 discretes AEC Q101 Packaged parts passives TCVs AEC Q200 Radio/CD Audio Powertrain SAE J1211 Climate control engine control SAE J1211 restraint SAE J1211 Car/ truck Ford GM DCX BMW Audi Toyota Honda Nissan