Hirose Korea Board To Board Connector

Transcription

1 Hirose Korea Board To Board Connector BM30-Series 1. Characteristic of Products page 2.Specifications & Formation of Products page 3.Details of Products ~ 6 page No. Products Name NO of Contacts Specification page 1 BM30B-**DP-0.35V 24,48,54 Pitch 0.35mm, Height 0.66mm 4~6 2 BM30B(0.8)-**DS-0.35V 24,54 Pitch 0.35mm,Height 0.8mm 4~6 3 BM30B(1.0)-**DS-0.35V 48 Pitch 0.35mm,Height 1.0mm 4~6 4.Reflow profile page HIROSE KOREA Page1 2015

2 BM30 - SERIES 0.35mm PITCH, Board To Board CONNECTOR Features 1. Higher density of the board-mounted components Extremely small board mounting pattern and low above theboard profile makes the connectors ideally suited for small device applications. Globally unrivalled compact depth :when mated 2.3mm Header 1.78mm 2. Reliable electrical and mechanical connection Despite its small mated height, unique contact configuration with a 2-point contacts and effective mating length of 0.2mm,assures highly reliable connection while confirming a complete mating with a definite tactile feel. 3. Large self-alignment distance The connectors will self-align within 0.3mm. 4. Solder wicking prevention Nickel barriers (receptacles) prevent un-intentional solder wicking. 5. Contamination protection Insulator walls protect the contact areas against flux splatter or other physical particles contamination. 6. Conducive traces on the PCB can run under the connector No exposed contacts on the bottom of the connector. HIROSE KOREA Page2 2015

3 Applications. Mobile phones, digital cameras, digital camcorders and other thin portable devices requiring high reliability board-toboard/ board-to-fpc connections. Specifications Rating Current rating 0.3A Voltage rating 30V AC,DC Operating temperature range Operating humidity range -35 C to +85 C RH 20% to 80% Storage temperature range Storage humidity range -10 C to +60 C RH 40% to 70% 3.Contact resistance 4.Vibration 5.Humidity 6.Temperature cycle 7.Durability Item 1.Insulation resistance 2.Withstanding voltage 8.Resistance to Soldering heat 500MΩ Min 100mΩ Max Specification No flashover or insulation breakdown No electrical discontinuity of 1 μs or longer No damage or parts dislocation Contact resistance: 100 mω max., Insulation resistance: 25 MΩ min. Contact resistance: 100 mω max., Insulation resistance: 50 MΩ min. No damage or parts dislocation Contact resistance: 100 mω max. No deformation of components affecting performance 100 V DC 100 V AC / 1minute 20 mv AC, 1 khz, 1 ma -55 C 5 to 35 C 85 C 5 to 35 C Time: 30 min. 10 min. 30 min. 10 min. 5 cycles 10 cycles Condition Frequency: 10 to 55 Hz, 5 min, single amplitude of 0.75mm, 10 cycles, for each directions. 96 hours at 40 ±2 C and humidity of 90 to 95% No damage or parts dislocation Reflow: At the recommended temperature profile Manual soldering: 350 C for 3 seconds Material Product Part Material Finish Remarks Receptacle Insulator LCP Color:Black UL94V-0 Header Contacts Phosphor bronze Gold plated Since Satiusfy with Reflow Temperature MAX 260, Fit for use at Lead-free Soldering. RoHS Compliant Suitable. Odering information Receptacles / Headers BM 30 # (**) - * DS V Serieal Name BM 2 Serieal No Configuration B:With metal fittings 4 Stacking Height 0.8mm(24,54), 1.0mm(48) 5 No of Contact 24,48,54 6 Connector style DS: Double-row receptacle / DP: Double-row Header 7 Contact Pitch 0.35mm 8 Termination type V(SMT Vertical mount type) HIROSE KOREA Page3 2015

4 Receptacles Recommended PCB layout Recommended metal mask dimensions C D E ROHS BM30B(0.8)-24DS-0.35V YES BM30B(0.8)-54DS-0.35V Part Number CL No. Number of Contacts A B C D E ROHS BM30B(1.0)-48DS-0.35V YES HIROSE KOREA Page4 2015

5 Headers Recommended PCB layout Recommended metal mask dimensions BM30B-24DP-0.35V BM30B-48DP-0.35V BM30B-54DP-0.35V C D ROHS YES HIROSE KOREA Page5 2015

6 Embosssed Carrier Tape Dimensions Receptacles Reel Dimensions BM30B(0.8)-24DS-0.35V BM30B(0.8)-54DS-0.35V C D E BM30B(1.0)-48DS-0.35V C D E Headers Reel Dimensions Guide Post 2ea BM30B-24DP-0.35V BM30B-48DP-0.35V BM30B-54DP-0.35V C D HIROSE KOREA Page6 2015

7 Reflow Profile Using Lead-free Solder Paste 250 Max Temperature( ) A' B' Preheating time Soldering time Time (Seconds) Recommended Application Conditions Reflow System: IR reflow Solder: Cream type Sn / 3 Ag / 0.5 Cu Flux content 11%wt Metal mask thickness: 0.15mm Preheating time: 150 ~190, 90±30seconds A'=150 ~170, B'=170 ~190 Soldering time: 250 Max 220 Min, 30~60 seconds HIROSE KOREA Page7 2015