NEMI RoHS Transition Task Group Forum APEX 2004 February 26, Dave McCarron, Dell

Transcription

1 NEMI RoHS Transition Task Group Forum APEX 2004 February 26, 2004 Dave McCarron, Dell

2 Agenda Introductions, Dave McCarron, Dell NEMI Overview, David Godlewski, NEMI Assembly Process Specifications, Frank Grano, Sanmina-SCI Component and Board Marking, Vivek Gupta, Intel Corporation Component Supply Chain Readiness, John Oldendorf, Intel Corporation Materials Declarations, Diane Fisher, HP Open Discussion 2

3 NEMI Mission North American Based Consortium Assure Leadership of the Global Electronics Manufacturing Supply Chain for the benefit of members and the industry Materials Build to Components Transformation Order Collaborative Design Life Cycle Materials Solutions Equipment Software Software Solutions Solutions Supply Chain Management Information Technology Logistics Communications Business Practices Marketing Design Manufacturing Order Fulfillment Customer 3

4 NEMI Roadmap Cycle Project Completion Technology Evolution Roadmap Product Needs Global Participation Available to Market Place Competitive Solutions Government Research Disruptive Technology Academia GAP Analysis No Work Required NEMI Users & Suppliers Regional Collaboration Projects Industry Solution Needed NEMI Implementation Cycle 4

5 Value Proposition Connect with and Strengthen Your Supply Chain NEMI offers the opportunity to collaborate with the entire supply chain in an efficient manner To understand and accelerate strategic directions To define future needs and opportunities To jointly create industry standard solutions. Today s increasingly distributed supply chain makes this more important than ever. NEMI is a virtual organization that adapts to industry changes quickly and provides timely leadership. NEMI provides Important deliverables: Technology roadmaps Forums on Key industry issues Deployment projects. 5

6 What Does NEMI Do? Leverage the combined Power of Member Companies to Provide Industry Leadership NEMI Roadmaps the Global Needs of the Electronics Industry Evolution of existing technologies Predictions on emerging/innovative technologies NEMI Identifies Gaps (both business & technical) in the electronics Infrastructure NEMI Stimulates R&D Projects to fill these Gaps NEMI Establishes Regional Implementation Projects to Eliminate these Gaps NEMI Stimulates Global Standards to speed the Introduction of New Technology & Business Practices NEMI works with other organizations to insure that North American government policy recommendations are aligned with NEMI mission. 6

7 Industry Leaders belong to NEMI OEM/EMS 7

8 Industry Leaders belong to NEMI Suppliers 8

9 Industry Leaders Consultants, Government, Organizations, and Universities 9

10 NEMI Organization Technology Working Group Technology Working Group Technology Working Group Technology Working Group Product Emulator Group Technology Roadmapping 18 Industry TWGs Product Need Roadmapping 5 Industry PEGs Product Emulator Group NEMI Board of of Directors Elected Elected by by NEMI NEMI Council Council Representatives Representatives EMS EMS Directors Directors OEM OEM Directors Directors Supplier Supplier Directors Directors Strategic Strategic Objectives Objectives Operational Operational Responsibility Responsibility Technical Committee EMS, EMS, OEM, OEM, Supplier Supplier & Academia/Government Representatives Business Leadership Team EMS EMS & OEM OEM Representatives NEMI Staff Secretary Secretary to to BoD BoD Communications Communications Membership Membership Development Development Technical Technical Facilitation Facilitation Implementation 5 NEMI TIGs Optoelectronics Technology Integration Group Substrates Technology Integration Group Board Assembly Technology Integration Group Product Life Cycle Information Management Technology Integration Group Environmentally Conscious Electronics Technology Integration Group

11 RoHS Transition Task Group Overview Chair, Dave McCarron, Dell 11

12 RoHS Transition Task Group Objective: Define and execute collaborative projects which address supply chain issues surrounding RoHS implementation for the electronics industry. 12

13 RoHS Transition Task Group Background: Transition of the electronics industry to RoHS compliance is driving a number of supply chain and logistics management issues. The Pb- Free Assembly Forum has highlighted gaps in NEMI ECE Roadmap which this team has been created to address 13

14 RoHS Transition Task Group Scope: Identify projects Determine if industry standardization is appropriate Develop standards requirements Identify appropriate standards body Work with standards body to develop and deploy standard 14

15 RoHS Transition Task Group Status: 4 teams formed in October 2003 Assembly Process Standards Component and Board Marking Component Supply Chain Readiness Materials Declarations SOW developed Projects under way 15

16 RoHS Transition Task Group Structure NEMI Environmentally Conscious Electronics TIG Chair: Richard Charbonneau, StorageTek RoHS Transition Task Group Dave McCarron, Dell Projects: Assembly Process Specifications, Frank Grano, Sanmina-SCI Component and Board Marking, Vivek Gupta, Intel Corporation Component Supply Chain Readiness, John Oldendorf, Intel Corporation Materials Declarations, Diane Fisher, HP 16

17 NEMI RoHS Transition Group Participants Agilent Technologies AMD Benchmark Electronics Boeing Satellite Systems, Inc. Bourns, Inc Celestica, Inc. Cisco Systems Cookson Electronics Dell EIA EMC Corporation EMT GoodBye Chain Group, LLC Hewlett Packard Company Honeywell Aerospace Electronic Systems IBM Intel Corporation Intersil Corporation IR - HiRel Products Jabil Circuit, Inc. Lexmark International, Inc. Loctite Electronics Lucent Technologies Molex Inc. Motorola Nokia NSWC Nortel Networks Philips Semiconductors Plexus PLexus Raytheon RosettaNet Sanmina-SCI Corporation Shure Incorporated Soldertec at Tin Technology Ltd Solectron Technology, Inc. Sun Microsystems Synapsis Technology, Inc. Texas Instruments The Boeing Company TYCO Electronics U.S. Army Aviation and Missile Command, Redstone Arsenal, AL URS Corporation 17

18 Assembly Process Specifications Project Overview Chair, Frank Grano, Sanmina-SCI 18

19 Assembly Process Specifications Project Objective: Provide the electronics assembly industry with a document that can be used as to define the conditions that will exist when assembling a board assembly with a lead free soldering process. This document will also serve as the basis for identifying the industry standards that will need to be changed. 19

20 Assembly Process Specifications Project Background: As the transition to lead free soldering continues there is a need to define the conditions that will exist during the assembly process. Once these conditions are defined the information can be supplied to the appropriate industry standards committees for incorporation. 20

21 Assembly Process Specifications Project Scope: This project encompasses 2 areas. Create a process definition document that describes the lead free process. Identify the industry standards that will need to be modified to reflect the lead free process. 21

22 Assembly Process Specifications Project Time Line: Review IPC 610 and JEDEC 020 Specs Compile Basic Process Conditions from Participants Input Supply Input to IPC 610 Sub Committee Identify Other Industry Specifications that need Revision Release Formal White Paper on Process Provide Input to IPC Specifications related to the Process Complete March 5 th, 2004 Preliminary - February 22 nd, 2004 Additional Input - March 22 nd, 2004 March 29 th 2004 April 26 th, 2004 TBD 22

23 Assembly Process Specifications Project Status: Review of IPC 610 and JEDEC 020 Complete Will present data to the IPC 610 Sub-Committee at APEX Several Members have supplied processing conditions 23

24 Component and Board Marking Project Overview Chair, Vivek Gupta, Intel Corporation 24

25 Component and Board Marking Project Objective: Develop a proposal for an industry accepted identification scheme for Pb-free parts Pb-free component and board-marking standard by February 2004 (Primary Goal). RoHS compliant component and board-marking standard by mid-2004 (Secondary Goal). Part numbering guideline to manage Pb-free change management Pb-free vocabulary guideline 25

26 Component and Board Marking Project Background: One of the issues surrounding the transition of electronics industry to Pb-free assembly (RoHS compliant products) is the clear and consistent identification of components, boards and end products. Several different Pb-free marking schemes are being used in the industry and are increasing with the proliferation of Pb-free manufacturing JEDEC marking proposal on the ballot since June, 2003 has not yet been approved yet An IPC Blue Ribbon group is reviewing the JEDEC specification to close gaps Soldertech-UK/ JEITA also have a labeling proposal 26

27 Component and Board Marking Project Scope: Develop Recommendations For Common Industry Standards Related To Pb-Free Component Identification Labeling And Marking Electronics Components, Cards & Motherboards (Feb 2004) Raw Material AND Finished Product Forms (June 2004) Part Identification Best Practices Part Number Nomenclatures & Change Management Visual Identification Secondary Recommendation For A RoHS Compliant Standard Propose a Pb-free vocabulary 27

28 Component and Board Marking Project Time Line: Current situation on marking schemes Dec 03 Define a minimum set of requirements Jan 04 Recommendation for gap closing Jan 04 Calibrate With NEMI Sub-Teams Feb 04 NEMI ECE TIG buy-in Feb 04 Publicize the standard IPC, JEDEC Mar 04 Part Identification Recommendations May 04 28

29 Component and Board Marking Project Status: JEDEC component and board marking spec in ready for BOD Ballot Over 85% Yes votes in the committee ballot Started to identify gaps to RoHS compliance First brainstorming held. Alan Ater (Sanmina) is leading the sub-team Part numbering proposal developed Alan Ater (Sanmina) led a subteam to develop a proposal Pb-free vocabulary propsal introduced to the team APEX FTF working session planned to get team feedback on the RoHS/ Part Numbering/ and Vocabulary proposals 29

30 Component and Board Marking Project Pb-free IDENTIFICATION MODEL Available Identification Modes Marking on Parts/ Containers Product Data Sheets Material Declarations Solder Material Lot Differentiation Etc.. Process Temp Etc,, RoHS Compliance Etc. Examples of Where Data Elements Found 30

31 Component Supply Chain Readiness Project Overview Chair, John Oldendorf, Intel Corporation 31

32 Component Supply Chain Readiness Project Objective: The objective of this sub team is to assess and influence readiness of the component supply chain to support RoHS product conversions 32

33 Component Supply Chain Readiness Project Background: RoHS compliance and increased lead free processing temperatures are impacting material selection for many board mounted components. While most component manufacturers are actively preparing, many are lagging due to lack of formal compliance definitions and product demand. 33

34 Component Supply Chain Readiness Project Scope is: Both RoHS content compliance and lead free process compatibility Both mainstream electronic and high reliability applications Board mounted components and PCB Scope is not: Lead free assembly process Lead free part identification Material Declaration Non-board mounted components, software or packaging 34

35 Component Supply Chain Readiness Project Time Line: Document RoHS compliance and Jan 04 temperature compatibility definitions Identify key suppliers to survey Feb 04 Begin survey Mar 04 Complete survey Mar 04 Publish survey results Apr 04 Follow up activities TBD TBD 35

36 Component Supply Chain Readiness Project Status: Survey prototype website complete. Will share with team members during APEX. Supplier list complete. Survey requests will be sent to suppliers first week of March. 36

37 Materials Declarations Project Overview Chair, Diane Fisher, HP Co-Chair, Nancy Bolinger, IBM 37

38 Materials Declarations Project Objective: Develop recommendations on standard materials declaration process and toolset by running a set of pilot tests to identify issues that: Aligns with the EIA, EICTA and JGPSSI Material Composition Declaration Guide Focuses on the legally banned and restricted materials (i.e. Annex A in the above Guide), Annex B optional Goals: Automated reporting process Minimal supply chain cost impact 38

39 Materials Declarations Project Background: Global efforts are underway to standardize how the IT industry will declare hazardous and other materials in products and components Global impact is anticipated on all OEM products 39

40 Materials Declarations Project Background: Suppliers ability to sell can be seriously affected if they are unable to provide materials declaration information Driven by regulatory and market-based restrictions (e.g. European Union RoHS Directive, TCO, Blue Angel, etc.) Draft Material Composition Declaration developed by: Electronics Industries Alliance (EIA) European Industry Association (EICTA) Japan Green Procurement Survey Standardization Initiative (JGPSSI) EIA submitted the joint guide to its members for a vote to approve 40

41 Materials Declarations Project Scope/Schedule: Decided on materials list to pilot December 2003 (e.g. Annex A list, not Annex B) Completed Tools Review - February 2004 Goodbye Chain, Centor, Synapsis, Excel, Agere Systems, Product Data Exchange (PDX), Agile, Japanese Green Procurement (JGPSSI) Determine Pilot Test Criteria - types of products and/or components April 2004 Run pilots - set up sender and receivers May 2004 Analyze results June-July 2004 (compare tools for accuracy, cost, effort, time, pitfalls/issues) Report results Recommend Connect solution(s) with and Strengthen and next your steps Supply Chain 41

42 Materials Declarations Project Status: Tool reviews completed: Goodbye Chain, Centor, Synapsis, Excel, Agile, Agere Systems, Product Data Exchange (PDX), Agile, Japanese Green Procurement JGPSSI PCA, design supplied by Motorola - pilot test vehicle Pilot process supplier questions and sample BOM established Goal: automated reporting process Pilot tests underway with following tools Goodbye Chain Synapsis Centor 42

43 contacts: Diane Fisher, HP, David Godlewski, NEMI, Frank Grano, Sanmina-SCI, Vivek Gupta, Intel Corporation, Dave McCarron, Dell, John Oldendorf, Intel Corporation, 43