HYB-MAN HYBRID 3D MANUFACTURING OF SMART SYSTEMS

Transcription

1 HYB-MAN HYBRID 3D MANUFACTURING OF SMART SYSTEMS Johannes Hörber 1, Martin Hedges 1, Rob van Asselt 2 1 : Neotech AMT GmbH, 2 : Philips Lighting Research Hyb-Man is a project labelled by the EUREKA Cluster PENTA, supporting innovation in micro and nanoelectronics based components & systems Contact: info@hybman.eu

2 THE CHALLENGE: EVOLVING ELECTRONICS MARKET Electronics manufacturing is still heavily relying on mass production: Standard products and components, rigid supply chains High investment cost (tooling, R&D) Long initial lead times (tooling, shipment) Industries like Philips Lighting are facing: Demand on customized and personalized products leading to increased diversity Request for new product designs offering improved functionality and form factors Need for cost effective manufacturing of small series. Need faster response to changes in the market. Digitization of manufacturing and users

3 THE APPROACH: HYB-MAN The Hyb-Man project will develop hybrid 3D manufacturing methods to enable flexible first time right production of smart systems integrated smart systems with optimized design and enhanced functionality hybrid 3D manufacturing methods, combining: additive manufacturing/3d printing 3D electronic structure processing 3D assembly & interconnect development of methods and technologies towards flexible first time right production

4 HYB-MAN BENEFITS Highly flexible manufacturing processes no product specific tooling no large inventory of parts or products local production high freedom of Design Substantial business benefits faster response to changes in the market cost effective manufacturing of small series and customer-oriented solutions new product designs offering improved functionality and new form factors

5 OPPORTUNITIES: NEW DESIGNS distributed electronics/sensors/light sources form freedom, adaptable shapes discrete electronics boxes

6 OPPORTUNITIES: FUNCTION INTEGRATION housing connection to peripheral electronics optics internal electronics Typical product architecture large quantity of parts separate parts for separate functions complex design of interfaces (failure risk) mechanical fixtures etc. combination/integration of functions and parts consolidation Part count reduction easy assembly simplified supply chain Integration miniaturization increased performance

7 3D ELECTRONICS: COMMERCIAL PROCESSES AVAILABLE Printing Tool Based Plating Based Examples: Piezo Jetting Aerosol Ink Jet 2 Shot Moulding Laser Direct Structuring (LDS) Injection molded structural electronics Dispensing LDS (ProtoPaint) In Mould Electronics Pad Printing 3D MID, Laser Direct Structuring Digital Direct Metallization FFF/FDM

8 3D PRINTED ELECTRONICS: CHALLENGES Approaches using n x 2D processing: Full 3D processing (5+ axes): Courtesy: LITE-ON Mobile Mechanical SBG Challenges to move beyond the state-of-the-art: 1. Combination of different technologies (Additive Manufacturing + Printed Electronics + conventional electronics) for industrial processes (reliable, cost effective) and materials for serial products and 2. First time right design and manufacturing 3. New product designs fully benefiting from the 3D integration opportunities

9 HYB-MAN APPROACH: WAY OF WORKING Ambition Develop hybrid 3D manufacturing methods to enable flexible first time right production of smart systems Objectives 1. Essential technologies 2. First time right production 3. Demonstration in innovative products Work package 1 Product specifications and process requirements Work package 2 AM/3D printing 3D electronics processing 3D assembly & interconnect Process integration Metrology and control platform Work package 3 Design rules Work package 4 Demonstrator realization and evaluation

10 WORK PACKAGES: COMPLEX NETWORK OF INPUTS AND OUTPUTS WP 1: User specifications smart system specifications for: - LED luminaires - automotive sensors requirements production process concept modeling requirements verification and validation WP 3: Knowledge rules for design and manufacturing process capabilities product design rules process design rules WP 2: Technology development and integration technology demonstrators new processes integral process flow product specs process design rules product design rules WP 5: Innovation management WP 4: Demonstration verification production processes evaluation/ test methods product demonstrators product evaluation data WP 6: Project management and coordination

11 HYB-MAN PARTNERS AND ROLES Together the partners cover the required competences and serve different markets Processes, materials & equipment Industrialization Products know-how materials processes equipment integrated systems new products

12 EXAMPLE: ENHANCEMENT OF PRODUCT PORTFOLIO SMD components 3D Printed Circuit structures Printed Device Substrate Building and Embedding Increased capabilities and tools integrated in machine platform to move from printing on 3D towards 3D printed : Print Platforms Print/Functionalising Tools Pre/Post-Processing 45X Volume Manufacture Piezo Jetting CNC Machining 15X R&D/Product Development Aerosol Based Plasma Cleaning (Motion 3D CAD/CAM SW) Ink Jetting Sintering (Light/Laser) Dispensing UV Curing FDM Adaptive Tool Path Vision System SMD Pick & Place

13 INTERACTION WITH OTHER PROJECTS - AMPECS courtesy: FAE - FRANCISCO ALBERO S.A.U. Aims of the Project: 1. Development of fully Additive Manufacturing Process for 3D Printing Electronics with Ceramic Substrates 2. The German-Spanish consortium will develop 3D printable ceramic materials for creating the structural body and integrate printed electronics into and onto this component. 3. End use applications will cover areas where harsh environments exists such as automotive and aerospace as well as in mobile communications

14 SUMMARY Changing environment and customer demands drive the need for more flexible manufacturing methods smaller series, customized products design freedom faster response to changes Huge opportunities product design manufacturing (local, on demand) supply chain and business model Many challenges technologies for serial products industrial processes first time right new product designs Multi-disciplinary approach and partnerships needed to move forward materials processes equipment process control product design manufacturing inspection and test

15 ACKNOWLEDGEMENT Hyb-Man is a project labelled by the EUREKA Cluster PENTA, supporting innovation in micro and nanoelectronics based components & systems

16 THANK YOU FOR YOUR ATTENTION!