Customer Guidelines for AMD Microprocessor Returns. May 28 th

Transcription

1 Customer Guidelines for AMD Microprocessor Returns May 28 th

2 Agenda AMD Return Policy Inspection Criteria Shipment and Packing Recommendations

3 AMD s Limited Warranty for Tray and PIB Product AMD s Warranty for Tray Product (Terms and Conditions): WARRANTY - Except as otherwise provided in the following paragraph, Seller warrants assembled devices of its manufacture against defective materials or workmanship for a period of one (1) year from date of shipment. Seller further warrants that assembled devices of its manufacture will conform to Seller's data sheet specifications. This warranty does not extend beyond the first purchaser of said assembled devices and unpackaged die (collectively "products"). The liability of Seller under this warranty is limited, at Seller's option, solely to repair the product, to send replacement product, or to make an appropriate credit adjustment or refund in an amount not to exceed the original purchase price actually paid for the products returned to Seller, provided that (a) Seller is promptly notified in writing by Buyer during the applicable warranty period of any defect or nonconformance in the product, (b) Buyer obtains authorization from Seller to return the defective product, (c) the defective product is returned to Seller in accordance with Seller's shipping instructions set forth below, and (d) Seller's examination of such product discloses to its satisfaction that any defect or nonconformance actually existed and was not caused by improper use or operation outside of the data sheet specifications for the product, abuse, negligence, improper installation, accident, loss or damage in transit, or unauthorized repair or alteration by a person other than Seller. Buyer shall ship such defective product to Seller via Seller's carrier, collect. Risk of loss will transfer to Seller when the defective product is provided to Seller's carrier. If Buyer fails to adhere to these warranty returns guidelines, Buyer shall assume all risk of loss and shall pay for all freight to Seller's specified location. This warranty shall not apply to any products which have been repaired or altered, except those which have been repaired or altered by Seller. The aforementioned provisions do not extend the original warranty period of any product which has either been repaired or replaced by Seller. AMD s Limited Warranty for PIB Product: AMD warrants that the AMD microprocessor contained herein when properly installed and used, will be free from defects in material and workmanship and will substantially conform to AMD s publicly available specifications for a period of three (3) years after the date the AMD microprocessor was purchased. If the AMD microprocessor which is the subject of this Limited Warranty fails during the warranty period for reasons covered by this Limited Warranty, AMD, at its sole option, will: (1) repair the AMD microprocessor by means of hardware and/or software; (2) replace the AMD microprocessor with another AMD microprocessor of equal or greater performance, OR, (3) if AMD is unable to repair or replace the AMD microprocessor, refund the then-current value of the AMD microprocessor. This Limited Warranty does not cover damages due to external causes, including improper use, problems with electrical power, accident, neglect, alteration, repair, improper installation, or improper testing.

4 AMD Return Policy AMD accepts the following returns: Products purchased direct from AMD Defective product as shipped by AMD Products that do not exhibit customer induced damage Products shipped according to AMD s packing or shipping instructions AMD does NOT accept the following types of returns: Product purchased from parties other than AMD. Return this type of material to that organization or company Requests for Product whose point of sale date is older than the warranty period (1 yr for Tray product, 3 yr for PIB product) Broken and damaged product, induced by the customer through neglect, improper use or improper installation. Product shipped in improper packaging

5 Customer Guidelines for Microprocessor Returns General Quality Return Comments Examples of Customer Induced Damage Returns: Cracked Package Cracked Die Die Chip Surface Mount Component Damage Burnt Die Under-Fill Damage Thermal Compound on Heat-sink Bent Pins Multiple Bent Pins Foreign Material Example of Returns that should be brought to AMD s Attention: No Marking Missing Compression Thermal Pads

6 Quality Returns Comments Thermal Compound should be visible on or surrounding the die area. Any product with no evidence of thermal compound may be a No Boot, or has never been tested / used. If the product is a No Boot, the clean unit should be thoroughly visually inspected for die crack or other mechanical damage (see next slide) Units that HAVE NOT BEEN USED are not acceptable Quality Returns and should be returned instead as a Policy Exception.

7 Cracked Die The picture below shows a cracked die. This crack is caused by heat-sink installation or removal. During the HS installation or removal process the operator may apply excessive force on the die, causing it to crack. Excessive mechanical shock to the computer system may also result in this type of CPU failure. This is sometime difficult to see using an un-aided eye but by tilting the unit to the light a crack will become visible. Crack This is considered customer-induced damage and is not an acceptable quality return.

8 Cracked Package This is a picture of a cracked ceramic package. The possible cause of this crack is improper installation or removal of the heat-sink. This is considered customer-induced damage and is not an acceptable quality return.

9 Die Chip The picture on the right shows a processor with a small chip, but passes AMD s Visual Inspection Specification. The picture on the left shows a processor with a corner chip that fails AMD s specification. When handling this processor, damage can propagate into the rest of the processor die and cause the unit to malfunction. Bad Good The severely damaged processor shown above on the left is not testable at AMD. This is considered customer-induced damage and is not an acceptable quality return.

10 Surface Mount Component Damage This picture shows surface mount component damage. This damage is caused by a severe impact to the components when installing or removing the heat-sink. This is considered customer-induced damage and is not an acceptable quality return.

11 Under-fill Damage This picture shows under-fill bubbling due to die overheating. This is usually caused by improper heat-sink installation (tilted heat-sink) or incorrect thermal compound usage. This damaged unit could cause catastrophic damage to a motherboard. This is considered customer-induced damage and is not an acceptable quality return.

12 Burnt CPU The picture on the right shows burnt package discoloration. This is caused by improper heat-sink installation or the use of a non-approved thermal compound. The picture on the left shows surface mount components that are burnt and damaged. These types of defects are not testable and if tried will cause serious damage to the motherboard. Burnt Surface Mount Component Burnt Package This is considered customer-induced damage and is not an acceptable quality return.

13 Thermal Compound on Heat-sink The picture shown below contains the contact surface of the heat-sink to the CPU die. The picture shows two very different thermal compounds. The pink compound is an approved thermal material and the white grease is unknown. Mixing of thermal interfaces (ie., thermal interface pad and thermal grease) is not recommended. Mixed Thermal Compound A unit that is returned with a heat sink that has mixed thermal compounds is considered to to have a damaged unit due to improper installation. This is not an acceptable quality return.

14 Bent Pins These units have bent pins that vary in severity. This is considered customer-induced damage and is not an acceptable quality return.

15 Multiple Bent Pins This picture shows evidence of gross mishandling. This level of pin damage is caused by forcing the unit into the socket incorrectly, or by dropping the unit. Units with this type of gross damage due to mishandling are not testable at AMD. This is considered customer-induced damage and is not an acceptable quality return.

16 Foreign Matter The picture at the right shows thermal compound on the pins. This thermal compound could contaminate a motherboard socket, causing poor pin/socket contact. This unit should be cleaned and retested before sending to AMD. The picture at the right shows heat-sink blue mylar tape that should have been removed prior to heat-sink installation. This tape will cause the thermal compound to react properly and causes the unit to overheat and burn up. This is considered customer-induced damage and is not an acceptable quality return.

17 No Marking This picture shows a unit that has no marking on the die surface. If this is seen the customer should contact AMD sales and/or marketing.

18 Missing Compression Thermal Pads This picture shows two missing CTP pads. Missing Pad Pad Missing leaving white adhesive If you notice any components shipped from AMD that has a missing a CTP pad, you should contact sales or marketing.

19 Out of Warranty Product AMD will not provide RMA credit for out-of-warranty products. Several potential examples follow: K6 Athlon Module

20 Shipping Methodology Instruction USE the Correct Address ALL Product to be sent to the following address: ADVANCED MICRO DEVICES Attn: Corporate Returns 3625 Peterson Way Santa Clara, CA Certain Quality returns may be directed to the following address per special instruction: ADVANCED MICRO DEVICES Attn: Shereen Bassette 5900 E. Ben White Blvd Mailstop 625 Austin, TX USE the Recommended Packing Methods Minimize product damage that can occur during shipment Enclose a copy of the RMA paperwork for tracking purposes NOTIFY AMD of the Shipping Details

21 RMA Shipping Methodology Instruction RMA lots shall be of the same ordering part number, in other words, one RMA for every OPN. No mixing of units from another RMA lot even if the tray or pack is partially filled. When shipping several RMA lots, each RMA lot shall be boxed separately. Each RMA box shall be clearly marked with the correct RMA number. If an RMA has multiple boxes, please identify every box with a number and total number of boxes, i.e. 1 of 5

22 Unit Packing- Instructions The picture on the right is an illustration of improper unit packing. Proper CPU packing protects the units from mechanical damage during shipment. Improper Unit Packing Product may be returned if received without proper packing.

23 AMD Packing Recommendations The preferred AMD method of packing is in tray form. The picture on the right illustrates improper banding of trays for shipping. Notice the use of tiny bands and the placement of these bands situated only on the ends. This type of banding will not survive in-transit carrier handling. Bad In transit damage caused by improper packing is considered customer mer- induced damage and is not an acceptable return. The picture on the right illustrates proper banding. This product should also be tightly wrapped in pink bubble wrap to tightly fit in a well designed box for shipment. Good

24 Packing Recommendations To prevent Bending of Pins, Ensure that processors are placed in the trays with the correct orientation Note the notch in the tray socket, and the corresponding notch on the corner of the package Note the corresponding notch on the outside portion of the tray

25 Examples of Product Damage Examples of product damage that will occur when trays are not securely packed. Very badly bent lead

26 Adhesive Tape Usage Tape is an ESD hazard around electrical components. Product received with static tape will not be processed. Credit may not be provided and the units may be returned to the customer at their expense. Tape

27 Unit Packing- In Transit Damage The picture below shows an example of in-transit product damage. In-Transit Damage The customer should contact AMD sales or marketing if product with this type of damage is received by the customer.

28 General Comments If you find any of these damage, inherent to the product of AMD. Please notify AMD sales and we will work to understand the root cause for this type of failure

29 The End Thanks for reviewing this presentation

30 AMD Socket-A Processor Identification Components (R-packs, Capacitors) Silicon Die Laser config elements Ceramic Package Compliant Pads Organic Package