Semiconductor Components, Instruments and Subsystems (SCIS)

Transcription

1 Semiconductor Components, Instruments and Subsystems (SCIS) Introduction to the SCIS SIG March 2016 Special Interest Group (SIG)

2 High Volume Manufacturing at Advanced Process Nodes will be Gated by Equipment Parts Performance Critical Issues Performance consistency of equipment components and subcomponents critical for maintaining fab process control Industry standards are needed to provide consistent parameters to enable users to compare similar parts and assess performance differences Effective problem diagnosis and resolution will require faster, more robust traceability of parts and subcomponents Standardization Needed Define critical defects, test methods and reporting Parts Traceability 2

3 Evolution of Process Control Emphasis within the Maturing Microelectronics Supply Chain Level 1 Level 2 Level 3 Process Control at the Fab Process Control at Equipment and Materials Suppliers Process Control at Equipment Component and Subcomponent Suppliers As the industry becomes more mature and products become more advanced, superior process control is needed deeper within the supply chain 3

4 The SEMI SCIS Special Interest Group (SIG) Goals Establish a framework that will enable industry partners to define: Measurable defects for different components specific to intended process applications Standardized test methods to measure the defects Consistent methods for reporting the results Implement an industry standard parts traceability process Define standardized formats and protocols Facilitate communication among suppliers, OEMs, and IDMs. Enable efficient problem diagnosis and resolution Provide a forum that fosters discussion and aligns stakeholders on industrycritical issues 4

5 Why We Need You If we don t solve this problem proactively, it will be very painful for our entire industry. Diverse stakeholder representation is critical for successful standards This is not a small problem. The more people who are engaged, the faster we can tackle it.

6 SCIS SIG Organization Emphasis on Four Defectivity Teams and Traceability 6

7 Addressing Defectivity Problems in HVM # Item Description Phase 1 Phase 2 Define Key Characteristics / Parameters Sub-Component Survey Document Characterization Plan Define Independent Test Plan Part/Sub-system Specification Primary characteristics which contribute to defects: New state End of Useful Life Larger community IDM-OEM-Supplier input: Primary contributors to defects High impact processes which create elevated defects Define how each characteristic is tested, Sample size Processes used to simulate end of life Test Plan which verifies defect levels Cleanliness testing Particle measurement SPC Analysis Summary Key Characteristic Capability Defect Characteristic Capability Create a standard system of comparable metrics which will be used to rate, compare, and classify process-critical OEM components in order to reduce defects generated in semiconductor manufacturing. 7

8 Current Focus Areas of SCIS Subteams Valves, Seals, and Pumps Liquid and Gas Delivery Critical Chamber Components and RF Automation Valves Slit Gate Pendulum Liquid Delivery Tubing Filters Drum Mixing Valve Critical Chamber Components Showerheads Robots (repeatability, calibration) Pumps Dry Turbo Cryo Gas Delivery Pneumatic & Manual Valves RF RF Generator

9 Importance of IDM-OEM-Supplier Collaboration It takes an industry. Collaboration, dedication and leadership. Applied Seals NA, Brooks Automation, Edwards, Entegris, Greene Tweed, Pall, SMC, Swagelok, VAT Component Supplier Device Manufacturer GLOBALFOUNDRIES Intel Corporation TI AMAT KLA-Tencor Lam Research TEL Semiconductor Equipment Manufacturer Consortium SEMI Standards

10 SCIS Value Proposition For Subcomponent Suppliers: Sharper focus on improving component design against established performance criteria Reduce overhead associated with product testing with established testing methods Compliance enables market access (or secures market presence) For OEMs: Improve alignment with end user specifications Reduced variability of subcomponent performance enables better equipment design and capability Establish traceability upstream/downstream to mitigate risk and expedite problem resolution For Device Manufacturers: Improve final wafer quality Can make better decisions on part selection with standardized reporting of performance rating Improve control of new process recipes with reduced variability of component performance

11 SCIS 2016 Face-to-face Meeting Calendar Quarterly Meetings Date Event Winter February 26, 2016 SEMI Headquarters San Jose, California 10:00 AM to 2:00 PM (Pacific) (SPIE Advanced Lithography Conference held during this week, Feb 21-25) Spring May 19, 2016 (afternoon) Summer July 14, 2016 (afternoon) SEMI ASMC (Advanced Semiconductor Manufacturing Conference) May Saratoga Springs, New York SEMICON West July San Francisco, California Fall September 22, 2016 SEMI SMC (Strategic Materials Conference) September Mountain View, California 2017 Winter January 2017 (Last day of the symposium) SEMI ISS (Industry Strategy Symposium) January 2017, details to be announced

12 Contact Information Paul Trio Senior Manager, Strategic Initiatives 3081 Zanker Road San Jose, CA Phone: