PRODUCT/PROCESS CHANGE NOTIFICATION

Transcription

1 PRODUCT/PROCESS CHAGE OTIFICATIO PC IPD-DIS/12/7137 otification Date 03/08/2012 IPD - ASD & IPAD Division Protection Devices & Rectifiers in axial packages Qualification of a new ECOPACK2 moulding compound 1/17

2 PC IPD-DIS/12/ otification Date 03/08/2012 Table 1. Change Implementation Schedule Forecasted implementation date for change Forecasted availabillity date of samples for customer Forecasted date for STMicroelectronics change Qualification Plan results availability Estimated date of changed product first shipment 02-Apr Mar Mar Jun-2012 Table 2. Change Identification Product Identification (Product Family/Commercial Product) Type of change Reason for change Description of the change Protection Devices & Rectifiers in axial packages Package assembly material change production rationnalization The purpose of this document is to announce the use of the EME-E125 new moulding compound for the production of our Protection Devices & Power Rectifiers in Axial packages DO-15, DO-201, DO-201AD, DO-41 and R6 Product Line(s) and/or Part umber(s) Description of the Qualification Plan Change Product Identification See attached See attached Date code and QA number Manufacturing Location(s) 2/17

3 PC IPD-DIS/12/ otification Date 03/08/2012 Table 3. List of Attachments Customer Part numbers list Qualification Plan results Customer Acknowledgement of Receipt PC IPD-DIS/12/7137 Please sign and return to STMicroelectronics Sales Office otification Date 03/08/2012 Qualification Plan Denied Qualification Plan Approved ame: Title: Company: Change Denied Change Approved Date: Signature: Remark /17

4 PC IPD-DIS/12/ otification Date 03/08/2012 DOCUMET APPROVAL ame Paris, Eric Duclos, Franck Cazaubon, Guy Function Division Marketing Manager Division Product Manager Division Q.A. Manager 4/17

5 PRODUCT/PROCESS CHAGE OTIFICATIO PC IPD-DIS/12/7137 IPD - ASD & IPAD Division 1 Protection Devices & Rectifiers in axial packages: Qualification of a new ECOPACK 2 moulding compound (1) IPD: Industrial & Power Discretes - ASD: Application Specific Device - IPAD: Integrated Passive and Active Devices February 2012

6 PC IPD-DIS/12/7137 WHY THIS CHAGE? The purpose of this document is to announce the use of the EME-E125 new moulding compound for the production of our Protection Devices & Power Rectifiers in Axial packages DO-15, DO-201, DO-201AD, DO-41 and R6. WHAT IS THE CHAGE? The EME-E125 moulding compound is ST ECOPACK 2 graded, thus meeting the Halogen- Free requirements of the market. The involved product series are listed in the table below: Product Family Package Involved Product Series Protection Devices Rectifiers DO-15 DO-201 R6 DO-15 DO-201AD DO-41 BZW04xxx BZW06xxx P6KExxx TPAxxx 1.5KExxx BZW50xxx LDPxxx PKC-xxx(RL), STPSxxx(RL), STTHxxx(RL), STTHxxxQ(RL) 158xx(RL), STPSxxx(RL), STTHxxx(RL) 158xx(RL), STPSxxx(RL), STTHxxx(RL) Specific devices not expressly listed in the above table are included in this change, including lead bent versions. The use of the EME-E125 new moulding compound does not impact the electrical, dimensional and thermal parameters, maintaining unchanged current information published in the relevant datasheets. The verification was included in the qualification program. The devices produced with the new moulding compound comply with the RoHS* directive by their ECOPACK 2 grade and also comply with the UL 94 V-0 standard. There is no change in the packing mode and in the standard delivery quantities. (*) Restriction of the use of certain Hazardous Substances according to European Directive 2002/95/CE. HOW AD WHE? Qualification program and results availability: The qualification program has mainly consisted of comparative electrical characterizations and reliability tests. The Reliability Test Report of the qualification program is annexed to the present document. February 2012

7 PC IPD-DIS/12/7137 Samples availability: For the involved Product Families, samples of selected devices, including the test vehicles, are available on request from now, as indicated below. Product Family Commercial Product Package Availability Protection Devices Rectifiers 1.5KE440A BZW50-33 P6KE440CA TPA270 STPS5L606 STTH112RL STTH5BCF060 DO-201 R6 DO-15 DO-15 DO-201AD DO-41 DO-201AD Other samples will be available on request for delivery within notice period if ordered within 30 days from PC reception. Change implementation schedule: The production start and first shipments for standard products will be implemented according to our work in progress and materials availability as indicated in the table below. ow Manufacturing location Production Start 1st Shipments China From Week From Week Absence of acknowledgement of this PC within 30 days of receipt will constitute acceptance of the change. After an acknowledgement, unless otherwise previously agreed to in writing for a specific process change requirement or for device specific requirements, absence of additional response within 90 days of receipt of this PC will constitute acceptance of the change. Shipments may in any case start earlier with the customer s written agreement. Marking and traceability: Parts assembled with the new moulding compound have the same marking as currently produced parts. The traceability is ensured by the date code and by the Q.A. number. Annex: 12008QRP.Rev 2. Reliability Test Report for qualification program. February 2012

8 16-February-2012 Report ID 12008QRP Reliability Report Protection Devices and Rectifiers in axial packages assembled in our ST China plant Qualification of a new ECOPACK2 molding compound Product Line Part-number Product Group Product division Package Maturity level step General Information Protection & Rectifiers Refer to the table below APM ASD&IPAD DO-15, DO-201, DO-201AD, DO-41 and R6 Qualification Wafer fab Assembly plant Reliability Lab Locations STMicroelectronics Tours STMicroelectronics Ang Mo Kio Subcontractor (China) STMicroelectronics Tours List of impacted series products Product Family Package Involved Product Series Protection Devices Rectifiers DO-15 DO-201 R6 DO-15 DO-201AD DO-41 BZW04xxx BZW06xxx P6KExxx TPAxxx 1.5KExxx BZW50xxx LDPxxx PKC-xxx(RL) STPSxxx(RL) STTHxxx(RL) STTHxxxQ(RL) 158xx(RL) STPSxxx(RL) STTHxxx(RL) 158xx(RL) STPSxxx(RL) STTHxxx(RL) DOCUMET IFORMATIO Versio Date Pages Prepared by Approved by Comment n 1 24-January J. MICHELO J.P. REBRASSE 2 16-February J. MICHELO J.P. REBRASSE Adding lead integrity tests ote: This report is a summary of the reliability trials performed in good faith by STMicroelectronics in order to evaluate the potential reliability risks during the product life using a set of defined test methods. This report does not imply for STMicroelectronics expressly or implicitly any contractual obligations other than as set forth in STMicroelectronics general terms and conditions of Sale. This report and its contents shall not be disclosed to a third party without previous written agreement from STMicroelectronics. Reliability Report Page 1/9

9 16-February-2012 Report ID 12008QRP TABLE OF COTETS 1 APPLICABLE AD REFERECE DOCUMETS GLOSSARY RELIABILITY EVALUATIO OVERVIEW OBJECTIVES PRODUCT RELIABILITY DESCRIPTIO COCLUSIO DEVICE CHARACTERISTICS DEVICE DESCRIPTIO TESTS RESULTS SUMMARY TEST VEHICLE TEST PLA AD RESULTS SUMMARY AEXES TESTS DESCRIPTIO... 8 Reliability Report Page 2/9

10 16-February-2012 Report ID 12008QRP 1 APPLICABLE AD REFERECE DOCUMETS Document reference AEC-Q100 AEC-Q101 JESD47H Short description Stress test qualification for automotive grade integrated circuits Stress test qualification for automotive grade discrete semiconductors Stress-Test-Driven Qualification of Integrated Circuits 2 GLOSSARY DUT PCB SS Device Under Test Printed Circuit Board Sample Size 3 RELIABILITY EVALUATIO OVERVIEW 3.1 Objectives The purpose of this document is to announce the use of the EME-E125 new moulding compound for the production of our Protection Devices & Power Rectifiers in Axial packages DO-15, DO-201, DO-201AD, DO- 41 and R Product reliability description The qualification methodology is failure mechanisms driven (JESD94). All potential failure mechanisms have been identified. Reliability trials follow JESD47 and specifications. 3.3 Conclusion Based on the reliability results, plan requirements have been fulfilled without exception. It shows that the devices behave correctly against environmental tests (no failure). Moreover, the stability of electrical parameters during the accelerated tests demonstrates the robustness of the products and safe operation, which is consequently expected during their lifetime. Reliability Report Page 3/9

11 16-February-2012 Report ID 12008QRP 4 DEVICE CHARACTERISTICS 4.1 Device description Protection Devices & Power Rectifiers in Axial packages DO-15, DO-201, DO-201AD, DO-41 and R6 5 TESTS RESULTS SUMMARY 5.1 Test vehicle Lot # Part number Family Package Assembly plant 1 P6KE440CA Protection DO-15 Subcontractor China 2 1.5KE440A Protection DO-201 Subcontractor China 3 BZW50-33 Protection R6 Subcontractor China 4 TPA270 Protection DO-15 Subcontractor China 5 STTH112 Rectifiers DO-41 Subcontractor China 6 STTH5BCF060 Rectifiers DO-201AD Subcontractor China 7 STPS5L60 Rectifiers DO-201AD Subcontractor China 8 STTH3L06 Rectifiers DO-201AD Subcontractor China Reliability Report Page 4/9

12 5.2 Test plan and results summary 16-February-2012 Report ID 12008QRP P6KE440CA Test PC Std ref. Conditions SS Steps Package Oriented Tests THB JESD22 A-101 Ta=85 C, RH=85%, Vr=100V 25 Lead Integrity IEC Failure/SS Lot 1 168h 0/25 504h 0/ h 0/25 Tensile Thrust Bending Torsion 40 control 0/40 RSH JESD22 B C 10s O, 15s OFF 12 Die Oriented Tests Repetitive ST spec Surge ADCS Electrical measurement 0/12 IPP(10/1000us)=1.3A hits 0/20 HTRB JESD22 A-108 Tj=175 C, V=352V KE440A Test PC Std ref. Conditions SS Steps Package Oriented Tests THB JESD22 A-101 Ta=85 C, RH=85%, Vr=100V 25 RSH JESD22 B C 10s O, 15s OFF 12 Die Oriented Tests Repetitive ST spec Surge ADCS h 0/76 504h 0/ h 0/76 Failure/SS Lot 2 168h 0/25 504h 0/ h 0/25 Electrical measurement 0/12 IPP(10/1000us)=3.5A hits 0/20 HTRB JESD22 A-108 Tj=175 C, Vr=352V 77 BZW50-33 Test PC Std ref. Conditions SS Steps Package Oriented Tests THB JESD22 A-101 Ta=85 C, RH=85%, Vr=33V 25 RSH JESD22 B C 10s O, 15s OFF 12 Marking JESD22 B-107 Solvent B 10 Test Die Oriented Tests Repetitive ST spec Surge ADCS h 0/77 504h 0/ h 0/77 Failure/SS Lot 3 168h 0/25 504h 0/ h 0/25 Electrical measurement 0/12 Visual inspection 0/12 IPP(10/1000us)=85A hits 0/20 HTRB JESD22 A-108 Tj=175 C, Vr=33V h 0/77 504h 0/ h 0/77 ote ote ote Reliability Report Page 5/9

13 16-February-2012 Report ID 12008QRP TPA270 Test PC Std ref. Conditions SS Steps Die Oriented Tests HTRB JESD22 A-108 Tj=175 C, Vr=33V 77 STTH112 Test PC Std ref. Conditions SS Steps Package Oriented Tests THB JESD22 A- 101 Lead IEC Integrity 21 JESD22 B- RSH 106 Marking JESD22 B- Test 107 Die Oriented Tests HTRB STTH5BCF060 JESD22 A- 108 Ta=85 C, RH=85%, Vr=100V 25 Failure/SS Lot 4 168h 0/77 504h 0/ h 0/77 Failure/SS Lot 5 168h 0/25 504h 0/ h 0/25 Tensile Thrust Bending Torsion 40 control 0/ C 10s O, 15s OFF 12 Solvent B 10 Tj=175 C, Vr=960V 77 Electrical measurement Visual Inspection Test PC Std ref. Conditions SS Steps Package Oriented Tests Lead IEC Integrity 21 Die Oriented Tests HTRB JESD22 A /12 0/10 168h 0/77 504h 0/ h 0/77 Failure/SS Lot 6 Tensile Thrust Bending Torsion 40 control 0/40 Tj=175 C, Vr= 520V h 0/77 504h 0/ h 0/77 ote ote ote STPS5L60 Test PC Std ref. Conditions SS Steps Package Oriented Tests THB Marking Test JESD22 A- 101 JESD22 B- 107 Ta=85 C, RH=85%, Vr=100V 77 Solvent B 10 Failure/SS Lot 7 168h 0/77 504h 0/ h 0/77 Visual inspection 0/10 ote Reliability Report Page 6/9

14 16-February-2012 Report ID 12008QRP STTH3L06 Test PC Std ref. Conditions SS Steps Package Oriented Tests Lead IEC Integrity 21 Marking JESD22 B- Test 107 Die Oriented Tests HTRB JESD22 A- 108 Failure/SS Lot 8 Tensile Thrust Bending Torsion 40 control 0/40 Solvent B 10 Tj=175 C, Vr=480V 77 Visual inspection 0/10 168h 0/77 504h 0/ h 0/77 ote Reliability Report Page 7/9

15 16-February-2012 Report ID 12008QRP 6 AEXES 6.1 Tests Description Test name Description Purpose Die Oriented HTRB High Temperature Reverse Bias Package Oriented PC Preconditioning TC Temperature Cycling THB Temperature Humidity Bias RSH Resistance To Solder Heat Marking Test The device is stressed in static configuration, trying to satisfy as much as possible the following conditions: low power dissipation; max. supply voltage compatible with diffusion process and internal circuitry limitations; The device is submitted to a typical temperature profile used for surface mounting devices, after a controlled moisture absorption. The device is submitted to cycled temperature excursions, between a hot and a cold chamber in air atmosphere. The device is biased in static configuration minimizing its internal power dissipation, and stored at controlled conditions of ambient temperature and relative humidity. Device is submitted to a dipping in a solder bath at 260 C with a dwell time of 10s. Only for through hole mounted devices. Application with a brush of a semi-aqueous based solvent (Solvent B) to test the marking permanency. To determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices operating condition in an accelerated way. To maximize the electrical field across either reverse-biased junctions or dielectric layers, in order to investigate the failure modes linked to mobile contamination, oxide ageing, layout sensitivity to surface effects. As stand-alone test: to investigate the moisture sensitivity level. As preconditioning before other reliability tests: to verify that the surface mounting stress does not impact on the subsequent reliability performance. The typical failure modes are "pop corn" effect and delamination. To investigate failure modes related to the thermo-mechanical stress induced by the different thermal expansion of the materials interacting in the die-package system. Typical failure modes are linked to metal displacement, dielectric cracking, molding compound delamination, wire-bonds failure, die-attach layer degradation. To evaluate the package moisture resistance with electrical field applied, both electrolytic and galvanic corrosion are put in evidence. This test is used to determine whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. The purpose of this test is to determine whether the markings on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process Reliability Report Page 8/9

16 16-February-2012 Report ID 12008QRP Test name Description Purpose Lead Integrity This test method provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly. This test is applicable to all through-hole devices and surface-mount devices requiring lead forming by the user. a) Test Condition A - Tension This test condition provides for the application of straight tensile loading. b) Test Condition B - Bending Stress This test condition provides for the application of bending stresses to determine the integrity of leads, seals and lead plating. c) Test Condition C - Lead Fatigue This test condition provides for the application of bending stresses primarily to determine the resistance of the leads to metal fatigue under repeated bending. d) Test Condition D - Lead Torque This test condition provides for the application of stresses to the leads to determine the resistance of seals and leads to twisting motions. e) Test Condition E - Stud Torque This test condition provides for the application of stresses on a threaded mounting stud caused by tightening the device during mounting. Reliability Report Page 9/9

17 PC IPD-DIS/12/ otification Date 03/08/2012 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics V and its subsidiaries( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. o license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. ULESS OTHERWISE SET FORTH I ST S TERMS AD CODITIOS OF SALE ST DISCLAIMS AY EXPRESS OR IMPLIED WARRATY WITH RESPECT TO THE USE AD / OR SALE OF ST PRODUCTS ICLUDIG WITHOUT LIMITATIO IMPLIED WARRATIES OF MERCHATABILITY, FITESS FOR A PARTICULAR PURPOSE ( AD THEIR EQUIVALETS UDER THE LAWS OF AY JURISDICTIO ), OR IFRIGEMET OF AY PATET, COPYRIGHT OR OTHER ITELLECTUAL PROPERTY RIGHT. ULESS EXPRESSLY APPROVED I WRITIG BY A AUTHORIZED ST REPRESETATIVE, ST PRODUCTS ARE OT RECOMMEDED, AUTHORIZED OR WARRATED FOR USE I MILITARY, AIR CRAFT, SPACE, LIFE SAVIG, OR LIFE SUSTAIIG APPLICATIOS, OR I PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUCTIO MAY RESULT I PERSOAL IJURY, DEATH, OR SEVERE PROPERTY OR EVIROMETAL DAMAGE. ST PRODUCTS WHICH ARE OT SPECIFIED AS AUTOMOTIVE GRADE MAY OLY BE USED I AUTOMOTIVE APPLICATIOS AT USER S OW RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners c 2012 STMicroelectronics - All rights reserved. STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morroco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 17/17